UL Prospector
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SIO6700.0 Gelest, Incorporated Low molecular weight silicone that possesses a cyclic structure rather than a chain structure and serves as a volatile carrier for a variety of formulations.
EDV-2025 Gelest, Incorporated Vinyl terminated diethylsiloxane-dimethylsiloxane copolymer.
DMS-T25 Gelest, Incorporated General purpose silicone composed of polymer chains with unique flexibility. It has virtually no energy barrier for rotation resulting in one of the lowest glass-transition temperatures of any polymer.
DMS-T41 Gelest, Incorporated General purpose silicone composed of polymer chains with unique flexibility. It has virtually no energy barrier for rotation resulting in one of the lowest glass-transition temperatures of any polymer.
DMS-T43 Gelest, Incorporated General purpose silicone composed of polymer chains with unique flexibility. It has virtually no energy barrier for rotation resulting in one of the lowest glass-transition temperatures of any polymer.
DBL-C31 Gelest, Incorporated Carbinol (hydroxyl) terminated polydimethylsiloxane.
DBP-C22 Gelest, Incorporated Carbinol (hydroxyl) terminated polydimethylsiloxane.
SILQUEST* VX-225 Momentive Performance Materials An amino-functional oligosiloxane adhesion promoter that may be considered for use over a broad range of adhesives and sealants applications
DMS-EC13 Gelest, Incorporated Epoxycyclohexylethyl terminated polydimethylsiloxane.
EMS-232 Gelest, Incorporated (Epoxycyclohexylethylmethylsiloxane) dimethylsiloxane copolymer.
EMS-323 Gelest, Incorporated (Epoxycyclohexylethylmethylsiloxane) dimethylsiloxane copolymer.
DBE-U12 Gelest, Incorporated Acryloxy terminated ethyleneoxide dimethylsiloxane-ethyleneoxide ABA block copolymer.
DBE-U22 Gelest, Incorporated Acryloxy terminated ethyleneoxide dimethylsiloxane-ethyleneoxide ABA block copolymer.
DMS-C23 Gelest, Incorporated Carbinol (hydroxyl) terminated polydimethylsiloxane.
SILQUEST* Y-15744 SILANE Momentive Performance Materials Adhesion promoter for sealants, adhesives and coatings on porous and other difficult substrates