The Evonik Crosslinkers Business Line offers a broad range of products and competences for coatings and adhesives, as well as for high-performance elastomers, civil engineering and composites. Besides products based on isophorone chemistry the portfolio contains a full toolbox of amine curing agents for ambient and heat cure applications. The products are mainly used in industrial applications due to the mechanical strength, durability, chemical resistance and excellent adhesion properties. Our experienced technical specialists have an in-depth understanding of your market requirements and are able to provide the right level of technical service and support you need.
HYBRIDUR® 580 Polymer Dispersion is an acrylic-urethane hybrid polymer dispersion. Cost-effective alternative to standard polyurethane dispersions. Provides outstanding adhesion to a wide variety of substrates, superior abrasion, and chemical and stain re...view more
HYBRIDUR® 580 Polymer Dispersion is an acrylic-urethane hybrid polymer dispersion. Cost-effective alternative to standard polyurethane dispersions. Provides outstanding adhesion to a wide variety of substrates, superior abrasion, and chemical and stain resistance. view less
VESTANAT® EP-IPMS is an isocyanate building block for the preparation of silane modified urethane resins. These resins may be used for the production of isocyanate-free, moisture curing adhesives, sealants and weatherable, UV- and ...view more
VESTANAT® EP-IPMS is an isocyanate building block for the preparation of silane modified urethane resins. These resins may be used for the production of isocyanate-free, moisture curing adhesives, sealants and weatherable, UV- and scratch-resistant coatings. view less
IMICURE® AMI-1 Curing Agent is a liquid, elevated-temperature curing agent for epoxy resins. It is readily compatible with both liquid and solid epoxy resins, and because it is a catalytic curing agent, it is used at low loadings of 1−5 phr. It is ideal f...view more
IMICURE® AMI-1 Curing Agent is a liquid, elevated-temperature curing agent for epoxy resins. It is readily compatible with both liquid and solid epoxy resins, and because it is a catalytic curing agent, it is used at low loadings of 1−5 phr. It is ideal for use in adhesives, pre-preg composites, and encapsulation. view less
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