| A-6165 | Designer Molecules | A-6165 is a dark brown viscous liquid, additive with a conductive adhesive formulation. This is most commonly used as an additive in combination with metal fillers to further decrease volume resistivity in electrically conductive adhesive applications. | |
| A-675-100% | Designer Molecules | A-675-100% is a Bis(Glyceryl Dimethacrylate) Pyromellitate liquid additive. This product is most commonly used as an additive in adhesive applications. The four methacrylate groups and two carboxylic groups per molecule allow bonding to a variety surfaces...voir plus A-675-100% is a Bis(Glyceryl Dimethacrylate) Pyromellitate liquid additive. This product is most commonly used as an additive in adhesive applications. The four methacrylate groups and two carboxylic groups per molecule allow bonding to a variety surfaces. voir moins | |
| BMI-1500 | Designer Molecules | BMI-1500 is a viscous amber liquid form bismaleimide oligomer. This product exhibits good adhesion to a variety of substrates. BMI-1500 is most commonly used in adhesives as an additive or base resin, for high temperature applications. | |
| BMI-1700 | Designer Molecules | BMI-1700 is a viscous amber liquid form bismaleimide oligomer. This product exhibits good adhesion to a variety of substrates. BMI-1700 is most commonly used in adhesives as an additive or base resin, for high temperature applications. | |
| BMI-3000 | Designer Molecules | BMI-3000 is a light yellow powder form bismaleimide oligomer. This product exhibits excellent flexibility and forms very tough, hydrophobic polyimides. BMI-3000 is most commonly used in adhesives as an additive to increase flexibility, hydrophobicity, and...voir plus BMI-3000 is a light yellow powder form bismaleimide oligomer. This product exhibits excellent flexibility and forms very tough, hydrophobic polyimides. BMI-3000 is most commonly used in adhesives as an additive to increase flexibility, hydrophobicity, and thixotropy. voir moins | |
| BMI-3000 GEL | Designer Molecules | BMI-3000 GEL is a red amber gel form bismaleimide oligomer. This product exhibits excellent flexibility and forms very tough, hydrophobic polyimides. BMI-3000 GEL is most commonly used in adhesives as an additive to increase flexibility, hydrophobicity, a...voir plus BMI-3000 GEL is a red amber gel form bismaleimide oligomer. This product exhibits excellent flexibility and forms very tough, hydrophobic polyimides. BMI-3000 GEL is most commonly used in adhesives as an additive to increase flexibility, hydrophobicity, and thixotropy. voir moins | |
| BMI-5000 | Designer Molecules | BMI-5000 is a light yellow powder form bismaleimide oligomer. This product can be processed in a resin system as a solid or dissolved in a solvent. BMI-5000 is a most commonly used in base resin applications. | |
| BMI-5000 50% Toluene | Designer Molecules | BMI-5000 50% Toluene is a dark brown liquid form bismaleimide oligomer. This product can be processed in a resin system as a solid or dissolved in a solvent. BMI-5000 50% Toluene is a most commonly used in base resin applications. | |
| CS-783 | Designer Molecules | CS-783 is a yellow liquid methacrylated epoxy. This product features dual cure mechanisms, low chloride, multifunctional, low viscosity, and UV curable. CS-783 is most commonly used in adhesion promoting applications. | |
| DYHARD® 100 | AlzChem | DYHARD® 100 is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations...voir plus DYHARD® 100 is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat. voir moins | |
| DYHARD® 100M | AlzChem | DYHARD® 100M is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomeration...voir plus DYHARD® 100M is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat. voir moins | |
| DYHARD® 100S | AlzChem | DYHARD® 100S is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomeration...voir plus DYHARD® 100S is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat. voir moins | |
| DYHARD® 100SF | AlzChem | DYHARD® 100SF is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomeratio...voir plus DYHARD® 100SF is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat. voir moins | |
| DYHARD® 100SH | AlzChem | DYHARD® 100SH is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomeratio...voir plus DYHARD® 100SH is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat. voir moins | |
| DYHARD® CAAB | AlzChem | DYHARD® CAAB is a curing agent for matt finish powder coatings based on epoxy or epoxy-polyester hybrid formulations. Usually it is used together with DYHARD® PIN to realize these matt finishes. For low gloss applications the optimal mixing ratio between ...voir plus DYHARD® CAAB is a curing agent for matt finish powder coatings based on epoxy or epoxy-polyester hybrid formulations. Usually it is used together with DYHARD® PIN to realize these matt finishes. For low gloss applications the optimal mixing ratio between DYHARD® PIN and DYHARD® CAAB is 45:55. This ideal mixture is also available in the ready to use premix DYHARD® PMC for an easy handling. voir moins | |
| DYHARD® D50EP | AlzChem | DYHARD® D50EP is a master batch of 50% DYHARD® 100S in standard bisphenol A epoxy resin (EEW 182-192). Advantages include a dust-free production environment, as well as easier dosage and incorporation. It is cost-effective due to easy handling, and offers...voir plus DYHARD® D50EP is a master batch of 50% DYHARD® 100S in standard bisphenol A epoxy resin (EEW 182-192). Advantages include a dust-free production environment, as well as easier dosage and incorporation. It is cost-effective due to easy handling, and offers the same reactivity, latency, and mechanical properties as the DYHARD® 100 series. This product is recommended for one-component thermosetting epoxy resin formulations for the automotive, sporting goods, and aerospace industry, for adhesives, for encapsulation compounds, and more. voir moins | |
| DYHARD® DF50EP | AlzChem | DYHARD® DF50EP is a master batch of 50% DYHARD® 100SF in standard bisphenol A epoxy resin (EEW 182-192). Products of the DYHARD® master batches are widely used for all kinds of one component thermosetting epoxy resin formulations | |
| DYHARD® Fluid 111 | AlzChem | DYHARD® Fluid 111 is a liquid latent curing agent for thermosetting epoxy resin formulations. | |
| DYHARD® Fluid 212 | AlzChem | DYHARD® Fluid 212 is a liquid latent curing agent. It features a long pot life in the impregnation bath, a rapid cure at 120ºC, optical clearness, and high transparency. This makes it ideal for use in filament winding applications. | |
| DYHARD® MCA10 | AlzChem | DYHARD® MCA10 is a special formulated curing agent for low temperature cure, or very fast cure at standard cure temperatures. A formulated 1K-Epoxy resins system with DYHARD® MCA10 still has an acceptable long latency of a few weeks at room temperature. | |
| DYHARD® MCA30 | AlzChem | DYHARD® MCA30 is a non toxic, special formulated curing agent for low temperature cure, high gloss epoxy powder coatings. | |
| DYHARD® MI-C | AlzChem | DYHARD® MI-C is used as a very active but also reasonably latent accelerator in thermosetting epoxy resin formulations. It is typically used for fast curing, or low temperature cure, resin systems with low latency requirements. | |
| DYHARD® MI-FF | AlzChem | DYHARD® MI-FF is used as a very active but also reasonably latent accelerator in thermosetting epoxy resin formulations. It is typically used for fast curing, or low temperature cure, resin systems with low latency requirements. | |
| DYHARD® MIA5 | AlzChem | DYHARD® MIA5 is used as a very active but also reasonably latent accelerator in thermosetting epoxy resin formulations. It’s use is particularly suited in combination with micronized dicyandiamide from the DYHARD® CU-Line, or with the dicyandiamide master...voir plus DYHARD® MIA5 is used as a very active but also reasonably latent accelerator in thermosetting epoxy resin formulations. It’s use is particularly suited in combination with micronized dicyandiamide from the DYHARD® CU-Line, or with the dicyandiamide master batches from the DYHARD® MB-Line. voir moins | |
| DYHARD® OTB | AlzChem | DYHARD® OTB represents a medium reactive curing agent for high gloss epoxy powder coatings. With it’s ideal distribution properties in epoxy resins high quality finishes at low curing temperatures are provided. | |
| DYHARD® PI | AlzChem | DYHARD® PI represents an imidazole based accelerator and/or hardener for thermosetting epoxy resin systems. It has a larger particle size than DYHARD® PI-FF, which is more suitable where lower reactiviy's are needed. | |
| DYHARD® PI-FF | AlzChem | DYHARD® PI-FF represents an imidazole based accelerator and/or hardener for thermosetting epoxy resin systems. DYHARD® PI-FF has a smaller particle size than DYHARD® PI and hence is more suitable where higher reactivity's are needed. | |
| DYHARD® PIN | AlzChem | DYHARD® PIN represents a curing agent which is used in low gloss epoxy and epoxy-polyester hybrid powder coatings. It’s ideal distribution properties in both resin systems provides high quality finishes with a very good color stability. | |
| DYHARD® PMC | AlzChem | DYHARD® PMC represents a matt curing agent for low gloss epoxy and epoxy-polyester hybrid powder coatings. With its ideal distribution properties in both resins systems, high quality finishes with a very good color stability are provided. | |
| DYHARD® UR200 | AlzChem | DYHARD® UR200 represents a latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. | |
| DYHARD® UR300 | AlzChem | DYHARD® UR300 represents a latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. | |
| DYHARD® UR300AB | AlzChem | DYHARD® UR300AB represents a latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. | |
| DYHARD® UR400 | AlzChem | DYHARD® UR400 represents a bi-functional, micronized accelerator based on a substituted urea. Being an active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in...voir plus DYHARD® UR400 represents a bi-functional, micronized accelerator based on a substituted urea. Being an active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. voir moins | |
| DYHARD® UR500 | AlzChem | DYHARD® UR500 represents a bi-functional, micronized accelerator based on a substituted urea. Being a highly active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 ser...voir plus DYHARD® UR500 represents a bi-functional, micronized accelerator based on a substituted urea. Being a highly active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. voir moins | |
| DYHARD® UR700 | AlzChem | DYHARD® UR700 represents a highly latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. In addit...voir plus DYHARD® UR700 represents a highly latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. In addition, DYHARD® UR700 is soluble in water, which makes it a preferred accelerator for waterborne applications. voir moins | |
| DYHARD® UR800 | AlzChem | DYHARD® UR800 represents a very latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. | |
| DYHARD® URAcc13 | AlzChem | DYHARD® URAcc13 represents a formulated latent, micronized accelerator based on a substituted urea. Being an active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 ser...voir plus DYHARD® URAcc13 represents a formulated latent, micronized accelerator based on a substituted urea. Being an active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. voir moins | |
| DYHARD® URAcc57 | AlzChem | DYHARD® URAcc57 represents a latent, micronized accelerator based on a substituted urea. Being a very highly active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 ser...voir plus DYHARD® URAcc57 represents a latent, micronized accelerator based on a substituted urea. Being a very highly active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. voir moins | |
| EC-1074 | Designer Molecules | EC-1074 is an amber glassy solid tetra-phenol epoxy. This product highlights low modulus, hydrophobic, thermal stability, hydrolytically resistant thermosets. EC-1074 is most commonly used as an epoxy curative in film and pre-applied adhesive composition...voir plus EC-1074 is an amber glassy solid tetra-phenol epoxy. This product highlights low modulus, hydrophobic, thermal stability, hydrolytically resistant thermosets. EC-1074 is most commonly used as an epoxy curative in film and pre-applied adhesive composition applications. voir moins | |
| EC-234 | Designer Molecules | EC-234 is a light yellow, liquid phenyl ester epoxy curative hybrid. This product has the ability to cure with both epoxy resin through the phenyl ester or in a free radical resin system through the acrylate. EC-234 is most commonly used as an adhesive o...voir plus EC-234 is a light yellow, liquid phenyl ester epoxy curative hybrid. This product has the ability to cure with both epoxy resin through the phenyl ester or in a free radical resin system through the acrylate. EC-234 is most commonly used as an adhesive or coating in a multitude of applications. voir moins | |
| EC-298 | Designer Molecules | EC-298 is a clear light yellow, liquid difunctional phenyl ester epoxy. This product does not interfere with free-radical cure and is therefore well suited for use in epoxy/(meth)acrylate hybrid thermoset compositions. EC-298 is most commonly used as an e...voir plus EC-298 is a clear light yellow, liquid difunctional phenyl ester epoxy. This product does not interfere with free-radical cure and is therefore well suited for use in epoxy/(meth)acrylate hybrid thermoset compositions. EC-298 is most commonly used as an epoxy curative in applications where toughness is required. voir moins | |
| EC-326 | Designer Molecules | EC-326 is a white to light yellow solid acetate/proprionate epoxy. This product has low melting curative properties, is soluble in most epoxy monomers, and low moisture uptake. EC-326 is most commonly used to improve toughness, hydrophobicity, and hydroly...voir plus EC-326 is a white to light yellow solid acetate/proprionate epoxy. This product has low melting curative properties, is soluble in most epoxy monomers, and low moisture uptake. EC-326 is most commonly used to improve toughness, hydrophobicity, and hydrolytic stability in adhesive applications. voir moins | |
| EC-392 | Designer Molecules | EC-392 is an amber liquid phenyl ester epoxy. This product highlights dual cure mechanism, high cross-link density, and thermal stability. EC-392 is most commonly used in liquid adhesives and paste applications. | |
| EC-861 | Designer Molecules | EC-861 is a yellow liquid phenyl acetate epoxy curative. This product highlights low modulus, hydrophobic, thermal stability, and hydrolytically resistant thermosets. EC-861 is most commonly used in applications where high levels of toughness and flexibil...voir plus EC-861 is a yellow liquid phenyl acetate epoxy curative. This product highlights low modulus, hydrophobic, thermal stability, and hydrolytically resistant thermosets. EC-861 is most commonly used in applications where high levels of toughness and flexibility are needed. voir moins | |
| ECAT-243 | Designer Molecules | ECAT-243 is a yellow microcrystalline solid imidazole epoxy catalyst. This product features good solubility in most epoxy monomers and excellent latency characteristics. ECAT-243 is most commonly used in epoxy homocure and epoxy curative applications. | |
| ECAT-259 | Designer Molecules | ECAT-259 is a yellow powder imidazole epoxy. This product features good solubility in most epoxy monomers, excellent latency characteristics, can be used as a catalyst or curative, and tunable cures. ECAT-259 is most commonly used in catalyst and epoxy c...voir plus ECAT-259 is a yellow powder imidazole epoxy. This product features good solubility in most epoxy monomers, excellent latency characteristics, can be used as a catalyst or curative, and tunable cures. ECAT-259 is most commonly used in catalyst and epoxy curative, applications. voir moins | |
| ECAT-353 | Designer Molecules | ECAT-353 is a besige powder imidazole epoxy catalyst. This product features good solubility in most epoxy monomers, excellent latency characteristics, can be used as a catalyst or curative, and tunable cures. ECAT-353 is most commonly used in catalyst and...voir plus ECAT-353 is a besige powder imidazole epoxy catalyst. This product features good solubility in most epoxy monomers, excellent latency characteristics, can be used as a catalyst or curative, and tunable cures. ECAT-353 is most commonly used in catalyst and epoxy curative applications. voir moins | |
| ECAT-434 | Designer Molecules | ECAT-434 is a yellow solid imidazole epoxy catalyst. This product features good solubility in most epoxy monomers, excellent latency characteristics, can be used as a catalyst or curative, and tunable cures. ECAT-434 is most commonly used in catalyst and ...voir plus ECAT-434 is a yellow solid imidazole epoxy catalyst. This product features good solubility in most epoxy monomers, excellent latency characteristics, can be used as a catalyst or curative, and tunable cures. ECAT-434 is most commonly used in catalyst and epoxy curative applications. voir moins | |
| Silzot® HQ plus (Powder) | AlzChem | Silzot® HQ plus (Powder) is a grey powder derived from the direct chemical reaction of silicon and nitrogen. | |
| Silzot® HQ (Powder) | AlzChem | Silzot® HQ (Powder) is a grey powder derived from the direct chemical reaction of silicon and nitrogen. | |
| Silzot® SQ | AlzChem | Silzot® SQ is a fine powder derived from the direct chemical reaction of highly purified silicon and nitrogen. | |
| Silzot® TQ (Powder) | AlzChem | Silzot® TQ (Powder) is a grey powder derived from the direct chemical reaction of silicon and nitrogen. |
