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HECTALITE® 200 American Colloid Company HECTALITE® 200 is a high-purity, micronized sodium hectorite clay, consisting of microfine particles for emulsion stabilizing, gelling, suspending, and binding. This product is a high-yielding hectorite clay that exhibits high efficiency, excellent rheolo...view more HECTALITE® 200 is a high-purity, micronized sodium hectorite clay, consisting of microfine particles for emulsion stabilizing, gelling, suspending, and binding. This product is a high-yielding hectorite clay that exhibits high efficiency, excellent rheology and stability, and is typically used in architectural paints, ceramics, and adhesives. view less
NT-552 Changzhou Niutang Chemical Plant NT-552 is a white powdered curing agent. It is widely used for its stabilizing, adhesive and curing agent properties. It is most commonly used in polyester powder coatings, plastic and rubber adhesive additives and PCB solder resistant ink.
TGIC-D Changzhou Niutang Chemical Plant TGIC-D is a white powder with low UV absorption, high heat and low chlorine level. It is used for its adhesive, stabilizing and curing agent properties. It is most commonly used in polyester powder coatings, plastic and rubber adhesive additives and PCB s...view more TGIC-D is a white powder with low UV absorption, high heat and low chlorine level. It is used for its adhesive, stabilizing and curing agent properties. It is most commonly used in polyester powder coatings, plastic and rubber adhesive additives and PCB solder resistant ink. view less
TGIC-G Changzhou Niutang Chemical Plant TGIC-G is a white granule with low UV absorption. It is used for its adhesive, stabilizing and curing agent properties. It is most commonly used in polyester powder coatings, plastic and rubber adhesive additives and PCB solder resistant ink.
TGIC-P Changzhou Niutang Chemical Plant TGIC-P is a white powder with high heat and chemical resistance. It is used for its adhesive, stabilizing and curing agent properties. It is most commonly used in polyester powder coatings, plastic and rubber adhesive additives and PCB solder resistant in...view more TGIC-P is a white powder with high heat and chemical resistance. It is used for its adhesive, stabilizing and curing agent properties. It is most commonly used in polyester powder coatings, plastic and rubber adhesive additives and PCB solder resistant ink. view less
VOLCLAY® HPM-20 American Colloid Company VOLCLAY® HPM-20 is a high-purity, air-classified sodium bentonite, selectively-mined, consisting of micronized particles and supplied as a free-flowing powder. This high-purity montmorillonite is typically used as a suspending agent, viscosifier, binder, ...view more VOLCLAY® HPM-20 is a high-purity, air-classified sodium bentonite, selectively-mined, consisting of micronized particles and supplied as a free-flowing powder. This high-purity montmorillonite is typically used as a suspending agent, viscosifier, binder, and emulsion stabilizer in adhesives and industrial applications. view less
VOLCLAY® HPM-75 American Colloid Company VOLCLAY® HPM-75 is a high-purity sodium bentonite, selectively-mined, consisting of micronized particles and supplied as a free-flowing powder. This high-purity montmorillonite is typically used as a suspending agent, viscosifier, binder, and emulsion sta...view more VOLCLAY® HPM-75 is a high-purity sodium bentonite, selectively-mined, consisting of micronized particles and supplied as a free-flowing powder. This high-purity montmorillonite is typically used as a suspending agent, viscosifier, binder, and emulsion stabilizer for adhesives, coatings, and other industrial applications. view less