| Blendex S 24/20 | Ichemco | Blendex S 24/20 is a thermoplastic polyurethane in methyl-ethyl-ketone solution, solvent-based, heat sealable adhesive. This product has a total solids content of 20-22% and a Brookfield viscosity at 25°C of 5500-7500 cPs. Blendex S 24/20 is most commonl...voir plus Blendex S 24/20 is a thermoplastic polyurethane in methyl-ethyl-ketone solution, solvent-based, heat sealable adhesive. This product has a total solids content of 20-22% and a Brookfield viscosity at 25°C of 5500-7500 cPs. Blendex S 24/20 is most commonly used as a soft heat sealable adhesive in lamination applications. voir moins | |
| Blendex S 24/25 A | Ichemco | Blendex S 24/25 A is a solution of a thermoplastic polyurethane in acetone solvent-based, heat sealable adhesive. This product has a total solids content of 24-26% and a Brookfield viscosity at 25°C of 5000-7000 cPs. Blendex S 24/25 A is most commonly us...voir plus Blendex S 24/25 A is a solution of a thermoplastic polyurethane in acetone solvent-based, heat sealable adhesive. This product has a total solids content of 24-26% and a Brookfield viscosity at 25°C of 5000-7000 cPs. Blendex S 24/25 A is most commonly used as a soft heat sealable adhesive in lamination applications. voir moins | |
| Blendex S 24/25 MA | Ichemco | Blendex S 24/25 MA is a mat solution of a thermoplastic polyurethane in acetone, solvent-based, heat sealable adhesive. This product has a total solids content of 23-25%. Blendex S 24/25 MA is most commonly used as a soft heat sealable adhesive in lamina...voir plus Blendex S 24/25 MA is a mat solution of a thermoplastic polyurethane in acetone, solvent-based, heat sealable adhesive. This product has a total solids content of 23-25%. Blendex S 24/25 MA is most commonly used as a soft heat sealable adhesive in lamination applications. voir moins | |
| Blendex S12 20 | Ichemco | Blendex S12 20 is a thermoplastic polyurethane in methyl-ethyl-ketone solution, solvent-based, heat sealable adhesive. This product has a total solids content of 19-21% and a Brookfield viscosity at 25°C of 2000-6000 cPs. Blendex S12 20 is most commonly...voir plus Blendex S12 20 is a thermoplastic polyurethane in methyl-ethyl-ketone solution, solvent-based, heat sealable adhesive. This product has a total solids content of 19-21% and a Brookfield viscosity at 25°C of 2000-6000 cPs. Blendex S12 20 is most commonly used as a soft heat sealable adhesive in lamination applications. voir moins | |
| Ithane 02 | Ichemco | Ithane 02 is an aromatic thermoplastic polyurethane in a dry granule form. This product has a Brookfield viscosity at 25°C of 460-680 cPs. Ithane 02 is most commonly used in shoe adhesive applications. | |
| Ithane 15/25 | Ichemco | Ithane 15/25 is a solvent-based, heat sealable adhesive. This product has a total solids content of 24-26%. Ithane 15/25 is most commonly used as a soft heat sealable adhesive in lamination applications. | |
| Ithane 46 | Ichemco | Ithane 46 is a solvent-based, heat sealable adhesive. This product has a total solids content of 35-37% and a Brookfield viscosity at 25°C of 1000-2000 cPs. Ithane 46 is most commonly used in transparent and aluminum-containing structure lamination applic...voir plus Ithane 46 is a solvent-based, heat sealable adhesive. This product has a total solids content of 35-37% and a Brookfield viscosity at 25°C of 1000-2000 cPs. Ithane 46 is most commonly used in transparent and aluminum-containing structure lamination applications. voir moins |
