| A-6165 | Designer Molecules | A-6165 is a dark brown viscous liquid, additive with a conductive adhesive formulation. This is most commonly used as an additive in combination with metal fillers to further decrease volume resistivity in electrically conductive adhesive applications. | |
| A-675-100% | Designer Molecules | A-675-100% is a Bis(Glyceryl Dimethacrylate) Pyromellitate liquid additive. This product is most commonly used as an additive in adhesive applications. The four methacrylate groups and two carboxylic groups per molecule allow bonding to a variety surfaces...voir plus A-675-100% is a Bis(Glyceryl Dimethacrylate) Pyromellitate liquid additive. This product is most commonly used as an additive in adhesive applications. The four methacrylate groups and two carboxylic groups per molecule allow bonding to a variety surfaces. voir moins | |
| Amicure® CG-NA Curing Agent | Evonik Operations GmbH, BL Crosslinkers | Amicure® CG-NA Curing Agent is an unpulverized grade of dicyandiamide designed for use as a latent curing agent for epoxy resins in solventbased processes. It is ideal for use in electrical laminates, and solvent-based, pre-preg composites. | Request Sample |
| AMICURE® UR Curing Agent | Evonik Operations GmbH, BL Crosslinkers | AMICURE® UR Curing Agent is a substituted urea-based accelerator (1 Phenyl 3,3 dimethyl urea) for dicyandiamide- cured epoxy resins. It combines excellent latency at ambient temperature with rapid cure in systems heated above its activation temperature. I...voir plus AMICURE® UR Curing Agent is a substituted urea-based accelerator (1 Phenyl 3,3 dimethyl urea) for dicyandiamide- cured epoxy resins. It combines excellent latency at ambient temperature with rapid cure in systems heated above its activation temperature. It is ideal for use in one-pack paste and film adhesives, heat-sure composites, and prepreg composites. voir moins | Request Sample |
| Ancamide® 220 Curing Agent | Evonik Operations GmbH, BL Crosslinkers | Ancamide® 220 Curing Agent is one in a series of standard reactive polyamides for use in the curing of epoxy resins. It has been designed particularly for use in solvent-based surface coatings. | Request Sample |
| ANCAMIDE® 220-X-70 Curing Agent | Evonik Operations GmbH, BL Crosslinkers | ANCAMIDE® 220-X-70 Curing Agent is one in a series of standard reactive polyamides intended for use in the curing of epoxy resins. It is ideal for use in solvent-based maintenance coatings, primers, sealers and coatings for concrete. | Request Sample |
| ANCAMIDE 221® Curing Agent | Evonik Operations GmbH, BL Crosslinkers | ANCAMIDE 221® Curing Agent is a member of a series of reactive polyamides developed for use in the curing of epoxy resins in solvent-based surface coatings applications. Special features include good color, color stability, chemical resistance and excelle...voir plus ANCAMIDE 221® Curing Agent is a member of a series of reactive polyamides developed for use in the curing of epoxy resins in solvent-based surface coatings applications. Special features include good color, color stability, chemical resistance and excellent corrosion resistance properties. It is freely compatible with a wide range of solvents, including those generally used in epoxy resin based coatings. voir moins | Request Sample |
| ANCAMIDE® 3201 Curing Agent | Evonik Operations GmbH, BL Crosslinkers | ANCAMIDE® 3201 Curing Agent is a low viscosity, solvent-free formulated polyaminoamide adduct. The curing agent is an accelerated version of Ancamine® 3200 and is recommended for use with liquid epoxy resin for the development of primers, coatings particu...voir plus ANCAMIDE® 3201 Curing Agent is a low viscosity, solvent-free formulated polyaminoamide adduct. The curing agent is an accelerated version of Ancamine® 3200 and is recommended for use with liquid epoxy resin for the development of primers, coatings particularly for wet and high humid application areas. In addition the curing agent can be used for high-solid coatings for corrosion protection under severe conditions. voir moins | Request Sample |
| ANCAMIDE® 400 Curing Agent | Evonik Operations GmbH, BL Crosslinkers | ANCAMIDE® 400 Curing Agent is a unique, low viscosity reactive polyamide developed specifically for use in the curing of liquid epoxy resins. It can be used in a wide range of applications, including flooring and surface coatings, adhesives, sealant and p...voir plus ANCAMIDE® 400 Curing Agent is a unique, low viscosity reactive polyamide developed specifically for use in the curing of liquid epoxy resins. It can be used in a wide range of applications, including flooring and surface coatings, adhesives, sealant and putties, castings, laminates, and cable jointing compounds. voir moins | Request Sample |
| Ancamide® 910 | Evonik Operations GmbH, BL Crosslinkers | Ancamide® 910 curing agent is a versatile, flexible hardener designed for use with liquid epoxy resin. Its engineered chemistry provides a unique combination of properties not found in other epoxy hardeners. It delivers outstanding flexibility/peel streng...voir plus Ancamide® 910 curing agent is a versatile, flexible hardener designed for use with liquid epoxy resin. Its engineered chemistry provides a unique combination of properties not found in other epoxy hardeners. It delivers outstanding flexibility/peel strength, excellent thermal shock resistance, and good electrical properties. Additional features include lower viscosity than conventional polyamides and DOT non-corrosive status. Ancamide® 910 curing agent can be used either as a sole curing agent or as a modifier. voir moins | Request Sample |
| Ancamine® 2014AS/FG | Evonik Operations GmbH, BL Crosslinkers | Ancamine® 2014AS/FG is a modified aliphatic polyamine adduct designed for use as a latent catalyst and curing agent for liquid epoxy resins. They can also be used as accelerators for dicyandiamide (DICY). This white micronised powder is applied in one-com...voir plus Ancamine® 2014AS/FG is a modified aliphatic polyamine adduct designed for use as a latent catalyst and curing agent for liquid epoxy resins. They can also be used as accelerators for dicyandiamide (DICY). This white micronised powder is applied in one-component adhesives and solvent free laminating. voir moins | Request Sample |
| Ancamine® 2337S | Evonik Operations GmbH, BL Crosslinkers | Ancamine® 2337S curing agent is a modified aliphatic amine designed for use as a latent curing agent for epoxy resins. Applications for this product include one-component conduction or induction heat-cure adhesives, potting, coatings, and hot-melt prepreg...voir plus Ancamine® 2337S curing agent is a modified aliphatic amine designed for use as a latent curing agent for epoxy resins. Applications for this product include one-component conduction or induction heat-cure adhesives, potting, coatings, and hot-melt prepregs. This product is a light yellow powder. voir moins | Request Sample |
| Ancamine® 2441 Curing Agent | Evonik Operations GmbH, BL Crosslinkers | Ancamine® 2441 curing agent is a modified polyamine which was designed for use as a latent curing agentfor onecomponent adhesive formulations. The product can also be used as an accelerator fordicyandiamide (dicy). Its combinatio...voir plus Ancamine® 2441 curing agent is a modified polyamine which was designed for use as a latent curing agentfor onecomponent adhesive formulations. The product can also be used as an accelerator fordicyandiamide (dicy). Its combination of low temperature activation, good shelf life and high glass transitiontemperature permits use in many applications requiring latency and high performance. voir moins | Request Sample |
| Ancamine® 2442 Curing Agent | Evonik Operations GmbH, BL Crosslinkers | Ancamine® 2442 curing agent is a modified polyamine designed for use as a latent curing agent for one-component epoxy formulations. The product can also be used to accelerate dicyandiamide (DICY). It provides an excellent balance of low-temp...voir plus Ancamine® 2442 curing agent is a modified polyamine designed for use as a latent curing agent for one-component epoxy formulations. The product can also be used to accelerate dicyandiamide (DICY). It provides an excellent balance of low-temperature activation, good shelf stability and high glass transition temperature, and can be used in many applications requiring latency and high performance. voir moins | Request Sample |
| BMI-1500 | Designer Molecules | BMI-1500 is a viscous amber liquid form bismaleimide oligomer. This product exhibits good adhesion to a variety of substrates. BMI-1500 is most commonly used in adhesives as an additive or base resin, for high temperature applications. | |
| BMI-1700 | Designer Molecules | BMI-1700 is a viscous amber liquid form bismaleimide oligomer. This product exhibits good adhesion to a variety of substrates. BMI-1700 is most commonly used in adhesives as an additive or base resin, for high temperature applications. | |
| BMI-3000 | Designer Molecules | BMI-3000 is a light yellow powder form bismaleimide oligomer. This product exhibits excellent flexibility and forms very tough, hydrophobic polyimides. BMI-3000 is most commonly used in adhesives as an additive to increase flexibility, hydrophobicity, and...voir plus BMI-3000 is a light yellow powder form bismaleimide oligomer. This product exhibits excellent flexibility and forms very tough, hydrophobic polyimides. BMI-3000 is most commonly used in adhesives as an additive to increase flexibility, hydrophobicity, and thixotropy. voir moins | |
| BMI-3000 GEL | Designer Molecules | BMI-3000 GEL is a red amber gel form bismaleimide oligomer. This product exhibits excellent flexibility and forms very tough, hydrophobic polyimides. BMI-3000 GEL is most commonly used in adhesives as an additive to increase flexibility, hydrophobicity, a...voir plus BMI-3000 GEL is a red amber gel form bismaleimide oligomer. This product exhibits excellent flexibility and forms very tough, hydrophobic polyimides. BMI-3000 GEL is most commonly used in adhesives as an additive to increase flexibility, hydrophobicity, and thixotropy. voir moins | |
| BMI-5000 | Designer Molecules | BMI-5000 is a light yellow powder form bismaleimide oligomer. This product can be processed in a resin system as a solid or dissolved in a solvent. BMI-5000 is a most commonly used in base resin applications. | |
| BMI-5000 50% Toluene | Designer Molecules | BMI-5000 50% Toluene is a dark brown liquid form bismaleimide oligomer. This product can be processed in a resin system as a solid or dissolved in a solvent. BMI-5000 50% Toluene is a most commonly used in base resin applications. | |
| CAB-O-SIL® EH5 | Cabot Corporation - Additives | CAB-O-SIL® EH5 is a very high surface fumed silica that can be used to provide thickening, thixotropic, and anti-settling behavior in liquid systems. It is characterized by high purity, aggregated structure, submicron particle size, low bulk density, and ...voir plus CAB-O-SIL® EH5 is a very high surface fumed silica that can be used to provide thickening, thixotropic, and anti-settling behavior in liquid systems. It is characterized by high purity, aggregated structure, submicron particle size, low bulk density, and hyprophilic surface chemistry. This product is well suited for use in adhesives and sealants, coatings, and printing inks. voir moins | |
| CAB-O-SIL® H5 | Cabot Corporation - Additives | CAB-O-SIL® H5 is a high surface area fumed silica that can be used to provide thickening, thixotropic, and anti-settling behavior in liquid systems. It is characterized by high purity, aggregated structure, submicron particle size, low bulk density, and h...voir plus CAB-O-SIL® H5 is a high surface area fumed silica that can be used to provide thickening, thixotropic, and anti-settling behavior in liquid systems. It is characterized by high purity, aggregated structure, submicron particle size, low bulk density, and hyprophilic surface chemistry. It is also used for building viscosity in non-polar to medium polarity systems. This product is well suited for use in adhesives, coatings, composites, cosmetics, food, pharmaceuticals, powder coatings, sealants, and silicone rubber systems. voir moins | |
| CAB-O-SIL® LM150 | Cabot Corporation - Additives | CAB-O-SIL® LM150 is a low surface area fumed silica that imparts a moderate increase in viscosity, and reinforcement in liquid and polymer systems. It provides balance of dispersability, thixotropy, and reinforcement. This product is well suited for use f...voir plus CAB-O-SIL® LM150 is a low surface area fumed silica that imparts a moderate increase in viscosity, and reinforcement in liquid and polymer systems. It provides balance of dispersability, thixotropy, and reinforcement. This product is well suited for use for thixotropy in silicone sealants and for reinforcement in silicone rubbers. voir moins | |
| CAB-O-SIL® M-5 | Cabot Corporation - Additives | CAB-O-SIL® M-5 is a untreated medium surface fumed silica that provides thickening, thixotrophic, and anti-settling behavior in liquid systems. It is most efficient in non-polar to medium polarity systems, and provides increases in hardness, tensile stren...voir plus CAB-O-SIL® M-5 is a untreated medium surface fumed silica that provides thickening, thixotrophic, and anti-settling behavior in liquid systems. It is most efficient in non-polar to medium polarity systems, and provides increases in hardness, tensile strength and elongation. It can be used for reinforcement of silicone and organic rubbers. This product is well suited for use in coatings, adhesives, and other liquid systems. voir moins | |
| CAB-O-SIL® TS530 | Cabot Corporation - Additives | CAB-O-SIL® TS530 is a high-purity silica that has been treated with hexamethyldisilazane to render the silica hydrophobic. It offers good rheological control, sag resistance, anti-settling, and improved dispersion. This product is well suited for use in m...voir plus CAB-O-SIL® TS530 is a high-purity silica that has been treated with hexamethyldisilazane to render the silica hydrophobic. It offers good rheological control, sag resistance, anti-settling, and improved dispersion. This product is well suited for use in medium-to-high polarity inks, coatings, and adhesive applications. voir moins | |
| CAB-O-SIL® TS610 | Cabot Corporation - Additives | CAB-O-SIL® TS610 is a low surface area fumed silica that has been surface modified with dimethyldichlorosilane. As a thickener, this product is well suited for use in non-polar to medium polarity inks, coatings, and adhesives. It is also highly effective ...voir plus CAB-O-SIL® TS610 is a low surface area fumed silica that has been surface modified with dimethyldichlorosilane. As a thickener, this product is well suited for use in non-polar to medium polarity inks, coatings, and adhesives. It is also highly effective as free-flow additive for moisture-sensitive powder systems. voir moins | |
| CAB-O-SIL® TS622 | Cabot Corporation - Additives | CAB-O-SIL® TS622 is a medium surface area fumed silica that has been surface modified with dimethyldichlorosilane. This product is specially designed for use as a reinforcing agent for RTV-1 silicone sealants, where it provides faster wet-in or incorporat...voir plus CAB-O-SIL® TS622 is a medium surface area fumed silica that has been surface modified with dimethyldichlorosilane. This product is specially designed for use as a reinforcing agent for RTV-1 silicone sealants, where it provides faster wet-in or incorporation, better dispersion, and good sealant surface smoothness and appearance. voir moins | |
| CAB-O-SIL® TS720 | Cabot Corporation - Additives | CAB-O-SIL® TS720 is a medium surface area fumed silica which has been surface modified with polydimethylsiloxane. It provides thickening efficiency, sag resistance or high film build, anti-settling of pigments and fillers, shear-thinning rheological behav...voir plus CAB-O-SIL® TS720 is a medium surface area fumed silica which has been surface modified with polydimethylsiloxane. It provides thickening efficiency, sag resistance or high film build, anti-settling of pigments and fillers, shear-thinning rheological behavior, and stable rheological performance over time. This product is well suited for rheology control in adhesives, composites, and coatings. voir moins | |
| CAB-O-SPERSE® 1030K | Cabot Corporation - Additives | CAB-O-SPERSE® 1030K is an aqueous fumed silica dispersion featuring low viscosity and high solids loading. Performance benefits of this product include good rheological control,anti-blocking, anti-corrosion, adhesion promotion, and surface treatment prope...voir plus CAB-O-SPERSE® 1030K is an aqueous fumed silica dispersion featuring low viscosity and high solids loading. Performance benefits of this product include good rheological control,anti-blocking, anti-corrosion, adhesion promotion, and surface treatment properties. This product is well suited for use in coatings, adhesives, and metal and optical glass polish applications. voir moins | |
| CS-783 | Designer Molecules | CS-783 is a yellow liquid methacrylated epoxy. This product features dual cure mechanisms, low chloride, multifunctional, low viscosity, and UV curable. CS-783 is most commonly used in adhesion promoting applications. | |
| EC-1074 | Designer Molecules | EC-1074 is an amber glassy solid tetra-phenol epoxy. This product highlights low modulus, hydrophobic, thermal stability, hydrolytically resistant thermosets. EC-1074 is most commonly used as an epoxy curative in film and pre-applied adhesive composition...voir plus EC-1074 is an amber glassy solid tetra-phenol epoxy. This product highlights low modulus, hydrophobic, thermal stability, hydrolytically resistant thermosets. EC-1074 is most commonly used as an epoxy curative in film and pre-applied adhesive composition applications. voir moins | |
| EC-234 | Designer Molecules | EC-234 is a light yellow, liquid phenyl ester epoxy curative hybrid. This product has the ability to cure with both epoxy resin through the phenyl ester or in a free radical resin system through the acrylate. EC-234 is most commonly used as an adhesive o...voir plus EC-234 is a light yellow, liquid phenyl ester epoxy curative hybrid. This product has the ability to cure with both epoxy resin through the phenyl ester or in a free radical resin system through the acrylate. EC-234 is most commonly used as an adhesive or coating in a multitude of applications. voir moins | |
| EC-298 | Designer Molecules | EC-298 is a clear light yellow, liquid difunctional phenyl ester epoxy. This product does not interfere with free-radical cure and is therefore well suited for use in epoxy/(meth)acrylate hybrid thermoset compositions. EC-298 is most commonly used as an e...voir plus EC-298 is a clear light yellow, liquid difunctional phenyl ester epoxy. This product does not interfere with free-radical cure and is therefore well suited for use in epoxy/(meth)acrylate hybrid thermoset compositions. EC-298 is most commonly used as an epoxy curative in applications where toughness is required. voir moins | |
| EC-326 | Designer Molecules | EC-326 is a white to light yellow solid acetate/proprionate epoxy. This product has low melting curative properties, is soluble in most epoxy monomers, and low moisture uptake. EC-326 is most commonly used to improve toughness, hydrophobicity, and hydroly...voir plus EC-326 is a white to light yellow solid acetate/proprionate epoxy. This product has low melting curative properties, is soluble in most epoxy monomers, and low moisture uptake. EC-326 is most commonly used to improve toughness, hydrophobicity, and hydrolytic stability in adhesive applications. voir moins | |
| EC-392 | Designer Molecules | EC-392 is an amber liquid phenyl ester epoxy. This product highlights dual cure mechanism, high cross-link density, and thermal stability. EC-392 is most commonly used in liquid adhesives and paste applications. | |
| EC-861 | Designer Molecules | EC-861 is a yellow liquid phenyl acetate epoxy curative. This product highlights low modulus, hydrophobic, thermal stability, and hydrolytically resistant thermosets. EC-861 is most commonly used in applications where high levels of toughness and flexibil...voir plus EC-861 is a yellow liquid phenyl acetate epoxy curative. This product highlights low modulus, hydrophobic, thermal stability, and hydrolytically resistant thermosets. EC-861 is most commonly used in applications where high levels of toughness and flexibility are needed. voir moins | |
| ECAT-243 | Designer Molecules | ECAT-243 is a yellow microcrystalline solid imidazole epoxy catalyst. This product features good solubility in most epoxy monomers and excellent latency characteristics. ECAT-243 is most commonly used in epoxy homocure and epoxy curative applications. | |
| ECAT-259 | Designer Molecules | ECAT-259 is a yellow powder imidazole epoxy. This product features good solubility in most epoxy monomers, excellent latency characteristics, can be used as a catalyst or curative, and tunable cures. ECAT-259 is most commonly used in catalyst and epoxy c...voir plus ECAT-259 is a yellow powder imidazole epoxy. This product features good solubility in most epoxy monomers, excellent latency characteristics, can be used as a catalyst or curative, and tunable cures. ECAT-259 is most commonly used in catalyst and epoxy curative, applications. voir moins | |
| ECAT-353 | Designer Molecules | ECAT-353 is a besige powder imidazole epoxy catalyst. This product features good solubility in most epoxy monomers, excellent latency characteristics, can be used as a catalyst or curative, and tunable cures. ECAT-353 is most commonly used in catalyst and...voir plus ECAT-353 is a besige powder imidazole epoxy catalyst. This product features good solubility in most epoxy monomers, excellent latency characteristics, can be used as a catalyst or curative, and tunable cures. ECAT-353 is most commonly used in catalyst and epoxy curative applications. voir moins | |
| ECAT-434 | Designer Molecules | ECAT-434 is a yellow solid imidazole epoxy catalyst. This product features good solubility in most epoxy monomers, excellent latency characteristics, can be used as a catalyst or curative, and tunable cures. ECAT-434 is most commonly used in catalyst and ...voir plus ECAT-434 is a yellow solid imidazole epoxy catalyst. This product features good solubility in most epoxy monomers, excellent latency characteristics, can be used as a catalyst or curative, and tunable cures. ECAT-434 is most commonly used in catalyst and epoxy curative applications. voir moins | |
| IMICURE® AMI-1 Curing Agent | Evonik Operations GmbH, BL Crosslinkers | IMICURE® AMI-1 Curing Agent is a liquid, elevated-temperature curing agent for epoxy resins. It is readily compatible with both liquid and solid epoxy resins, and because it is a catalytic curing agent, it is used at low loadings of 1−5 phr. It is ideal f...voir plus IMICURE® AMI-1 Curing Agent is a liquid, elevated-temperature curing agent for epoxy resins. It is readily compatible with both liquid and solid epoxy resins, and because it is a catalytic curing agent, it is used at low loadings of 1−5 phr. It is ideal for use in adhesives, pre-preg composites, and encapsulation. voir moins | Request Sample |
| IMICURE® AMI-2T Curing Agent | Evonik Operations GmbH, BL Crosslinkers | IMICURE® AMI-2T Curing Agent is an elevated temperature curing agent for epoxy systems. It is readily compatible with both liquid and solid epoxy resins, and because it is a catalytic curing agent, it is used at low loadings of 1−5 phr. It is a good accel...voir plus IMICURE® AMI-2T Curing Agent is an elevated temperature curing agent for epoxy systems. It is readily compatible with both liquid and solid epoxy resins, and because it is a catalytic curing agent, it is used at low loadings of 1−5 phr. It is a good accelerator for dicyandiamide, anhydride and phenolic curing agents. It is ideal for use in electrical laminates, adhesives, pre-preg composites, and encapsulation. voir moins | Request Sample |
| IMICURE® EMI-24 Curing Agent | Evonik Operations GmbH, BL Crosslinkers | IMICURE® EMI-24 Curing Agent is a high-reactivity, medium-viscosity liquid imidazole used alone or to accelerate dicyandiamide or anhydride cures. Used in filament winding, electrical laminates, molding powders, one-component adhesives, and structural adh...voir plus IMICURE® EMI-24 Curing Agent is a high-reactivity, medium-viscosity liquid imidazole used alone or to accelerate dicyandiamide or anhydride cures. Used in filament winding, electrical laminates, molding powders, one-component adhesives, and structural adhesives. voir moins | Request Sample |
| IMICURE® Imidazole Curing Agent | Evonik Operations GmbH, BL Crosslinkers | IMICURE® Imidazole Curing Agent is an elevated-temperature curing agent for epoxy resins. It is readily compatible with both liquid and solid epoxy resins, and because it is a catalytic curing agent, it is used at low loadings of 1−5 phr. It is a good acc...voir plus IMICURE® Imidazole Curing Agent is an elevated-temperature curing agent for epoxy resins. It is readily compatible with both liquid and solid epoxy resins, and because it is a catalytic curing agent, it is used at low loadings of 1−5 phr. It is a good accelerator for dicyandiamide, anhydride and phenolic curing agents. voir moins | Request Sample |
| NOURYBOND® 289 Adhesion Promoter | Evonik Operations GmbH, BL Crosslinkers | NOURYBOND® 289 Adhesion Promoter is a blocked isocyanate PVC plastisol adhesion promoter for use in automotive sealants applied to visible areas and anti-chip primers. | Request Sample |
| SpectrAl® 100 | Cabot Corporation - Additives | SpectrAl® 100 is a high surface area fumed alumina. It has similar properties and functions as fumed silica for rheological control and free flow of powder coats. This product is well suited for use in coatings, adhesives, and rubber products. | |
| SpectrAl® 51 | Cabot Corporation - Additives | SpectrAl® 51 is a low surface area fumed alumina. It has similar morphology and properties as fumed silica for rheological control and free flow. This product is well suited for use in coatings, adhesives, and rubber products. | |
| SpectrAl® 81 | Cabot Corporation - Additives | SpectrAl® 81 is a medium surface area fumed alumina. It has similar morphology and properties as fumed silica for rheological control and free flow. This product is well suited for use in coatings, adhesives, and rubber products. | |
| VESTALITE® S 101 | Evonik Operations GmbH, BL Crosslinkers | VESTALITE® S 101 is a curing agent for epoxy resin matrix designed for SMC applications. Systems using VESTALITE® S 101 have a low initial viscosity during compounding, allowing excellent fiber wetting, highfiber volume fraction and efficient process...voir plus VESTALITE® S 101 is a curing agent for epoxy resin matrix designed for SMC applications. Systems using VESTALITE® S 101 have a low initial viscosity during compounding, allowing excellent fiber wetting, highfiber volume fraction and efficient processing. The high reactivity of the hardener allows fast curing inabout 4 - 5 min at 150 °. voir moins | Request Sample |
| VESTALITE® S 102 | Evonik Operations GmbH, BL Crosslinkers | VESTALITE® S 102 is a curing agent for epoxy resin matrix designed for SMC applications. Systems using VESTALITE® S 102 have a low initial viscosity during compounding, allowing excellent fiber wetting, high fiber volume fraction and efficient processing....voir plus VESTALITE® S 102 is a curing agent for epoxy resin matrix designed for SMC applications. Systems using VESTALITE® S 102 have a low initial viscosity during compounding, allowing excellent fiber wetting, high fiber volume fraction and efficient processing. The high reactivity of the hardener allows fast curing in about3 min at 150 °C. voir moins | Request Sample |
