| BurnEx™ 30-107 | Nyacol Nano Technology | BurnEx™ 30-107 is a flame retardant synergist for polyvinyl chloride and other materials employing halogens as its primary flame retardant. It is composed of agglomerated particles in the range of 10 to 40 microns and is used in textiles, adhesives, coati...voir plus BurnEx™ 30-107 is a flame retardant synergist for polyvinyl chloride and other materials employing halogens as its primary flame retardant. It is composed of agglomerated particles in the range of 10 to 40 microns and is used in textiles, adhesives, coatings, and water-based systems. voir moins | |
| BurnEx™ A1582 | Nyacol Nano Technology | BurnEx™ A1582, a Nano-Dispersible Dry Powder Colloidal Antimony Pentoxide Flame Retardant Additive, is used with halogenated flame retardants in polymers, solvents and adhesives. It has end use applications in flexible vinyl and thermoplastic polyester. | |
| BurnEx™ ADP480 | Nyacol Nano Technology | BurnEx™ ADP480 a nano-dispersible dry powder colloidal antimony Pentoxide flame retardant additive, is used with halogenated flame retardants in polymers, solvents and adhesives. It has end use applications in Polyolefins, HIPS, and Adhesives | |
| BurnEx™ ADP494 | Nyacol Nano Technology | BurnEx™ ADP494, a nano-dispersible dry powder colloidal antimony Pentoxide flame retardant additive, is used with halogenated flame retardants in polymers, solvents and adhesives. It has end use applications in Solution-spun fibers, ABS, Epoxy-ketones. | |
| BurnEx Plus™ A1588LP | Nyacol Nano Technology | BurnEx Plus™ A1588LP is a dry powder colloidal antimony pentoxide (Sb2O5) for use as a synergist with halogenated flame retardants in high performance epoxy. Its ultimate particle size is 0.03 microns and it has applications in textiles, adhesives, coatin...voir plus BurnEx Plus™ A1588LP is a dry powder colloidal antimony pentoxide (Sb2O5) for use as a synergist with halogenated flame retardants in high performance epoxy. Its ultimate particle size is 0.03 microns and it has applications in textiles, adhesives, coatings, and water-based systems. voir moins | |
| BurnEx Plus™ A1590 | Nyacol Nano Technology | BurnEx Plus™ A1590 is a dry powder colloidal antimony pentoxide (Sb2O5) for use as a synergist with halogenated flame retardants in high performance epoxy. Its ultimate particle size is 0.06 microns and it has applications in textiles, adhesives, coatings...voir plus BurnEx Plus™ A1590 is a dry powder colloidal antimony pentoxide (Sb2O5) for use as a synergist with halogenated flame retardants in high performance epoxy. Its ultimate particle size is 0.06 microns and it has applications in textiles, adhesives, coatings, and water-based systems. voir moins | |
| BurnEx™ ZTA | Nyacol Nano Technology | BurnEx™ ZTA is a dry powder colloidal antimony Pentoxide and a synergist with PVC and other halogenated polymers. Its particles are about 10-30 microns in size and it is used as a flame retardant synergist in vinyl plastisols, injection molding compounds ...voir plus BurnEx™ ZTA is a dry powder colloidal antimony Pentoxide and a synergist with PVC and other halogenated polymers. Its particles are about 10-30 microns in size and it is used as a flame retardant synergist in vinyl plastisols, injection molding compounds and calendar compounds. voir moins | |
| DYHARD® 100 | AlzChem | DYHARD® 100 is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations...voir plus DYHARD® 100 is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat. voir moins | |
| DYHARD® 100M | AlzChem | DYHARD® 100M is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomeration...voir plus DYHARD® 100M is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat. voir moins | |
| DYHARD® 100S | AlzChem | DYHARD® 100S is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomeration...voir plus DYHARD® 100S is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat. voir moins | |
| DYHARD® 100SF | AlzChem | DYHARD® 100SF is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomeratio...voir plus DYHARD® 100SF is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat. voir moins | |
| DYHARD® 100SH | AlzChem | DYHARD® 100SH is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomeratio...voir plus DYHARD® 100SH is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat. voir moins | |
| DYHARD® CAAB | AlzChem | DYHARD® CAAB is a curing agent for matt finish powder coatings based on epoxy or epoxy-polyester hybrid formulations. Usually it is used together with DYHARD® PIN to realize these matt finishes. For low gloss applications the optimal mixing ratio between ...voir plus DYHARD® CAAB is a curing agent for matt finish powder coatings based on epoxy or epoxy-polyester hybrid formulations. Usually it is used together with DYHARD® PIN to realize these matt finishes. For low gloss applications the optimal mixing ratio between DYHARD® PIN and DYHARD® CAAB is 45:55. This ideal mixture is also available in the ready to use premix DYHARD® PMC for an easy handling. voir moins | |
| DYHARD® D50EP | AlzChem | DYHARD® D50EP is a master batch of 50% DYHARD® 100S in standard bisphenol A epoxy resin (EEW 182-192). Advantages include a dust-free production environment, as well as easier dosage and incorporation. It is cost-effective due to easy handling, and offers...voir plus DYHARD® D50EP is a master batch of 50% DYHARD® 100S in standard bisphenol A epoxy resin (EEW 182-192). Advantages include a dust-free production environment, as well as easier dosage and incorporation. It is cost-effective due to easy handling, and offers the same reactivity, latency, and mechanical properties as the DYHARD® 100 series. This product is recommended for one-component thermosetting epoxy resin formulations for the automotive, sporting goods, and aerospace industry, for adhesives, for encapsulation compounds, and more. voir moins | |
| DYHARD® DF50EP | AlzChem | DYHARD® DF50EP is a master batch of 50% DYHARD® 100SF in standard bisphenol A epoxy resin (EEW 182-192). Products of the DYHARD® master batches are widely used for all kinds of one component thermosetting epoxy resin formulations | |
| DYHARD® Fluid 111 | AlzChem | DYHARD® Fluid 111 is a liquid latent curing agent for thermosetting epoxy resin formulations. | |
| DYHARD® Fluid 212 | AlzChem | DYHARD® Fluid 212 is a liquid latent curing agent. It features a long pot life in the impregnation bath, a rapid cure at 120ºC, optical clearness, and high transparency. This makes it ideal for use in filament winding applications. | |
| DYHARD® MCA10 | AlzChem | DYHARD® MCA10 is a special formulated curing agent for low temperature cure, or very fast cure at standard cure temperatures. A formulated 1K-Epoxy resins system with DYHARD® MCA10 still has an acceptable long latency of a few weeks at room temperature. | |
| DYHARD® MCA30 | AlzChem | DYHARD® MCA30 is a non toxic, special formulated curing agent for low temperature cure, high gloss epoxy powder coatings. | |
| DYHARD® MI-C | AlzChem | DYHARD® MI-C is used as a very active but also reasonably latent accelerator in thermosetting epoxy resin formulations. It is typically used for fast curing, or low temperature cure, resin systems with low latency requirements. | |
| DYHARD® MI-FF | AlzChem | DYHARD® MI-FF is used as a very active but also reasonably latent accelerator in thermosetting epoxy resin formulations. It is typically used for fast curing, or low temperature cure, resin systems with low latency requirements. | |
| DYHARD® MIA5 | AlzChem | DYHARD® MIA5 is used as a very active but also reasonably latent accelerator in thermosetting epoxy resin formulations. It’s use is particularly suited in combination with micronized dicyandiamide from the DYHARD® CU-Line, or with the dicyandiamide master...voir plus DYHARD® MIA5 is used as a very active but also reasonably latent accelerator in thermosetting epoxy resin formulations. It’s use is particularly suited in combination with micronized dicyandiamide from the DYHARD® CU-Line, or with the dicyandiamide master batches from the DYHARD® MB-Line. voir moins | |
| DYHARD® OTB | AlzChem | DYHARD® OTB represents a medium reactive curing agent for high gloss epoxy powder coatings. With it’s ideal distribution properties in epoxy resins high quality finishes at low curing temperatures are provided. | |
| DYHARD® PI | AlzChem | DYHARD® PI represents an imidazole based accelerator and/or hardener for thermosetting epoxy resin systems. It has a larger particle size than DYHARD® PI-FF, which is more suitable where lower reactiviy's are needed. | |
| DYHARD® PI-FF | AlzChem | DYHARD® PI-FF represents an imidazole based accelerator and/or hardener for thermosetting epoxy resin systems. DYHARD® PI-FF has a smaller particle size than DYHARD® PI and hence is more suitable where higher reactivity's are needed. | |
| DYHARD® PIN | AlzChem | DYHARD® PIN represents a curing agent which is used in low gloss epoxy and epoxy-polyester hybrid powder coatings. It’s ideal distribution properties in both resin systems provides high quality finishes with a very good color stability. | |
| DYHARD® PMC | AlzChem | DYHARD® PMC represents a matt curing agent for low gloss epoxy and epoxy-polyester hybrid powder coatings. With its ideal distribution properties in both resins systems, high quality finishes with a very good color stability are provided. | |
| DYHARD® UR200 | AlzChem | DYHARD® UR200 represents a latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. | |
| DYHARD® UR300 | AlzChem | DYHARD® UR300 represents a latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. | |
| DYHARD® UR300AB | AlzChem | DYHARD® UR300AB represents a latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. | |
| DYHARD® UR400 | AlzChem | DYHARD® UR400 represents a bi-functional, micronized accelerator based on a substituted urea. Being an active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in...voir plus DYHARD® UR400 represents a bi-functional, micronized accelerator based on a substituted urea. Being an active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. voir moins | |
| DYHARD® UR500 | AlzChem | DYHARD® UR500 represents a bi-functional, micronized accelerator based on a substituted urea. Being a highly active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 ser...voir plus DYHARD® UR500 represents a bi-functional, micronized accelerator based on a substituted urea. Being a highly active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. voir moins | |
| DYHARD® UR700 | AlzChem | DYHARD® UR700 represents a highly latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. In addit...voir plus DYHARD® UR700 represents a highly latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. In addition, DYHARD® UR700 is soluble in water, which makes it a preferred accelerator for waterborne applications. voir moins | |
| DYHARD® UR800 | AlzChem | DYHARD® UR800 represents a very latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. | |
| DYHARD® URAcc13 | AlzChem | DYHARD® URAcc13 represents a formulated latent, micronized accelerator based on a substituted urea. Being an active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 ser...voir plus DYHARD® URAcc13 represents a formulated latent, micronized accelerator based on a substituted urea. Being an active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. voir moins | |
| DYHARD® URAcc57 | AlzChem | DYHARD® URAcc57 represents a latent, micronized accelerator based on a substituted urea. Being a very highly active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 ser...voir plus DYHARD® URAcc57 represents a latent, micronized accelerator based on a substituted urea. Being a very highly active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. voir moins | |
| NexSil™ 12 | Nyacol Nano Technology | NexSil™ 12 is an alkaline dispersion of 12 nm colloidal silica at 30% SiO2 concentration in water. The product can be used in a wide variety of applications such as precision investment casting, precision polishing, metal surface treatment, textile treatm...voir plus NexSil™ 12 is an alkaline dispersion of 12 nm colloidal silica at 30% SiO2 concentration in water. The product can be used in a wide variety of applications such as precision investment casting, precision polishing, metal surface treatment, textile treatment, catalyst binder and more. voir moins | |
| NexSil™ 125-40 | Nyacol Nano Technology | NexSil™ 125-40 is an alkaline dispersion of 70 - 90 nm colloidal silica at a 40% SiO2 concentration in water. The product can be used in paper, steel and precision polishing applications where large particle size colloidal silica is required and as an ant...voir plus NexSil™ 125-40 is an alkaline dispersion of 70 - 90 nm colloidal silica at a 40% SiO2 concentration in water. The product can be used in paper, steel and precision polishing applications where large particle size colloidal silica is required and as an anti-slip coating. voir moins | |
| NexSil™ 125A | Nyacol Nano Technology | NexSil™ 125A is an acidic dispersion of 60 - 80 nm colloidal silica at a 30% SiO2 concentration in water. The product can be used in paper, steel, and precision polishing applications where large-particle size colloidal silica is required. | |
| NexSil™ 125K-40 | Nyacol Nano Technology | NexSil™ 125K-40 is a colloidal silica at a 40% SiO2 concentration in water. A large particle product, it is primarily intended as an abrasive for formulated polishing slurries. | |
| NexSil™ 125NH4 | Nyacol Nano Technology | NexSil™ 125NH4 is an ammonia-stabilized, aqueous dispersion of 85 nm colloidal silica at a 40% SiO2 concentration in water. This product has applications in surface modifications for cardboard coatings, anti-blocking effects for films and coatings, among ...voir plus NexSil™ 125NH4 is an ammonia-stabilized, aqueous dispersion of 85 nm colloidal silica at a 40% SiO2 concentration in water. This product has applications in surface modifications for cardboard coatings, anti-blocking effects for films and coatings, among others. voir moins | |
| NexSil™ 12HS | Nyacol Nano Technology | NexSil™ 12HS is an alkaline dispersion of 12 nm colloidal silica at 40% SiO2 concentration in water. The product can be used in a wide variety of applications such as precision investment casting, metal surface treatment, textile treatment, catalyst binde...voir plus NexSil™ 12HS is an alkaline dispersion of 12 nm colloidal silica at 40% SiO2 concentration in water. The product can be used in a wide variety of applications such as precision investment casting, metal surface treatment, textile treatment, catalyst binder or other applications where a very small particle size colloidal silica is required. voir moins | |
| NexSil™ 20 | Nyacol Nano Technology | NexSil™ 20 is an alkaline dispersion of 20 nm colloidal silica at 40% SiO2 concentration in water. The product can be used in a wide variety of applications such as precision investment casting, precision polishing, metal surface treatment, textile treatm...voir plus NexSil™ 20 is an alkaline dispersion of 20 nm colloidal silica at 40% SiO2 concentration in water. The product can be used in a wide variety of applications such as precision investment casting, precision polishing, metal surface treatment, textile treatment, catalyst binder or other applications where a small particle size colloidal silica is required. voir moins | |
| NexSil™ 20A | Nyacol Nano Technology | NexSil™ 20A is an acidic dispersion of 20 nm colloidal silica at 30% concentration. The product is used as a low sodium colloidal silica binder in investment casting and fibrous refractory applications, to formulate catalyst support structures, and for us...voir plus NexSil™ 20A is an acidic dispersion of 20 nm colloidal silica at 30% concentration. The product is used as a low sodium colloidal silica binder in investment casting and fibrous refractory applications, to formulate catalyst support structures, and for use with trivalent chromium conversion coatings, among other applications. voir moins | |
| NexSil™ 20K-30 | Nyacol Nano Technology | NexSil™ is a potassium-stabilized alkaline dispersion of 20nm colloidal silica at 30% SiO2 concentration in water. It can be used in a wide variety of applications such as precision investment casting, precision polishing, metal surface treatment, textile...voir plus NexSil™ is a potassium-stabilized alkaline dispersion of 20nm colloidal silica at 30% SiO2 concentration in water. It can be used in a wide variety of applications such as precision investment casting, precision polishing, metal surface treatment, textile treatment, catalyst binder, or other applications where a small particle-size colloidal silica is required. voir moins | |
| NexSil™ 20NH4 | Nyacol Nano Technology | NexSil™ 20NH4 is an ammonia-stabilized alkaline dispersion of 20 nm colloidal silica at 40% SiO2 concentration in water. It can be used in a wide variety of applications such as precision investment casting, metal surface treatment, textile treatment, cat...voir plus NexSil™ 20NH4 is an ammonia-stabilized alkaline dispersion of 20 nm colloidal silica at 40% SiO2 concentration in water. It can be used in a wide variety of applications such as precision investment casting, metal surface treatment, textile treatment, catalyst binder or other applications. voir moins | |
| NexSil™ 35A | Nyacol Nano Technology | NexSil™ 35A is an acidic colloidal silica dispersion of 35nm collidal silica at 30% SIO2 concentration in water. This product is used in binders, cardboard coatings, films, coatings, catalyst production, and precision polishing of semiconductor substrates...voir plus NexSil™ 35A is an acidic colloidal silica dispersion of 35nm collidal silica at 30% SIO2 concentration in water. This product is used in binders, cardboard coatings, films, coatings, catalyst production, and precision polishing of semiconductor substrates. voir moins | |
| NexSil™ 6 | Nyacol Nano Technology | NexSil™ 6 is an alkaline dispersion of 6 nm colloidal silica at a 16-18% SiO2 concentration in water. It can be used in paper, steel, and precision polishing applications as well. | |
| NexSil™ 8 | Nyacol Nano Technology | NexSil™ 8 is an alkaline dispersion of 8 nm colloidal silica at 30% SiO2 concentration in water. The product can be used in a wide variety of applications such as precision investment casting, metal surface treatment, textile treatment, catalyst binder or...voir plus NexSil™ 8 is an alkaline dispersion of 8 nm colloidal silica at 30% SiO2 concentration in water. The product can be used in a wide variety of applications such as precision investment casting, metal surface treatment, textile treatment, catalyst binder or other applications where a very small particle size colloidal silica is required. voir moins | |
| NexSil™ 85-40 | Nyacol Nano Technology | NexSil™ 85-40 is an alkaline dispersion of 40-60 nm colloidal silica at a 40% SiO2 concentration in water. The product is used in paper, steel and precision polishing applications as well as specialty wafer polishing applications. | |
| NexSil™ 85A | Nyacol Nano Technology | NexSil™ 85A is an acidic dispersion of 40 - 60 nm colloidal silica at a 30% SiO2 concentration in water. The product can be used in paper, steel, and precision polishing applications. | |
| NexSil™ 85K-40 | Nyacol Nano Technology | NexSil™ 85K-40 is a colloidal silica of 50 nm colloidal silica at a 40% SiO2 concentration in water. This product is used as an abrasive for formulated polishing slurries. | |
| NexSil™ 85NH4 | Nyacol Nano Technology | NexSil™ 85NH4 is an ammonia-stabilized alkaline dispersion of 85 nm colloidal silica at 40% SiO2 concentration in water with low alkali metal levels. It is used in a wide variety of applications such as paper, steel and precision polishing applications. | |
| Nyacol ® DP5540 | Nyacol Nano Technology | Nyacol DP5540, colloidal silica in ethylene glycol, is a dispersion of nano-sized silica particles with a particle size between 100 and 120 nm. It is used in abrasion resistance and anti-blocking properties for PET film. | |
| Nyacol ® DP5480 | Nyacol Nano Technology | Nyacol DP5480, Colloidal Silica in Ethylene Glycol, are Silica particles with a particle size of 50nm colloidal silica at a 30% SiO2 concentration in water. The polymer-grade EG provides abrasion resistance and anti-blocking properties for PET film. | |
| Nyacol® DP5820 | Nyacol Nano Technology | Nycaol® DP5820, Colloidal Silica in Ethylene Glycol, is an ethylene glycol silica additive with a particle size of 20nm. This product is developed to provide anti-block and abrasion resistance properties to polyester film and tape. | |
| Nyacol® A1530 | Nyacol Nano Technology | Nyacol® A1530 is a water-based dispersion of 30nm particle antimony at 29% Antimony Pentoxide. It is used in the flame retardant treatments of materials such as textiles, nonwovens, adhesive latices, and coatings. | |
| Nyacol® A1540N | Nyacol Nano Technology | Nyacol® A1540N is a water-based dispersion of 30nm particle antimony at 38% Antimony Pentoxide. It is used in the flame retardant treatments of materials such as textiles, nonwovens, adhesive latices, and coatings. | |
| Nyacol® A1550 | Nyacol Nano Technology | Nyacol® A1550 is a water-based dispersion of 30nm particle antimony at 48% Antimony Pentoxide and a pH of 5. It is used in the flame retardant treatments of materials such as textiles, nonwovens, adhesive latices, and coatings. | |
| Nyacol® A1550pH7 | Nyacol Nano Technology | Nyacol® A1550pH7 is a water-based dispersion of 30nm particle antimony at 48% Antimony Pentoxide and a pH of 7. It is used in the flame retardant treatments of DMAC solvent systems. | |
| Nyacol® AB40 | Nyacol Nano Technology | Nyacol® AB40 is a nonaqueous dispersion of colloidal antimony peroxide with a specific gravity of 1.67. It is used as a flame retardant synergist in halogen containing polyester and vinyl ester resins. | |
| Nyacol® AL20 | Nyacol Nano Technology | Nyacol® AL20 Colloidal Alumina, a high temperature coating/binder, is a water-based dispersion of particle size 60-90nm at 20% Aluminum content. It is used within high-temperature binders for refractories and ceramics. | |
| Nyacol® APE1540 | Nyacol Nano Technology | Nyacol® APE1540 is a nonaqueous dispersion of colloidal antimony peroxide with a specific gravity of 1.70. It is used as a flame retardant synergist in halogen containing polyester and vinyl ester resins. | |
| Nyacol® APE3040 | Nyacol Nano Technology | Nyacol® APE3040 is a nonaqueous dispersion of colloidal antimony pentoxide formulated for use as a flame retardant synergist in halogen-containing vinyl ester and unsaturated polyester resins. It can replace antimony trioxide in formulas containing bromin...voir plus Nyacol® APE3040 is a nonaqueous dispersion of colloidal antimony pentoxide formulated for use as a flame retardant synergist in halogen-containing vinyl ester and unsaturated polyester resins. It can replace antimony trioxide in formulas containing bromine or chlorine and can be used in textiles, adhesives, coatings, and water-based systems. voir moins | |
| Nyacol® CeO2 | Nyacol Nano Technology | Nyacol® CeO2 is cerium oxide. This product is designed for use in automotive and other catalyst production. Nyacol® CeO2 is used in glass polishing and coating applications. | |
| NYACOL® DP6095 | Nyacol Nano Technology | NYACOL® DP6095 is a sub-micron calcium carbonate dispersion in ethylene glycol recommended for use as an additive in PET for film or fiber production. | |
| Nyagraph ® 249 | Nyacol Nano Technology | Nyagraph® 249 is a natural material based on the processing of graphite ore. This product is an intumescent flame retardant used in sealants, bitumens, rubbers, adhesives, and coatings. | |
| Nyagraph® 200 | Nyacol Nano Technology | Nyagraph® 200 is a natural material based on the processing of graphite ore with a fine particle size of 80%>180 microns. This product is an intumescent flame retardant used in sealants, adhesives, and coatings and has applications in soft ash, plastic. | |
| Nyagraph® 250 | Nyacol Nano Technology | Nyagraph® 250 is a natural material based on the processing of graphite ore with an expansion volume of >250cm3/g. This product is an intumescent flame retardant used in sealants, bitumens, rubbers, adhesives, and coatings. | |
| Nyagraph® 251 | Nyacol Nano Technology | Nyagraph® 251 is a natural material based on the processing of graphite ore with a minimum of 250ml/g. This product is an intumescent flame retardant used in sealants, bitumens, rubbers, adhesives, and coatings. | |
| Nyagraph® 35 | Nyacol Nano Technology | Nyagraph® 35 is a natural material based on the processing of graphite ore with an expansion volume of ≥35cm3/g. This product is an intumescent flame retardant used in sealants, bitumens, rubbers, adhesives, and coatings. | |
| Nyagraph® 351 | Nyacol Nano Technology | Nyagraph® 351 is a natural material based on the processing of graphite ore with an expansion volume of 330-350cm3/g. This product is an intumescent flame retardant used in sealants, bitumens, rubbers, adhesives, and coatings. | |
| Nyagraph® FP | Nyacol Nano Technology | Nyagraph® FP is a natural material based on the processing of graphite ore with an expansion volume of ≥230cm3/g. This product is used in sealants, bitumens, rubbers, adhesives, and coatings. | |
| Nyagraph® KP251 | Nyacol Nano Technology | Nyagraph® KP251 is a natural material based on the processing of graphite ore with an expansion volume of ≥230cm3/g and soft ash, low initial expansion temperature, and low sulfur. This product is used in sealants, bitumens, rubbers, adhesives, and coatin...voir plus Nyagraph® KP251 is a natural material based on the processing of graphite ore with an expansion volume of ≥230cm3/g and soft ash, low initial expansion temperature, and low sulfur. This product is used in sealants, bitumens, rubbers, adhesives, and coatings. voir moins | |
| Nyasil™ 20 | Nyacol Nano Technology | Nyasil™ 20, a nano-structured amorphous silica powder, is an ethylene glycol silica additive with a mean particle diameter of 20μm. This product is used with polyester film and tape. | |
| Nyasil™ 5 | Nyacol Nano Technology | Nyasil™ 5 is an amorphous silica ethylene glycol silica additive with a particle size of 2.0µm. This product is used with polyester film and tape. | |
| Nyasil™ 6200 | Nyacol Nano Technology | Nyasil™ 6200, amorphous silica, ethylene glycol silica additive with a mean particle diameter of 1.5µm. This product is used with polyster film and tape. | |
| Silzot® HQ plus (Powder) | AlzChem | Silzot® HQ plus (Powder) is a grey powder derived from the direct chemical reaction of silicon and nitrogen. | |
| Silzot® HQ (Powder) | AlzChem | Silzot® HQ (Powder) is a grey powder derived from the direct chemical reaction of silicon and nitrogen. | |
| Silzot® SQ | AlzChem | Silzot® SQ is a fine powder derived from the direct chemical reaction of highly purified silicon and nitrogen. | |
| Silzot® TQ (Powder) | AlzChem | Silzot® TQ (Powder) is a grey powder derived from the direct chemical reaction of silicon and nitrogen. |
