| Amicure® CG-NA Curing Agent | Evonik Operations GmbH, BL Crosslinkers | Amicure® CG-NA Curing Agent is an unpulverized grade of dicyandiamide designed for use as a latent curing agent for epoxy resins in solventbased processes. It is ideal for use in electrical laminates, and solvent-based, pre-preg composites. | Request Sample |
| AMICURE® UR Curing Agent | Evonik Operations GmbH, BL Crosslinkers | AMICURE® UR Curing Agent is a substituted urea-based accelerator (1 Phenyl 3,3 dimethyl urea) for dicyandiamide- cured epoxy resins. It combines excellent latency at ambient temperature with rapid cure in systems heated above its activation temperature. I...voir plus AMICURE® UR Curing Agent is a substituted urea-based accelerator (1 Phenyl 3,3 dimethyl urea) for dicyandiamide- cured epoxy resins. It combines excellent latency at ambient temperature with rapid cure in systems heated above its activation temperature. It is ideal for use in one-pack paste and film adhesives, heat-sure composites, and prepreg composites. voir moins | Request Sample |
| Ancamide® 220 Curing Agent | Evonik Operations GmbH, BL Crosslinkers | Ancamide® 220 Curing Agent is one in a series of standard reactive polyamides for use in the curing of epoxy resins. It has been designed particularly for use in solvent-based surface coatings. | Request Sample |
| ANCAMIDE® 220-X-70 Curing Agent | Evonik Operations GmbH, BL Crosslinkers | ANCAMIDE® 220-X-70 Curing Agent is one in a series of standard reactive polyamides intended for use in the curing of epoxy resins. It is ideal for use in solvent-based maintenance coatings, primers, sealers and coatings for concrete. | Request Sample |
| ANCAMIDE 221® Curing Agent | Evonik Operations GmbH, BL Crosslinkers | ANCAMIDE 221® Curing Agent is a member of a series of reactive polyamides developed for use in the curing of epoxy resins in solvent-based surface coatings applications. Special features include good color, color stability, chemical resistance and excelle...voir plus ANCAMIDE 221® Curing Agent is a member of a series of reactive polyamides developed for use in the curing of epoxy resins in solvent-based surface coatings applications. Special features include good color, color stability, chemical resistance and excellent corrosion resistance properties. It is freely compatible with a wide range of solvents, including those generally used in epoxy resin based coatings. voir moins | Request Sample |
| ANCAMIDE® 3201 Curing Agent | Evonik Operations GmbH, BL Crosslinkers | ANCAMIDE® 3201 Curing Agent is a low viscosity, solvent-free formulated polyaminoamide adduct. The curing agent is an accelerated version of Ancamine® 3200 and is recommended for use with liquid epoxy resin for the development of primers, coatings particu...voir plus ANCAMIDE® 3201 Curing Agent is a low viscosity, solvent-free formulated polyaminoamide adduct. The curing agent is an accelerated version of Ancamine® 3200 and is recommended for use with liquid epoxy resin for the development of primers, coatings particularly for wet and high humid application areas. In addition the curing agent can be used for high-solid coatings for corrosion protection under severe conditions. voir moins | Request Sample |
| ANCAMIDE® 400 Curing Agent | Evonik Operations GmbH, BL Crosslinkers | ANCAMIDE® 400 Curing Agent is a unique, low viscosity reactive polyamide developed specifically for use in the curing of liquid epoxy resins. It can be used in a wide range of applications, including flooring and surface coatings, adhesives, sealant and p...voir plus ANCAMIDE® 400 Curing Agent is a unique, low viscosity reactive polyamide developed specifically for use in the curing of liquid epoxy resins. It can be used in a wide range of applications, including flooring and surface coatings, adhesives, sealant and putties, castings, laminates, and cable jointing compounds. voir moins | Request Sample |
| Ancamide® 910 | Evonik Operations GmbH, BL Crosslinkers | Ancamide® 910 curing agent is a versatile, flexible hardener designed for use with liquid epoxy resin. Its engineered chemistry provides a unique combination of properties not found in other epoxy hardeners. It delivers outstanding flexibility/peel streng...voir plus Ancamide® 910 curing agent is a versatile, flexible hardener designed for use with liquid epoxy resin. Its engineered chemistry provides a unique combination of properties not found in other epoxy hardeners. It delivers outstanding flexibility/peel strength, excellent thermal shock resistance, and good electrical properties. Additional features include lower viscosity than conventional polyamides and DOT non-corrosive status. Ancamide® 910 curing agent can be used either as a sole curing agent or as a modifier. voir moins | Request Sample |
| Ancamine® 2014AS/FG | Evonik Operations GmbH, BL Crosslinkers | Ancamine® 2014AS/FG is a modified aliphatic polyamine adduct designed for use as a latent catalyst and curing agent for liquid epoxy resins. They can also be used as accelerators for dicyandiamide (DICY). This white micronised powder is applied in one-com...voir plus Ancamine® 2014AS/FG is a modified aliphatic polyamine adduct designed for use as a latent catalyst and curing agent for liquid epoxy resins. They can also be used as accelerators for dicyandiamide (DICY). This white micronised powder is applied in one-component adhesives and solvent free laminating. voir moins | Request Sample |
| Ancamine® 2337S | Evonik Operations GmbH, BL Crosslinkers | Ancamine® 2337S curing agent is a modified aliphatic amine designed for use as a latent curing agent for epoxy resins. Applications for this product include one-component conduction or induction heat-cure adhesives, potting, coatings, and hot-melt prepreg...voir plus Ancamine® 2337S curing agent is a modified aliphatic amine designed for use as a latent curing agent for epoxy resins. Applications for this product include one-component conduction or induction heat-cure adhesives, potting, coatings, and hot-melt prepregs. This product is a light yellow powder. voir moins | Request Sample |
| Ancamine® 2441 Curing Agent | Evonik Operations GmbH, BL Crosslinkers | Ancamine® 2441 curing agent is a modified polyamine which was designed for use as a latent curing agentfor onecomponent adhesive formulations. The product can also be used as an accelerator fordicyandiamide (dicy). Its combinatio...voir plus Ancamine® 2441 curing agent is a modified polyamine which was designed for use as a latent curing agentfor onecomponent adhesive formulations. The product can also be used as an accelerator fordicyandiamide (dicy). Its combination of low temperature activation, good shelf life and high glass transitiontemperature permits use in many applications requiring latency and high performance. voir moins | Request Sample |
| Ancamine® 2442 Curing Agent | Evonik Operations GmbH, BL Crosslinkers | Ancamine® 2442 curing agent is a modified polyamine designed for use as a latent curing agent for one-component epoxy formulations. The product can also be used to accelerate dicyandiamide (DICY). It provides an excellent balance of low-temp...voir plus Ancamine® 2442 curing agent is a modified polyamine designed for use as a latent curing agent for one-component epoxy formulations. The product can also be used to accelerate dicyandiamide (DICY). It provides an excellent balance of low-temperature activation, good shelf stability and high glass transition temperature, and can be used in many applications requiring latency and high performance. voir moins | Request Sample |
| DYHARD® 100 | AlzChem | DYHARD® 100 is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations...voir plus DYHARD® 100 is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat. voir moins | |
| DYHARD® 100M | AlzChem | DYHARD® 100M is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomeration...voir plus DYHARD® 100M is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat. voir moins | |
| DYHARD® 100S | AlzChem | DYHARD® 100S is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomeration...voir plus DYHARD® 100S is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat. voir moins | |
| DYHARD® 100SF | AlzChem | DYHARD® 100SF is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomeratio...voir plus DYHARD® 100SF is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat. voir moins | |
| DYHARD® 100SH | AlzChem | DYHARD® 100SH is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomeratio...voir plus DYHARD® 100SH is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat. voir moins | |
| DYHARD® CAAB | AlzChem | DYHARD® CAAB is a curing agent for matt finish powder coatings based on epoxy or epoxy-polyester hybrid formulations. Usually it is used together with DYHARD® PIN to realize these matt finishes. For low gloss applications the optimal mixing ratio between ...voir plus DYHARD® CAAB is a curing agent for matt finish powder coatings based on epoxy or epoxy-polyester hybrid formulations. Usually it is used together with DYHARD® PIN to realize these matt finishes. For low gloss applications the optimal mixing ratio between DYHARD® PIN and DYHARD® CAAB is 45:55. This ideal mixture is also available in the ready to use premix DYHARD® PMC for an easy handling. voir moins | |
| DYHARD® D50EP | AlzChem | DYHARD® D50EP is a master batch of 50% DYHARD® 100S in standard bisphenol A epoxy resin (EEW 182-192). Advantages include a dust-free production environment, as well as easier dosage and incorporation. It is cost-effective due to easy handling, and offers...voir plus DYHARD® D50EP is a master batch of 50% DYHARD® 100S in standard bisphenol A epoxy resin (EEW 182-192). Advantages include a dust-free production environment, as well as easier dosage and incorporation. It is cost-effective due to easy handling, and offers the same reactivity, latency, and mechanical properties as the DYHARD® 100 series. This product is recommended for one-component thermosetting epoxy resin formulations for the automotive, sporting goods, and aerospace industry, for adhesives, for encapsulation compounds, and more. voir moins | |
| DYHARD® DF50EP | AlzChem | DYHARD® DF50EP is a master batch of 50% DYHARD® 100SF in standard bisphenol A epoxy resin (EEW 182-192). Products of the DYHARD® master batches are widely used for all kinds of one component thermosetting epoxy resin formulations | |
| DYHARD® Fluid 111 | AlzChem | DYHARD® Fluid 111 is a liquid latent curing agent for thermosetting epoxy resin formulations. | |
| DYHARD® Fluid 212 | AlzChem | DYHARD® Fluid 212 is a liquid latent curing agent. It features a long pot life in the impregnation bath, a rapid cure at 120ºC, optical clearness, and high transparency. This makes it ideal for use in filament winding applications. | |
| DYHARD® MCA10 | AlzChem | DYHARD® MCA10 is a special formulated curing agent for low temperature cure, or very fast cure at standard cure temperatures. A formulated 1K-Epoxy resins system with DYHARD® MCA10 still has an acceptable long latency of a few weeks at room temperature. | |
| DYHARD® MCA30 | AlzChem | DYHARD® MCA30 is a non toxic, special formulated curing agent for low temperature cure, high gloss epoxy powder coatings. | |
| DYHARD® MI-C | AlzChem | DYHARD® MI-C is used as a very active but also reasonably latent accelerator in thermosetting epoxy resin formulations. It is typically used for fast curing, or low temperature cure, resin systems with low latency requirements. | |
| DYHARD® MI-FF | AlzChem | DYHARD® MI-FF is used as a very active but also reasonably latent accelerator in thermosetting epoxy resin formulations. It is typically used for fast curing, or low temperature cure, resin systems with low latency requirements. | |
| DYHARD® MIA5 | AlzChem | DYHARD® MIA5 is used as a very active but also reasonably latent accelerator in thermosetting epoxy resin formulations. It’s use is particularly suited in combination with micronized dicyandiamide from the DYHARD® CU-Line, or with the dicyandiamide master...voir plus DYHARD® MIA5 is used as a very active but also reasonably latent accelerator in thermosetting epoxy resin formulations. It’s use is particularly suited in combination with micronized dicyandiamide from the DYHARD® CU-Line, or with the dicyandiamide master batches from the DYHARD® MB-Line. voir moins | |
| DYHARD® OTB | AlzChem | DYHARD® OTB represents a medium reactive curing agent for high gloss epoxy powder coatings. With it’s ideal distribution properties in epoxy resins high quality finishes at low curing temperatures are provided. | |
| DYHARD® PI | AlzChem | DYHARD® PI represents an imidazole based accelerator and/or hardener for thermosetting epoxy resin systems. It has a larger particle size than DYHARD® PI-FF, which is more suitable where lower reactiviy's are needed. | |
| DYHARD® PI-FF | AlzChem | DYHARD® PI-FF represents an imidazole based accelerator and/or hardener for thermosetting epoxy resin systems. DYHARD® PI-FF has a smaller particle size than DYHARD® PI and hence is more suitable where higher reactivity's are needed. | |
| DYHARD® PIN | AlzChem | DYHARD® PIN represents a curing agent which is used in low gloss epoxy and epoxy-polyester hybrid powder coatings. It’s ideal distribution properties in both resin systems provides high quality finishes with a very good color stability. | |
| DYHARD® PMC | AlzChem | DYHARD® PMC represents a matt curing agent for low gloss epoxy and epoxy-polyester hybrid powder coatings. With its ideal distribution properties in both resins systems, high quality finishes with a very good color stability are provided. | |
| DYHARD® UR200 | AlzChem | DYHARD® UR200 represents a latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. | |
| DYHARD® UR300 | AlzChem | DYHARD® UR300 represents a latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. | |
| DYHARD® UR300AB | AlzChem | DYHARD® UR300AB represents a latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. | |
| DYHARD® UR400 | AlzChem | DYHARD® UR400 represents a bi-functional, micronized accelerator based on a substituted urea. Being an active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in...voir plus DYHARD® UR400 represents a bi-functional, micronized accelerator based on a substituted urea. Being an active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. voir moins | |
| DYHARD® UR500 | AlzChem | DYHARD® UR500 represents a bi-functional, micronized accelerator based on a substituted urea. Being a highly active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 ser...voir plus DYHARD® UR500 represents a bi-functional, micronized accelerator based on a substituted urea. Being a highly active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. voir moins | |
| DYHARD® UR700 | AlzChem | DYHARD® UR700 represents a highly latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. In addit...voir plus DYHARD® UR700 represents a highly latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. In addition, DYHARD® UR700 is soluble in water, which makes it a preferred accelerator for waterborne applications. voir moins | |
| DYHARD® UR800 | AlzChem | DYHARD® UR800 represents a very latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. | |
| DYHARD® URAcc13 | AlzChem | DYHARD® URAcc13 represents a formulated latent, micronized accelerator based on a substituted urea. Being an active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 ser...voir plus DYHARD® URAcc13 represents a formulated latent, micronized accelerator based on a substituted urea. Being an active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. voir moins | |
| DYHARD® URAcc57 | AlzChem | DYHARD® URAcc57 represents a latent, micronized accelerator based on a substituted urea. Being a very highly active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 ser...voir plus DYHARD® URAcc57 represents a latent, micronized accelerator based on a substituted urea. Being a very highly active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. voir moins | |
| IMICURE® AMI-1 Curing Agent | Evonik Operations GmbH, BL Crosslinkers | IMICURE® AMI-1 Curing Agent is a liquid, elevated-temperature curing agent for epoxy resins. It is readily compatible with both liquid and solid epoxy resins, and because it is a catalytic curing agent, it is used at low loadings of 1−5 phr. It is ideal f...voir plus IMICURE® AMI-1 Curing Agent is a liquid, elevated-temperature curing agent for epoxy resins. It is readily compatible with both liquid and solid epoxy resins, and because it is a catalytic curing agent, it is used at low loadings of 1−5 phr. It is ideal for use in adhesives, pre-preg composites, and encapsulation. voir moins | Request Sample |
| IMICURE® AMI-2T Curing Agent | Evonik Operations GmbH, BL Crosslinkers | IMICURE® AMI-2T Curing Agent is an elevated temperature curing agent for epoxy systems. It is readily compatible with both liquid and solid epoxy resins, and because it is a catalytic curing agent, it is used at low loadings of 1−5 phr. It is a good accel...voir plus IMICURE® AMI-2T Curing Agent is an elevated temperature curing agent for epoxy systems. It is readily compatible with both liquid and solid epoxy resins, and because it is a catalytic curing agent, it is used at low loadings of 1−5 phr. It is a good accelerator for dicyandiamide, anhydride and phenolic curing agents. It is ideal for use in electrical laminates, adhesives, pre-preg composites, and encapsulation. voir moins | Request Sample |
| IMICURE® EMI-24 Curing Agent | Evonik Operations GmbH, BL Crosslinkers | IMICURE® EMI-24 Curing Agent is a high-reactivity, medium-viscosity liquid imidazole used alone or to accelerate dicyandiamide or anhydride cures. Used in filament winding, electrical laminates, molding powders, one-component adhesives, and structural adh...voir plus IMICURE® EMI-24 Curing Agent is a high-reactivity, medium-viscosity liquid imidazole used alone or to accelerate dicyandiamide or anhydride cures. Used in filament winding, electrical laminates, molding powders, one-component adhesives, and structural adhesives. voir moins | Request Sample |
| IMICURE® Imidazole Curing Agent | Evonik Operations GmbH, BL Crosslinkers | IMICURE® Imidazole Curing Agent is an elevated-temperature curing agent for epoxy resins. It is readily compatible with both liquid and solid epoxy resins, and because it is a catalytic curing agent, it is used at low loadings of 1−5 phr. It is a good acc...voir plus IMICURE® Imidazole Curing Agent is an elevated-temperature curing agent for epoxy resins. It is readily compatible with both liquid and solid epoxy resins, and because it is a catalytic curing agent, it is used at low loadings of 1−5 phr. It is a good accelerator for dicyandiamide, anhydride and phenolic curing agents. voir moins | Request Sample |
| NOURYBOND® 289 Adhesion Promoter | Evonik Operations GmbH, BL Crosslinkers | NOURYBOND® 289 Adhesion Promoter is a blocked isocyanate PVC plastisol adhesion promoter for use in automotive sealants applied to visible areas and anti-chip primers. | Request Sample |
| Silzot® HQ plus (Powder) | AlzChem | Silzot® HQ plus (Powder) is a grey powder derived from the direct chemical reaction of silicon and nitrogen. | |
| Silzot® HQ (Powder) | AlzChem | Silzot® HQ (Powder) is a grey powder derived from the direct chemical reaction of silicon and nitrogen. | |
| Silzot® SQ | AlzChem | Silzot® SQ is a fine powder derived from the direct chemical reaction of highly purified silicon and nitrogen. | |
| Silzot® TQ (Powder) | AlzChem | Silzot® TQ (Powder) is a grey powder derived from the direct chemical reaction of silicon and nitrogen. | |
| VESTALITE® S 101 | Evonik Operations GmbH, BL Crosslinkers | VESTALITE® S 101 is a curing agent for epoxy resin matrix designed for SMC applications. Systems using VESTALITE® S 101 have a low initial viscosity during compounding, allowing excellent fiber wetting, highfiber volume fraction and efficient process...voir plus VESTALITE® S 101 is a curing agent for epoxy resin matrix designed for SMC applications. Systems using VESTALITE® S 101 have a low initial viscosity during compounding, allowing excellent fiber wetting, highfiber volume fraction and efficient processing. The high reactivity of the hardener allows fast curing inabout 4 - 5 min at 150 °. voir moins | Request Sample |
| VESTALITE® S 102 | Evonik Operations GmbH, BL Crosslinkers | VESTALITE® S 102 is a curing agent for epoxy resin matrix designed for SMC applications. Systems using VESTALITE® S 102 have a low initial viscosity during compounding, allowing excellent fiber wetting, high fiber volume fraction and efficient processing....voir plus VESTALITE® S 102 is a curing agent for epoxy resin matrix designed for SMC applications. Systems using VESTALITE® S 102 have a low initial viscosity during compounding, allowing excellent fiber wetting, high fiber volume fraction and efficient processing. The high reactivity of the hardener allows fast curing in about3 min at 150 °C. voir moins | Request Sample |
