| COPONYL™ 5065 | Nippon Gohsei | COPONYL™ 5065 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides high-speed peeling characteristics and is residue free. Applications include masking tapes and protective masking...voir plus COPONYL™ 5065 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides high-speed peeling characteristics and is residue free. Applications include masking tapes and protective masking films. This product is well suited for use in electronics and adhesives. voir moins | |
| COPONYL™ 5411 | Nippon Gohsei | COPONYL™ 5411 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides permanent adhesion, and is suitable for thick-layer application. Applications include double-sided tapes and foam...voir plus COPONYL™ 5411 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides permanent adhesion, and is suitable for thick-layer application. Applications include double-sided tapes and foam tapes. This product is well suited for use in electronics and adhesives. voir moins | |
| COPONYL™ 5560 | Nippon Gohsei | COPONYL™ 5560 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and isopropyl alcohol solvents. It is a one-component cross-linkage product. Applications include films and labels. This product is well ...voir plus COPONYL™ 5560 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and isopropyl alcohol solvents. It is a one-component cross-linkage product. Applications include films and labels. This product is well suited for use in adhesives. voir moins | |
| COPONYL™ 5672 | Nippon Gohsei | COPONYL™ 5672 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides strong adhesion and good removability. Applications include films and labels, masking tapes, and protective maski...voir plus COPONYL™ 5672 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides strong adhesion and good removability. Applications include films and labels, masking tapes, and protective masking films. This product is well suited for use in electronics and adhesives. voir moins | |
| COPONYL™ 5697 | Nippon Gohsei | COPONYL™ 5697 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It is a general use hard-type resin used in PVC backing materials. This product is well suited for use in adhesives. | |
| COPONYL™ 5698 | Nippon Gohsei | COPONYL™ 5698 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It is a general use soft-type resin used in PVC backing materials. This product is well suited for use in adhesives. | |
| COPONYL™ 5705L | Nippon Gohsei | COPONYL™ 5705L is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides strong adhesion and low tack. Applications include masking tapes and protective masking films. This product is w...voir plus COPONYL™ 5705L is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides strong adhesion and low tack. Applications include masking tapes and protective masking films. This product is well suited for use in electronics and adhesives. voir moins | |
| COPONYL™ 5706-A | Nippon Gohsei | COPONYL™ 5706-A is a pressure sensitive adhesive resin formulated from acrylic acid ester using toluene and cellosolve solvents. It is ideal for screen coatings. This product is well suited for use in adhesives. | |
| COPONYL™ 5740 | Nippon Gohsei | COPONYL™ 5740 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides slight adhesion, good removability, heat resistance, and is residue free. Applications include masking tapes, pro...voir plus COPONYL™ 5740 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides slight adhesion, good removability, heat resistance, and is residue free. Applications include masking tapes, protective masking films, and processing. This product is well suited for use in electronics and adhesives. voir moins | |
| COPONYL™ 8065 | Nippon Gohsei | COPONYL™ 8065 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. This product is well suited for use in adhesives in medical applications such as fixing tapes for cataplasm and elastics. | |
| COPONYL™ 8137 | Nippon Gohsei | COPONYL™ 8137 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides good adhesion at low temperatures. Applications include films and labels. This product is well suited for use in ...voir plus COPONYL™ 8137 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides good adhesion at low temperatures. Applications include films and labels. This product is well suited for use in adhesives. voir moins | |
| COPONYL™ 8694 | Nippon Gohsei | COPONYL™ 8694 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides strong adhesion and good removability. Applications include films and labels, masking tapes, and protective maski...voir plus COPONYL™ 8694 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides strong adhesion and good removability. Applications include films and labels, masking tapes, and protective masking films. This product is well suited for use in adhesives. voir moins | |
| COPONYL™ 8700 | Nippon Gohsei | COPONYL™ 8700 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It has good adhesion to olefin and is suitable for short-aging time. Applications include double-sided tapes and foam tapes. ...voir plus COPONYL™ 8700 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It has good adhesion to olefin and is suitable for short-aging time. Applications include double-sided tapes and foam tapes. This product is well suited for use in adhesives. voir moins | |
| COPONYL™ 8708 | Nippon Gohsei | COPONYL™ 8708 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides good adhesion at low temperature. Applications include double-sided tapes and foam tapes. This product is well su...voir plus COPONYL™ 8708 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides good adhesion at low temperature. Applications include double-sided tapes and foam tapes. This product is well suited for use in electronics and adhesives. voir moins | |
| COPONYL™ 8711 | Nippon Gohsei | COPONYL™ 8711 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It has good processability and heat resistance. Applications include double-sided tapes and foam tapes. This product is well ...voir plus COPONYL™ 8711 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It has good processability and heat resistance. Applications include double-sided tapes and foam tapes. This product is well suited for use in electronics and adhesives. voir moins | |
| COPONYL™ 8815 | Nippon Gohsei | COPONYL™ 8815 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides good removability, is residue free, and has weather resistance properties. Applications include masking tapes and...voir plus COPONYL™ 8815 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides good removability, is residue free, and has weather resistance properties. Applications include masking tapes and protective masking films. This product is well suited for use in electronics and adhesives. voir moins | |
| COPONYL™ 8976L | Nippon Gohsei | COPONYL™ 8976L is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides good heat resistance. Applications include films and labels. This product is well suited for use in adhesives. | |
| COPONYL™ N-2031 | Nippon Gohsei | COPONYL™ N-2031 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. This product provides different levels of adhesive properties depending on temperature. Applications include masking tapes ...voir plus COPONYL™ N-2031 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. This product provides different levels of adhesive properties depending on temperature. Applications include masking tapes and protective masking films. This product is well suited for use in electronics and adhesives. voir moins | |
| COPONYL™ N-2147 | Nippon Gohsei | COPONYL™ N-2147 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides heat resistance, dimension stability, and is suitable for window film. Applications include films and labels, P...voir plus COPONYL™ N-2147 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides heat resistance, dimension stability, and is suitable for window film. Applications include films and labels, PVC backing materials, and optical. This product is well suited for use in electronics and adhesives. voir moins | |
| COPONYL™ N-2260 | Nippon Gohsei | COPONYL™ N-2260 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides low adhesion, high tack, is heat resistant, and residue free. Applications include masking tapes, protective ma...voir plus COPONYL™ N-2260 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides low adhesion, high tack, is heat resistant, and residue free. Applications include masking tapes, protective masking films, and processing. This product is well suited for use in electronics and adhesives. voir moins | |
| COPONYL™ N-2332 | Nippon Gohsei | COPONYL™ N-2332 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. The characteristics of this product are low adherence and soft type. This product is well suited for use in adhesives for m...voir plus COPONYL™ N-2332 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. The characteristics of this product are low adherence and soft type. This product is well suited for use in adhesives for medical applications. voir moins | |
| COPONYL™ N-2584 | Nippon Gohsei | COPONYL™ N-2584 is a pressure-sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and methanol solvents. It is alkaline soluble and suitable for splicing labels and paper. This product is well suited for use in adhesi...voir plus COPONYL™ N-2584 is a pressure-sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and methanol solvents. It is alkaline soluble and suitable for splicing labels and paper. This product is well suited for use in adhesive labels and films. voir moins | |
| COPONYL™ N-3449L | Nippon Gohsei | COPONYL™ N-3449L is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and acetone solvents. It provides good adhesion to olefin. Applications include masking tapes and protective masking films. This produ...voir plus COPONYL™ N-3449L is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and acetone solvents. It provides good adhesion to olefin. Applications include masking tapes and protective masking films. This product is well suited for use in adhesives. voir moins | |
| COPONYL™ N-3483 | Nippon Gohsei | COPONYL™ N-3483 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. Applications include masking tapes and protective masking films. This product is well suited for use in adhesives. | |
| COPONYL™ N-3495HS | Nippon Gohsei | COPONYL™ N-3495HS is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and acetone solvents. It provides good adhesion to olefin. Applications include masking tapes, protective masking films, double-sided...voir plus COPONYL™ N-3495HS is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and acetone solvents. It provides good adhesion to olefin. Applications include masking tapes, protective masking films, double-sided tapes, and foam tapes. This product is well suited for use in electronics and adhesives. voir moins | |
| COPONYL™ N-3581 | Nippon Gohsei | COPONYL™ N-3581 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It has good wettability, and good adhesion to rough surfaces. Applications include masking tapes, protective masking films,...voir plus COPONYL™ N-3581 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It has good wettability, and good adhesion to rough surfaces. Applications include masking tapes, protective masking films, and processing. This product is well suited for use in electronics and adhesives. voir moins | |
| COPONYL™ N-3816E | Nippon Gohsei | COPONYL™ N-3816E is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It has good durability and is suitable for optical film applications. This product is well suited for use in electronics and adhesives. | |
| COPONYL™ N-3933E | Nippon Gohsei | COPONYL™ N-3933E is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides good adhesion for rounded surfaces and labels for refrigerated food. Applications include films and labels. Th...voir plus COPONYL™ N-3933E is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides good adhesion for rounded surfaces and labels for refrigerated food. Applications include films and labels. This product is well suited for use in adhesives. voir moins | |
| COPONYL™ N-4399 | Nippon Gohsei | COPONYL™ N-4399 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and acetone solvents. It provides slight adhesion, adhesion to rough surfaces, and is residue free. Applications include masking tapes,...voir plus COPONYL™ N-4399 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and acetone solvents. It provides slight adhesion, adhesion to rough surfaces, and is residue free. Applications include masking tapes, protective masking films, and processing. This product is well suited for use in electronics and adhesives. voir moins | |
| COPONYL™ N-4495 | Nippon Gohsei | COPONYL™ N-4495 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides high-speed peeling characteristics. Applications include masking tapes, protective masking films, and processin...voir plus COPONYL™ N-4495 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides high-speed peeling characteristics. Applications include masking tapes, protective masking films, and processing. This product is well suited for use in electronics and adhesives. voir moins | |
| COPONYL™ N-4510 | Nippon Gohsei | COPONYL™ N-4510 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It has good repulsion resistance. Applications include double-sided tapes and foam tapes. This product is well suited for u...voir plus COPONYL™ N-4510 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It has good repulsion resistance. Applications include double-sided tapes and foam tapes. This product is well suited for use in electronics and adhesives. voir moins | |
| COPONYL™ N-4519L | Nippon Gohsei | COPONYL™ N-4519L is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and acetone solvents. It provides strong adhesion and high tack. Applications include masking tapes and protective masking films. This...voir plus COPONYL™ N-4519L is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and acetone solvents. It provides strong adhesion and high tack. Applications include masking tapes and protective masking films. This product is well suited for use in electronics and adhesives. voir moins | |
| COPONYL™ N-6593 | Nippon Gohsei | COPONYL™ N-6593 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It has good durability and is suitable for optical film applications. This product is well suited for use in electronics and adhesives. | |
| COPONYL™ N-6803 | Nippon Gohsei | COPONYL™ N-6803 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It is formulated to provide good corrosion resistance and for use in thin-layer optical applications. This product is well suited for us...voir plus COPONYL™ N-6803 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It is formulated to provide good corrosion resistance and for use in thin-layer optical applications. This product is well suited for use in electronics and adhesives. voir moins | |
| COPONYL™ N-6941 | Nippon Gohsei | COPONYL™ N-6941 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It provides good bubble resistance, has good durability, and is ideal for thin layer application. This product is well suited for use in...voir plus COPONYL™ N-6941 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It provides good bubble resistance, has good durability, and is ideal for thin layer application. This product is well suited for use in electronics and adhesives. voir moins | |
| COPONYL™ N-7136 | Nippon Gohsei | COPONYL™ N-7136 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and methyl ethyl ketone solvents. It is acid free and ideal for optical applications. This product is well suited for use in electronics and adhe...voir plus COPONYL™ N-7136 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and methyl ethyl ketone solvents. It is acid free and ideal for optical applications. This product is well suited for use in electronics and adhesives. voir moins | |
| COPONYL™ N-7166 | Nippon Gohsei | COPONYL™ N-7166 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, methyl ethyl ketone solvents. It provides good corrosion resistance, and is ideal for thin layer application. This product is well suit...voir plus COPONYL™ N-7166 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, methyl ethyl ketone solvents. It provides good corrosion resistance, and is ideal for thin layer application. This product is well suited for use in electronics and adhesives. voir moins | |
| COPONYL™ N-7245 | Nippon Gohsei | COPONYL™ N-7245 is a pressure-sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and methyl ethyl ketone solvents. This product is well suited for use in electronic and adhesive applications, especially thick-layer o...voir plus COPONYL™ N-7245 is a pressure-sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and methyl ethyl ketone solvents. This product is well suited for use in electronic and adhesive applications, especially thick-layer optical films. voir moins | |
| COPONYL™ N-7482 | Nippon Gohsei | COPONYL™ N-7482 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It provides good adhesion at low temperature. Applications include double-sided tapes and foam tapes. This product is well suited for us...voir plus COPONYL™ N-7482 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It provides good adhesion at low temperature. Applications include double-sided tapes and foam tapes. This product is well suited for use in electronics and adhesives. voir moins | |
| COPONYL™ N-7483 | Nippon Gohsei | COPONYL™ N-7483 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It provides good removability. Applications include double-sided tapes and foam tapes. This product is well suited for use in electronic...voir plus COPONYL™ N-7483 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It provides good removability. Applications include double-sided tapes and foam tapes. This product is well suited for use in electronics and adhesives. voir moins | |
| COPONYL™ N-7486 | Nippon Gohsei | COPONYL™ N-7486 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and acetone solvents. It provides general type adhesive properties and punching processability. Applications include films and labels. This produ...voir plus COPONYL™ N-7486 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and acetone solvents. It provides general type adhesive properties and punching processability. Applications include films and labels. This product is well suited for use in adhesives. voir moins | |
| COPONYL™ N-7487 | Nippon Gohsei | COPONYL™ N-7487 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and acetone solvents. It provides high transparency and punching processability. Applications include films and labels. This product is well suit...voir plus COPONYL™ N-7487 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and acetone solvents. It provides high transparency and punching processability. Applications include films and labels. This product is well suited for use in adhesives. voir moins | |
| COPONYL™ N-7520 | Nippon Gohsei | COPONYL™ N-7520 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It provides good corrosion resistance, good whitening resistance, and is ideal for thin layer application. This product is well suited f...voir plus COPONYL™ N-7520 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It provides good corrosion resistance, good whitening resistance, and is ideal for thin layer application. This product is well suited for use in electronics and adhesives. voir moins | |
| CUMAR® 105 | Neville Chemical Company | CUMAR® 105 is an aromatic flaked resin that promotes wetting of pigments and fillers, improves resistance to acids and alkalis, maintains thermal stability and enables leafing characteristics for metallic pigments. It is used in high solids solvent-borne ...voir plus CUMAR® 105 is an aromatic flaked resin that promotes wetting of pigments and fillers, improves resistance to acids and alkalis, maintains thermal stability and enables leafing characteristics for metallic pigments. It is used in high solids solvent-borne and epoxy based coatings, IV ink modifiers, adhesives and sealants. voir moins | |
| DYHARD® 100 | AlzChem | DYHARD® 100 is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations...voir plus DYHARD® 100 is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat. voir moins | |
| DYHARD® 100M | AlzChem | DYHARD® 100M is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomeration...voir plus DYHARD® 100M is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat. voir moins | |
| DYHARD® 100S | AlzChem | DYHARD® 100S is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomeration...voir plus DYHARD® 100S is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat. voir moins | |
| DYHARD® 100SF | AlzChem | DYHARD® 100SF is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomeratio...voir plus DYHARD® 100SF is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat. voir moins | |
| DYHARD® 100SH | AlzChem | DYHARD® 100SH is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomeratio...voir plus DYHARD® 100SH is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat. voir moins | |
| DYHARD® A5M30 | AlzChem | DYHARD® A5M30 is widely used as a highly active but also latent accelerator master batch of DYHARD® UR500 in thermosetting epoxy resin formulations. It is especially designed for dust free work environments and easy to mix in productions | |
| DYHARD® CAAB | AlzChem | DYHARD® CAAB is a curing agent for matt finish powder coatings based on epoxy or epoxy-polyester hybrid formulations. Usually it is used together with DYHARD® PIN to realize these matt finishes. For low gloss applications the optimal mixing ratio between ...voir plus DYHARD® CAAB is a curing agent for matt finish powder coatings based on epoxy or epoxy-polyester hybrid formulations. Usually it is used together with DYHARD® PIN to realize these matt finishes. For low gloss applications the optimal mixing ratio between DYHARD® PIN and DYHARD® CAAB is 45:55. This ideal mixture is also available in the ready to use premix DYHARD® PMC for an easy handling. voir moins | |
| DYHARD® D50EP | AlzChem | DYHARD® D50EP is a master batch of 50% DYHARD® 100S in standard bisphenol A epoxy resin (EEW 182-192). Advantages include a dust-free production environment, as well as easier dosage and incorporation. It is cost-effective due to easy handling, and offers...voir plus DYHARD® D50EP is a master batch of 50% DYHARD® 100S in standard bisphenol A epoxy resin (EEW 182-192). Advantages include a dust-free production environment, as well as easier dosage and incorporation. It is cost-effective due to easy handling, and offers the same reactivity, latency, and mechanical properties as the DYHARD® 100 series. This product is recommended for one-component thermosetting epoxy resin formulations for the automotive, sporting goods, and aerospace industry, for adhesives, for encapsulation compounds, and more. voir moins | |
| DYHARD® DF50EP | AlzChem | DYHARD® DF50EP is a master batch of 50% DYHARD® 100SF in standard bisphenol A epoxy resin (EEW 182-192). Products of the DYHARD® master batches are widely used for all kinds of one component thermosetting epoxy resin formulations | |
| DYHARD® Fluid 111 | AlzChem | DYHARD® Fluid 111 is a liquid latent curing agent for thermosetting epoxy resin formulations. | |
| DYHARD® Fluid 151 | AlzChem | DYHARD® Fluid 151 is part of a fully formulated latent epoxy resin system, which has been specifically designed for resin transfer molding applications. | |
| DYHARD® Fluid 212 | AlzChem | DYHARD® Fluid 212 is a liquid latent curing agent. It features a long pot life in the impregnation bath, a rapid cure at 120ºC, optical clearness, and high transparency. This makes it ideal for use in filament winding applications. | |
| DYHARD® Fluid AC11 | AlzChem | DYHARD® Fluid AC11 is part of a fully formulated latent epoxy resin system, which has been specifically designed for resin transfer molding applications. | |
| DYHARD® MCA10 | AlzChem | DYHARD® MCA10 is a special formulated curing agent for low temperature cure, or very fast cure at standard cure temperatures. A formulated 1K-Epoxy resins system with DYHARD® MCA10 still has an acceptable long latency of a few weeks at room temperature. | |
| DYHARD® MCA30 | AlzChem | DYHARD® MCA30 is a non toxic, special formulated curing agent for low temperature cure, high gloss epoxy powder coatings. | |
| DYHARD® MI-C | AlzChem | DYHARD® MI-C is used as a very active but also reasonably latent accelerator in thermosetting epoxy resin formulations. It is typically used for fast curing, or low temperature cure, resin systems with low latency requirements. | |
| DYHARD® MI-FF | AlzChem | DYHARD® MI-FF is used as a very active but also reasonably latent accelerator in thermosetting epoxy resin formulations. It is typically used for fast curing, or low temperature cure, resin systems with low latency requirements. | |
| DYHARD® MIA5 | AlzChem | DYHARD® MIA5 is used as a very active but also reasonably latent accelerator in thermosetting epoxy resin formulations. It’s use is particularly suited in combination with micronized dicyandiamide from the DYHARD® CU-Line, or with the dicyandiamide master...voir plus DYHARD® MIA5 is used as a very active but also reasonably latent accelerator in thermosetting epoxy resin formulations. It’s use is particularly suited in combination with micronized dicyandiamide from the DYHARD® CU-Line, or with the dicyandiamide master batches from the DYHARD® MB-Line. voir moins | |
| DYHARD® OTB | AlzChem | DYHARD® OTB represents a medium reactive curing agent for high gloss epoxy powder coatings. With it’s ideal distribution properties in epoxy resins high quality finishes at low curing temperatures are provided. | |
| DYHARD® PI | AlzChem | DYHARD® PI represents an imidazole based accelerator and/or hardener for thermosetting epoxy resin systems. It has a larger particle size than DYHARD® PI-FF, which is more suitable where lower reactiviy's are needed. | |
| DYHARD® PI-FF | AlzChem | DYHARD® PI-FF represents an imidazole based accelerator and/or hardener for thermosetting epoxy resin systems. DYHARD® PI-FF has a smaller particle size than DYHARD® PI and hence is more suitable where higher reactivity's are needed. | |
| DYHARD® PIN | AlzChem | DYHARD® PIN represents a curing agent which is used in low gloss epoxy and epoxy-polyester hybrid powder coatings. It’s ideal distribution properties in both resin systems provides high quality finishes with a very good color stability. | |
| DYHARD® PMC | AlzChem | DYHARD® PMC represents a matt curing agent for low gloss epoxy and epoxy-polyester hybrid powder coatings. With its ideal distribution properties in both resins systems, high quality finishes with a very good color stability are provided. | |
| DYHARD® RF1000 | AlzChem | DYHARD® RF1000 is part of a fully formulated latent epoxy resin system, which has been specifically designed for resin transfer molding applications. | |
| DYHARD® RF2100 | AlzChem | DYHARD® RF2100 is a low viscos modified bisphenol A epoxy resin. It features a long pot life in the impregnation bath, a rapid cure at 120ºC, optical clearness, and high transparency. This makes it ideal for use in filament winding applications. | |
| DYHARD® UR200 | AlzChem | DYHARD® UR200 represents a latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. | |
| DYHARD® UR300 | AlzChem | DYHARD® UR300 represents a latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. | |
| DYHARD® UR300AB | AlzChem | DYHARD® UR300AB represents a latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. | |
| DYHARD® UR400 | AlzChem | DYHARD® UR400 represents a bi-functional, micronized accelerator based on a substituted urea. Being an active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in...voir plus DYHARD® UR400 represents a bi-functional, micronized accelerator based on a substituted urea. Being an active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. voir moins | |
| DYHARD® UR500 | AlzChem | DYHARD® UR500 represents a bi-functional, micronized accelerator based on a substituted urea. Being a highly active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 ser...voir plus DYHARD® UR500 represents a bi-functional, micronized accelerator based on a substituted urea. Being a highly active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. voir moins | |
| DYHARD® UR700 | AlzChem | DYHARD® UR700 represents a highly latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. In addit...voir plus DYHARD® UR700 represents a highly latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. In addition, DYHARD® UR700 is soluble in water, which makes it a preferred accelerator for waterborne applications. voir moins | |
| DYHARD® UR800 | AlzChem | DYHARD® UR800 represents a very latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. | |
| DYHARD® URAcc13 | AlzChem | DYHARD® URAcc13 represents a formulated latent, micronized accelerator based on a substituted urea. Being an active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 ser...voir plus DYHARD® URAcc13 represents a formulated latent, micronized accelerator based on a substituted urea. Being an active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. voir moins | |
| DYHARD® URAcc57 | AlzChem | DYHARD® URAcc57 represents a latent, micronized accelerator based on a substituted urea. Being a very highly active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 ser...voir plus DYHARD® URAcc57 represents a latent, micronized accelerator based on a substituted urea. Being a very highly active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. voir moins | |
| KTR-100 | Suparna Chemicals Ltd. | KTR-100 is a ketonic resin that has the appearance of white prills. It is neutral, light in color, and inert to saponification. It displays good pigment-wetting properties, and increases yield of coating systems. It is suitable for all types of industries...voir plus KTR-100 is a ketonic resin that has the appearance of white prills. It is neutral, light in color, and inert to saponification. It displays good pigment-wetting properties, and increases yield of coating systems. It is suitable for all types of industries, including nitrocellulose paints where it improves polishing characteristic and adhesion. In printing inks, it enhances adhesion, imparts gloss, improves drying properties, and increases solids content, where it is used in maleic resins, alkyd resins, nitro cellulose, and polyvinyl butyral. KTRs are also used in isocyanate based adhesive systems, as well as radiation cured adhesives and in water clear systems. KTR-100 has a softening point of 95 to 105 °C, in butyl acetate of 75 to 95 at 25 °C (cps), and a hydroxyl value of 170 to 200. voir moins | |
| KTR-118 | Suparna Chemicals Ltd. | KTR-118 is a ketonic resin that has the appearance of white prills. It is neutral, light in color, and inert to saponification. It displays good pigment-wetting properties, and increases yield of coating systems. It is suitable for all types of industries...voir plus KTR-118 is a ketonic resin that has the appearance of white prills. It is neutral, light in color, and inert to saponification. It displays good pigment-wetting properties, and increases yield of coating systems. It is suitable for all types of industries, including nitrocellulose paints where it improves polishing characteristic and adhesion. In printing inks, it enhances adhesion, imparts gloss, improves drying properties, and increases solids content, where it is used in maleic resins, alkyd resins, nitro cellulose, and polyvinyl butyral. KTRs are also used in isocyanate based adhesive systems, as well as radiation cured adhesives and in water clear systems. KTR-118 has a softening point of 105 to 115 °C, in butyl acetate of 100 to 120 at 25 °C (cps), and a hydroxyl value of 180 to 210. voir moins | |
| KTR-123 | Suparna Chemicals Ltd. | KTR-123 is a ketonic resin that has the appearance of white prills. It is neutral, light in color, and inert to saponification. It displays good pigment-wetting properties, and increases yield of coating systems. It is suitable for all types of industries...voir plus KTR-123 is a ketonic resin that has the appearance of white prills. It is neutral, light in color, and inert to saponification. It displays good pigment-wetting properties, and increases yield of coating systems. It is suitable for all types of industries, including nitrocellulose paints where it improves polishing characteristic and adhesion. In printing inks, it enhances adhesion, imparts gloss, improves drying properties, and increases solids content, where it is used in maleic resins, alkyd resins, nitro cellulose, and polyvinyl butyral. KTRs are also used in isocyanate based adhesive systems, as well as radiation cured adhesives and in water clear systems. KTR-123 has a softening point of 105 to 115 °C, in butyl acetate of 110 to 140 at 25 °C (cps), and a hydroxyl value of 200 to 230. voir moins | |
| LX®-1035 Resin | Neville Chemical Company | LX®-1035 Resin is a flaked resin that improves cohesive strength and promotes heat resistance of adhesives. In addition it can contribute to rapid solvent release and faster drying of litho inks. It has applications in the adhesives and sealants industry ...voir plus LX®-1035 Resin is a flaked resin that improves cohesive strength and promotes heat resistance of adhesives. In addition it can contribute to rapid solvent release and faster drying of litho inks. It has applications in the adhesives and sealants industry as well as in certain coatings related to the automobile industry. voir moins | |
| LX®-1200 | Neville Chemical Company | LX®-1200 is an inert thermoplastic hydrocarbon resin. This product promotes wetting of pigments and fillers, improves tack and bond strength in adhesives and enhances leafing and brilliance in metallic paints and inks. It is applied to mastics, constructi...voir plus LX®-1200 is an inert thermoplastic hydrocarbon resin. This product promotes wetting of pigments and fillers, improves tack and bond strength in adhesives and enhances leafing and brilliance in metallic paints and inks. It is applied to mastics, construction and flooring adhesives, high solids solvent-borne alkyd based coatings, litho printing inks and aluminum paint. voir moins | |
| LX®-1200, 130 | Neville Chemical Company | LX®-1200, 130 is an inert thermoplastic hydrocarbon resin flake. This product is applied to mastics, construction and flooring adhesives, high solids solvent-borne alkyd based coatings, litho printing inks, metallic litho printing inks and aluminum paint. | |
| LX®-2161 Resin | Neville Chemical Company | LX®-2161 Resin is an inert thermoplastic hydrocarbon resin of amber flakes that enhances the wetting of pigments and fillers, improves tack and bond strength in adhesives and are soluble in aliphatic solvents and vegetable oils. They can be applied to lit...voir plus LX®-2161 Resin is an inert thermoplastic hydrocarbon resin of amber flakes that enhances the wetting of pigments and fillers, improves tack and bond strength in adhesives and are soluble in aliphatic solvents and vegetable oils. They can be applied to litho printing inks and high solids solvent-borne alkyd based coatings in addition to mastics, construction and flooring adhesives. voir moins | |
| LX®-238 Resin | Neville Chemical Company | LX®-238 Resin is an inert thermoplastic hydrocarbon resin. This product promotes wetting of pigments and fillers, is soluble in aromatic and aliphatic solvents/oils and has applications for use in high solids solvent-borne alkyd based coatings and concret...voir plus LX®-238 Resin is an inert thermoplastic hydrocarbon resin. This product promotes wetting of pigments and fillers, is soluble in aromatic and aliphatic solvents/oils and has applications for use in high solids solvent-borne alkyd based coatings and concrete cure compounds. voir moins | |
| Mowinyl 081F | Nippon Gohsei | Mowinyl 081F is a water-based synthetic resin emulsion composed of a vinyl acetate/ethylene copolymer. With good heat sealing properties, transparency of film, and adhesion to plastics, this product is well suited for use in adhesive and laminate applicat...voir plus Mowinyl 081F is a water-based synthetic resin emulsion composed of a vinyl acetate/ethylene copolymer. With good heat sealing properties, transparency of film, and adhesion to plastics, this product is well suited for use in adhesive and laminate applications. voir moins | |
| Mowinyl 082 | Nippon Gohsei | Mowinyl 082 is a water-based synthetic resin emulsion composed of a vinyl acetate/ethylene copolymer. With good heat sealing properties, transparency of film, and adhesion to PE, this product is well suited for use in adhesive and laminate applications. | |
| Mowinyl 109E | Nippon Gohsei | Mowinyl 109E is a water-based synthetic resin emulsion composed of a vinyl acetate/ethylene copolymer. With good adhesion to polyvinyl, plywood, plastic, and paper surfaces, this product is well suited for use in adhesive and laminate applications. | |
| Mowinyl 127N | Nippon Gohsei | Mowinyl 127N is a water-based synthetic resin emulsion composed of vinyl acetate. With good initial adhesion, a longer open time, and good mechanical stability, this product is well suited for use in woodworking and plywood adhesives and laminates. | |
| Mowinyl 128N | Nippon Gohsei | Mowinyl 128N is a water-based synthetic resin emulsion composed of vinyl acetate. With good general adhesion properties, this product is well suited for use in woodworking, plywood, and packaging adhesive applications. | |
| Mowinyl 135N | Nippon Gohsei | Mowinyl 135N is a water-based synthetic resin emulsion composed of vinyl acetate. With high viscosity and good adhesion properties, this product is well suited for use in woodworking and plywood adhesives and laminates. | |
| Mowinyl 138N | Nippon Gohsei | Mowinyl 138N is a water-based synthetic resin emulsion composed of vinyl acetate. With good adhesion and compatibility with urea-formaldehyde, this product is well suited for use in woodworking and plywood adhesives and and laminates. | |
| Mowinyl 168N | Nippon Gohsei | Mowinyl 168N is a water-based synthetic resin emulsion composed of vinyl acetate. With good mechanical stability and a longer open time, this product is well suited for use in woodworking, plywood, and packaging adhesives. | |
| Mowinyl 172E | Nippon Gohsei | Mowinyl 172E is a water-based synthetic resin emulsion composed of a vinyl acetate/ethylene copolymer. With good adhesion and temperature resistance, this product is well suited for use in bookbinding and plastic and paper laminating applications. | |
| Mowinyl 180E | Nippon Gohsei | Mowinyl 180E is a water-based synthetic resin emulsion composed of a vinyl acetate/ethylene copolymer. With high ethylene content and good adhesion, especially to polyvinyl and other plastics, this product is well suited for use in adhesive and laminate a...voir plus Mowinyl 180E is a water-based synthetic resin emulsion composed of a vinyl acetate/ethylene copolymer. With high ethylene content and good adhesion, especially to polyvinyl and other plastics, this product is well suited for use in adhesive and laminate applications. voir moins | |
| Mowinyl 185EK | Nippon Gohsei | Mowinyl 185EK is a water-based synthetic resin emulsion composed of a vinyl acetate/ethylene copolymer. With high solids content and good adhesion to polyvinyl, plywood, plastic, and paper surfaces, this product is well suited for use in adhesive and lami...voir plus Mowinyl 185EK is a water-based synthetic resin emulsion composed of a vinyl acetate/ethylene copolymer. With high solids content and good adhesion to polyvinyl, plywood, plastic, and paper surfaces, this product is well suited for use in adhesive and laminate applications. voir moins | |
| Mowinyl 461 | Nippon Gohsei | Mowinyl 461 is a synthetic acrylic resin emulsion that provides good adhesion, high tack, and good retention for olefins. This product is well suited for use in film- and paper-type adhesive label and tape applications. | |
| Mowinyl 462 | Nippon Gohsei | Mowinyl 462 is a synthetic acrylic resin emulsion that provides good adhesion, high tack, and good retention for olefins. This product is well suited for use in film- and paper-type adhesive label and tape applications. | |
| Mowinyl 490 | Nippon Gohsei | Mowinyl 490 is a synthetic acrylic resin emulsion that features good adhesion, high tack, and a transparent starch type. This product is well suited for use in adhesive film sheet and tape applications. |
