UL Prospector

Succès!

Vous avez enregistré votre recherche avec succès
BYK®-012 Byk BYK®-012 is a mineral oil and silicone free defoamer for aqueous VOC-free adhesives and sealants.
BYK®-016 Byk BYK®-016 is a mineral oil and silicone-free defoamer for aqueous adhesives and sealants.
BYK®-022 Byk Silicone defoamer for aqueous adhesives and sealants.
BYK®-023 Byk Silicone defoamer for aqueous adhesives and sealants.
BYK®-024 Byk Silicone defoamer for adhesives and sealants based on aqueous emulsions.
BYK®-025 Byk Silicone defoamer for adhesives and sealants based on aqueous emulsions.
BYK®-028 Byk Silicone defoamer for adhesives and sealants based on aqueous emulsions.
BYK®-035 Byk BYK®-035 is a mixture of paraffin based mineral oils and hydrophobic components, containing silicone. This product is especially suitable for emulsion systems with a PVC of 20-40. Its effectiveness is not impaired by high shear forces.
BYK®-037 Byk BYK®-037 is an emulsion of paraffin based mineral oils and hydrophobic components, containing silicone. It is used in all emulsion paints and plasters as well as for defoaming during the dispersion production. BYK-037 is very cost-efficient.
BYK®-038 Byk BYK®-038 is a mixture of paraffin based mineral oils and hydrophobic components, containing silicone. This product is especially designed for universal use in APEO-free emulsions. It contains a small amount of a paint compatible silicone which enhances ex...voir plus BYK®-038 is a mixture of paraffin based mineral oils and hydrophobic components, containing silicone. This product is especially designed for universal use in APEO-free emulsions. It contains a small amount of a paint compatible silicone which enhances excellent efficiency. BYK-038 should be preferably used in emulsion systems with a PVC from 20 to 70. voir moins
BYK®-065 Byk Silicone defoamer for solvent-borne and solvent-free adhesives and sealants. The additive is recommended for PUR systems and can also be used in epoxy systems.
BYK®-066 N Byk Silicone defoamer for solvent-borne and solvent-free adhesives and sealants. The additive is recommended for PUR systems and can also be used in epoxy systems.
BYK®-067 A Byk Silicone defoamer for solvent-borne and solvent-free adhesives and sealants. The additive is recommended for PUR systems and can also be used in epoxy systems.
BYK®-077 Byk BYK®-077 is a solution of a polymethylalkylsiloxane. This product prevents foam and bubble formation arising during paint production and application in non-polar to high polar systems. It does not cause dewetting or defects in intercoat adhesion when reco...voir plus BYK®-077 is a solution of a polymethylalkylsiloxane. This product prevents foam and bubble formation arising during paint production and application in non-polar to high polar systems. It does not cause dewetting or defects in intercoat adhesion when recoated. voir moins
BYK®-085 Byk Silicone defoamer and surface additive for solvent-borne adhesives and sealants. BYK®-085 is the solvent-free version of BYK®-077 and is used especially in systems in which solvent-free additives are requested or where a special solvent requirement exist...voir plus Silicone defoamer and surface additive for solvent-borne adhesives and sealants. BYK®-085 is the solvent-free version of BYK®-077 and is used especially in systems in which solvent-free additives are requested or where a special solvent requirement exists.  voir moins
BYK®-088 Byk Silicone air release additive recommended for PUR-based adhesives. Also suitable for epoxy systems.
BYK®-093 Byk High Persistence Silicone Defoamer for Aqueous Adhesives and Sealants. This defoamer combines high efficiency with broad compatibilty.
BYK®-1610 Byk BYK®-1610 is a defoamer for emulsion-based adhesives and sealants.
BYK®-1615 Byk BYK®-1615 is a defoamer for adhesives and sealants based on aqueous emulsions.
BYK®-3400 Byk BYK®-3400 is a silicone surface additive for aqueous adhesives and sealants. It reduces the surface tension and thus improves subtrate wetting.
BYK®-3410 Byk BYK®-3410 is a silicone-free surface additive for aqueous adhesives and sealants. It reduces the surface tension and thus improves subtrate wetting.
BYK®-345 Byk BYK®-345 is a polyether modified siloxane. It is the solvent-free version of BYK-346. These additives improve substrate wetting due to strong reduction of surface tension; they also improve flow and leveling. They cause no or only slight foam stabilizatio...voir plus BYK®-345 is a polyether modified siloxane. It is the solvent-free version of BYK-346. These additives improve substrate wetting due to strong reduction of surface tension; they also improve flow and leveling. They cause no or only slight foam stabilization and they do not impair recoatability. voir moins
BYK®-346 Byk BYK®-346 is a solution of a polyether modified siloxane. This product is the standard additive to improve substrate wetting in aqueous systems. It should normally be added to the finished paint. If necessary, however, it can be added at any stage of the p...voir plus BYK®-346 is a solution of a polyether modified siloxane. This product is the standard additive to improve substrate wetting in aqueous systems. It should normally be added to the finished paint. If necessary, however, it can be added at any stage of the production process. voir moins
BYK®-347 Byk BYK®-347 is a polyether modified siloxane. This product exhibits only minor activity at the interface paint/air due to its chemical structure. The advantage is a further improvement of recoatability. For better overspray acceptance a combination with BYK-...voir plus BYK®-347 is a polyether modified siloxane. This product exhibits only minor activity at the interface paint/air due to its chemical structure. The advantage is a further improvement of recoatability. For better overspray acceptance a combination with BYK-345 is recommended. voir moins
BYK®-348 Byk BYK®-348 is a polyether modified siloxane. This product is especially suitable for solvent-free aqueous formulations (zero-VOC-systems). These additives should normally be added to the finished paint. If necessary, however, they can be added at any stage ...voir plus BYK®-348 is a polyether modified siloxane. This product is especially suitable for solvent-free aqueous formulations (zero-VOC-systems). These additives should normally be added to the finished paint. If necessary, however, they can be added at any stage of the production process. voir moins
BYK®-349 Byk BYK®-349 is a silicone surfactant used to improve substrate wetting in aqueous systems. It is composed of polyether modified siloxane. This product provides various water-borne coatings with highly effective spreading, wetting and leveling. It is suitable...voir plus BYK®-349 is a silicone surfactant used to improve substrate wetting in aqueous systems. It is composed of polyether modified siloxane. This product provides various water-borne coatings with highly effective spreading, wetting and leveling. It is suitable for water-borne systems based on: styrene acrylic, pure acrylic and acrylic/PU combinations, crosslinkable polyurethanes and baking systems. voir moins
BYK®-410 Byk Liquid rheologoical additive for solvent-based and solvent-free coatings. After incorporation it builds up pseudoplasticity within the system. The thixotropic flow behavior prevents settling and sagging. Due to its liquid form the additive is easy to hand...voir plus Liquid rheologoical additive for solvent-based and solvent-free coatings. After incorporation it builds up pseudoplasticity within the system. The thixotropic flow behavior prevents settling and sagging. Due to its liquid form the additive is easy to handle; it can even be used as a post-additive. The additive requires no special temperature control during incorporation. voir moins
BYK®-411 Byk BYK®-411 is a liquid rheological additive (also for post-addition into solvent-borne and solvent-free systems). It is a solution of a modified urea. These additives are preferably used to adjust rheology in low-polar, solvent-borne and solvent-free system...voir plus BYK®-411 is a liquid rheological additive (also for post-addition into solvent-borne and solvent-free systems). It is a solution of a modified urea. These additives are preferably used to adjust rheology in low-polar, solvent-borne and solvent-free systems. This product creates pseudo-plastic, thixotropic flow behavior in the low shear range, and has accordingly no impact on the overall application behavior of the coating. voir moins
BYK®-420 Byk BYK®-420 is a solution of a modified urea. BYK-420 has proven to be efficient for universal application in aqueous systems and pigment concentrates. As a result of varying regional labeling obligations for NMP (N-Methylpyrrolidone), the additives are avai...voir plus BYK®-420 is a solution of a modified urea. BYK-420 has proven to be efficient for universal application in aqueous systems and pigment concentrates. As a result of varying regional labeling obligations for NMP (N-Methylpyrrolidone), the additives are available alternatively as solutions in NEP (N-Ethylpyrroldione) and DMSO (Dimethylsulfoxide). voir moins
BYK®-425 Byk BYK®-425 is a rheological additive for aqueous and water soluble systems. It is a solution of an urea modified polyurethane. The additive is designed for adjusting the low shear viscosity of aqueous and water soluble resin systems providing pseudoplastic ...voir plus BYK®-425 is a rheological additive for aqueous and water soluble systems. It is a solution of an urea modified polyurethane. The additive is designed for adjusting the low shear viscosity of aqueous and water soluble resin systems providing pseudoplastic flow behavior. Due to its high effectiveness BYK-425 is also suitable to increase in-can viscosity and to adjust flow properties of pigment pastes. The viscosity increase improves the sag resistance. voir moins
BYK®-430 Byk BYK®-430 is a liquid rheology control additive for solvent borne systems. It is a solution of a high molecular urea modified medium polar polyamide. BYK-430 and BYK-431 build a three-dimensional structured network based on hydrogen bondings and interactio...voir plus BYK®-430 is a liquid rheology control additive for solvent borne systems. It is a solution of a high molecular urea modified medium polar polyamide. BYK-430 and BYK-431 build a three-dimensional structured network based on hydrogen bondings and interaction with the pigments and extenders. The resulting pseudoplastic flow characteristic is the result of the entanglement of high molecular weight polymers. The polarity of the coating system as well as the incorporation temperature will have an effect on the final rheology. voir moins
BYK®-431 Byk BYK®-431 is a liquid rheology control additive for solvent-borne systems. It is a solution of a high molecular urea modified non polar polyamide. BYK-430 and BYK-431 build a three-dimensional structured network based on hydrogen bondings and interaction w...voir plus BYK®-431 is a liquid rheology control additive for solvent-borne systems. It is a solution of a high molecular urea modified non polar polyamide. BYK-430 and BYK-431 build a three-dimensional structured network based on hydrogen bondings and interaction with the pigments and extenders. The resulting pseudoplastic flow characteristic is the result of the entanglement of high molecular weight polymers. The polarity of the coating system as well as the incorporation temperature will have an effect on the final rheology. voir moins
BYK®-9076 Byk BYK®-9076 is a high molecular weight additive for solvent-free adhesives and sealants BYK®-9076 is especially useful for the stabilization of acidic and neutral types of carbon black.
BYK®-9077 Byk BYK®-9077 is a wetting and dispersing additive for solvent-free systems and pigment concentrates with high molecular weight. It is a copolymer with pigment affinic groups. This product reduces viscosity and leads to more Newtonian flow behavior in the mil...voir plus BYK®-9077 is a wetting and dispersing additive for solvent-free systems and pigment concentrates with high molecular weight. It is a copolymer with pigment affinic groups. This product reduces viscosity and leads to more Newtonian flow behavior in the mill-base. BYK-9077 is especially suited for stabilizing basic carbon black pigments. The product does not contain plasticizers. voir moins
BYK®-A 515 Byk BYK®-A 515 is a highly surface active air release additive often used in acrylic systems to prevent air entrapment.
BYK®-A 530 Byk Air release agent and defoamer for solvent-based and solvent-free epoxy systems.
BYK®-A 535 Byk Silicone-free defoamer / air release additive for solvent-free and solvent-borne epoxy and PUR-based adhesives and sealants.
BYK®-A 550 Byk BYK®-A 550 shows a strong air release effect without creating a strong haziness effect.
BYK®-A 555 Byk BYK®-A 555 shows the highest efficiency in various adhesive applications.
BYK®-DYNWET 800 Byk BYK®-DYNWET 800 is a silicone-free surface additive for aqueous adhesives and sealants. It reduces the dynamic surface tension during fast application processes and thus improves subtrate wetting.
BYK®-W 940 Byk BYK®-W 940 prevents sedimentation of mineral fillers such as calcium carbonate and aluminium trihydroxide and minimizes flooding and floating when organic and inorganic pigments are used.
BYK®-W 961 Byk BYK®-W 961 is used as a wetting and dispersing additive for mineral fillers to prevent sedimentation.
BYK®-W 966 Byk BYK®-W 966 improves the dispersion of a wide range of the most common fillers such as calcium carbonate and aluminium trihydroxide in polyester resins. It reduces the viscosity, so that a higher filler loading is possible, and helps to prevent sedimentati...voir plus BYK®-W 966 improves the dispersion of a wide range of the most common fillers such as calcium carbonate and aluminium trihydroxide in polyester resins. It reduces the viscosity, so that a higher filler loading is possible, and helps to prevent sedimentation. voir moins
BYK®-W 969 Byk BYK®-W 969 is used as a wetting and dispersing additive with viscosity reducing properties for adhesives and sealants.
BYK®-W 980 Byk BYK®-W 980 improves the dispersion of a wide range of the most common fillers such as calcium carbonate and aluminium trihydroxide. It reduces the viscosity, so that a higher filler loading is possible and helps to prevent sedimentation.
BYK®-W 985 Byk BYK®-W 985 improves the wetting and dispersion speed of the most common fillers such as calcium carbonate and aluminium trihydroxide. It dramatically reduces the viscosity so that a higher filler load is possible. BYK®-W 985 usually will not prevent sedim...voir plus BYK®-W 985 improves the wetting and dispersion speed of the most common fillers such as calcium carbonate and aluminium trihydroxide. It dramatically reduces the viscosity so that a higher filler load is possible. BYK®-W 985 usually will not prevent sedimentation. voir moins
COPONYL™ 5065 Nippon Gohsei COPONYL™ 5065 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides high-speed peeling characteristics and is residue free. Applications include masking tapes and protective masking...voir plus COPONYL™ 5065 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides high-speed peeling characteristics and is residue free. Applications include masking tapes and protective masking films. This product is well suited for use in electronics and adhesives. voir moins
COPONYL™ 5411 Nippon Gohsei COPONYL™ 5411 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides permanent adhesion, and is suitable for thick-layer application. Applications include double-sided tapes and foam...voir plus COPONYL™ 5411 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides permanent adhesion, and is suitable for thick-layer application. Applications include double-sided tapes and foam tapes. This product is well suited for use in electronics and adhesives. voir moins
COPONYL™ 5560 Nippon Gohsei COPONYL™ 5560 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and isopropyl alcohol solvents. It is a one-component cross-linkage product. Applications include films and labels. This product is well ...voir plus COPONYL™ 5560 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and isopropyl alcohol solvents. It is a one-component cross-linkage product. Applications include films and labels. This product is well suited for use in adhesives. voir moins
COPONYL™ 5672 Nippon Gohsei COPONYL™ 5672 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides strong adhesion and good removability. Applications include films and labels, masking tapes, and protective maski...voir plus COPONYL™ 5672 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides strong adhesion and good removability. Applications include films and labels, masking tapes, and protective masking films. This product is well suited for use in electronics and adhesives. voir moins
COPONYL™ 5697 Nippon Gohsei COPONYL™ 5697 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It is a general use hard-type resin used in PVC backing materials. This product is well suited for use in adhesives.
COPONYL™ 5698 Nippon Gohsei COPONYL™ 5698 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It is a general use soft-type resin used in PVC backing materials. This product is well suited for use in adhesives.
COPONYL™ 5705L Nippon Gohsei COPONYL™ 5705L is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides strong adhesion and low tack. Applications include masking tapes and protective masking films. This product is w...voir plus COPONYL™ 5705L is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides strong adhesion and low tack. Applications include masking tapes and protective masking films. This product is well suited for use in electronics and adhesives. voir moins
COPONYL™ 5706-A Nippon Gohsei COPONYL™ 5706-A is a pressure sensitive adhesive resin formulated from acrylic acid ester using toluene and cellosolve solvents. It is ideal for screen coatings. This product is well suited for use in adhesives.
COPONYL™ 5740 Nippon Gohsei COPONYL™ 5740 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides slight adhesion, good removability, heat resistance, and is residue free. Applications include masking tapes, pro...voir plus COPONYL™ 5740 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides slight adhesion, good removability, heat resistance, and is residue free. Applications include masking tapes, protective masking films, and processing. This product is well suited for use in electronics and adhesives. voir moins
COPONYL™ 8065 Nippon Gohsei COPONYL™ 8065 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. This product is well suited for use in adhesives in medical applications such as fixing tapes for cataplasm and elastics.
COPONYL™ 8137 Nippon Gohsei COPONYL™ 8137 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides good adhesion at low temperatures. Applications include films and labels. This product is well suited for use in ...voir plus COPONYL™ 8137 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides good adhesion at low temperatures. Applications include films and labels. This product is well suited for use in adhesives. voir moins
COPONYL™ 8694 Nippon Gohsei COPONYL™ 8694 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides strong adhesion and good removability. Applications include films and labels, masking tapes, and protective maski...voir plus COPONYL™ 8694 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides strong adhesion and good removability. Applications include films and labels, masking tapes, and protective masking films. This product is well suited for use in adhesives. voir moins
COPONYL™ 8700 Nippon Gohsei COPONYL™ 8700 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It has good adhesion to olefin and is suitable for short-aging time. Applications include double-sided tapes and foam tapes. ...voir plus COPONYL™ 8700 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It has good adhesion to olefin and is suitable for short-aging time. Applications include double-sided tapes and foam tapes. This product is well suited for use in adhesives. voir moins
COPONYL™ 8708 Nippon Gohsei COPONYL™ 8708 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides good adhesion at low temperature. Applications include double-sided tapes and foam tapes. This product is well su...voir plus COPONYL™ 8708 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides good adhesion at low temperature. Applications include double-sided tapes and foam tapes. This product is well suited for use in electronics and adhesives. voir moins
COPONYL™ 8711 Nippon Gohsei COPONYL™ 8711 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It has good processability and heat resistance. Applications include double-sided tapes and foam tapes. This product is well ...voir plus COPONYL™ 8711 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It has good processability and heat resistance. Applications include double-sided tapes and foam tapes. This product is well suited for use in electronics and adhesives. voir moins
COPONYL™ 8815 Nippon Gohsei COPONYL™ 8815 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides good removability, is residue free, and has weather resistance properties. Applications include masking tapes and...voir plus COPONYL™ 8815 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides good removability, is residue free, and has weather resistance properties. Applications include masking tapes and protective masking films. This product is well suited for use in electronics and adhesives. voir moins
COPONYL™ 8976L Nippon Gohsei COPONYL™ 8976L is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides good heat resistance. Applications include films and labels. This product is well suited for use in adhesives.
COPONYL™ N-2031 Nippon Gohsei COPONYL™ N-2031 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. This product provides different levels of adhesive properties depending on temperature. Applications include masking tapes ...voir plus COPONYL™ N-2031 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. This product provides different levels of adhesive properties depending on temperature. Applications include masking tapes and protective masking films. This product is well suited for use in electronics and adhesives. voir moins
COPONYL™ N-2147 Nippon Gohsei COPONYL™ N-2147 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides heat resistance, dimension stability, and is suitable for window film. Applications include films and labels, P...voir plus COPONYL™ N-2147 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides heat resistance, dimension stability, and is suitable for window film. Applications include films and labels, PVC backing materials, and optical. This product is well suited for use in electronics and adhesives. voir moins
COPONYL™ N-2260 Nippon Gohsei COPONYL™ N-2260 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides low adhesion, high tack, is heat resistant, and residue free. Applications include masking tapes, protective ma...voir plus COPONYL™ N-2260 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides low adhesion, high tack, is heat resistant, and residue free. Applications include masking tapes, protective masking films, and processing. This product is well suited for use in electronics and adhesives. voir moins
COPONYL™ N-2332 Nippon Gohsei COPONYL™ N-2332 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. The characteristics of this product are low adherence and soft type. This product is well suited for use in adhesives for m...voir plus COPONYL™ N-2332 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. The characteristics of this product are low adherence and soft type. This product is well suited for use in adhesives for medical applications. voir moins
COPONYL™ N-2584 Nippon Gohsei COPONYL™ N-2584 is a pressure-sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and methanol solvents. It is alkaline soluble and suitable for splicing labels and paper. This product is well suited for use in adhesi...voir plus COPONYL™ N-2584 is a pressure-sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and methanol solvents. It is alkaline soluble and suitable for splicing labels and paper. This product is well suited for use in adhesive labels and films. voir moins
COPONYL™ N-3449L Nippon Gohsei COPONYL™ N-3449L is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and acetone solvents. It provides good adhesion to olefin. Applications include masking tapes and protective masking films. This produ...voir plus COPONYL™ N-3449L is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and acetone solvents. It provides good adhesion to olefin. Applications include masking tapes and protective masking films. This product is well suited for use in adhesives. voir moins
COPONYL™ N-3483 Nippon Gohsei COPONYL™ N-3483 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. Applications include masking tapes and protective masking films. This product is well suited for use in adhesives.
COPONYL™ N-3495HS Nippon Gohsei COPONYL™ N-3495HS is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and acetone solvents. It provides good adhesion to olefin. Applications include masking tapes, protective masking films, double-sided...voir plus COPONYL™ N-3495HS is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and acetone solvents. It provides good adhesion to olefin. Applications include masking tapes, protective masking films, double-sided tapes, and foam tapes. This product is well suited for use in electronics and adhesives. voir moins
COPONYL™ N-3581 Nippon Gohsei COPONYL™ N-3581 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It has good wettability, and good adhesion to rough surfaces. Applications include masking tapes, protective masking films,...voir plus COPONYL™ N-3581 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It has good wettability, and good adhesion to rough surfaces. Applications include masking tapes, protective masking films, and processing. This product is well suited for use in electronics and adhesives. voir moins
COPONYL™ N-3816E Nippon Gohsei COPONYL™ N-3816E is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It has good durability and is suitable for optical film applications. This product is well suited for use in electronics and adhesives.
COPONYL™ N-3933E Nippon Gohsei COPONYL™ N-3933E is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides good adhesion for rounded surfaces and labels for refrigerated food. Applications include films and labels. Th...voir plus COPONYL™ N-3933E is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides good adhesion for rounded surfaces and labels for refrigerated food. Applications include films and labels. This product is well suited for use in adhesives. voir moins
COPONYL™ N-4399 Nippon Gohsei COPONYL™ N-4399 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and acetone solvents. It provides slight adhesion, adhesion to rough surfaces, and is residue free. Applications include masking tapes,...voir plus COPONYL™ N-4399 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and acetone solvents. It provides slight adhesion, adhesion to rough surfaces, and is residue free. Applications include masking tapes, protective masking films, and processing. This product is well suited for use in electronics and adhesives. voir moins
COPONYL™ N-4495 Nippon Gohsei COPONYL™ N-4495 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides high-speed peeling characteristics. Applications include masking tapes, protective masking films, and processin...voir plus COPONYL™ N-4495 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides high-speed peeling characteristics. Applications include masking tapes, protective masking films, and processing. This product is well suited for use in electronics and adhesives. voir moins
COPONYL™ N-4510 Nippon Gohsei COPONYL™ N-4510 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It has good repulsion resistance. Applications include double-sided tapes and foam tapes. This product is well suited for u...voir plus COPONYL™ N-4510 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It has good repulsion resistance. Applications include double-sided tapes and foam tapes. This product is well suited for use in electronics and adhesives. voir moins
COPONYL™ N-4519L Nippon Gohsei COPONYL™ N-4519L is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and acetone solvents. It provides strong adhesion and high tack. Applications include masking tapes and protective masking films. This...voir plus COPONYL™ N-4519L is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and acetone solvents. It provides strong adhesion and high tack. Applications include masking tapes and protective masking films. This product is well suited for use in electronics and adhesives. voir moins
COPONYL™ N-6593 Nippon Gohsei COPONYL™ N-6593 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It has good durability and is suitable for optical film applications. This product is well suited for use in electronics and adhesives.
COPONYL™ N-6803 Nippon Gohsei COPONYL™ N-6803 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It is formulated to provide good corrosion resistance and for use in thin-layer optical applications. This product is well suited for us...voir plus COPONYL™ N-6803 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It is formulated to provide good corrosion resistance and for use in thin-layer optical applications. This product is well suited for use in electronics and adhesives. voir moins
COPONYL™ N-6941 Nippon Gohsei COPONYL™ N-6941 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It provides good bubble resistance, has good durability, and is ideal for thin layer application. This product is well suited for use in...voir plus COPONYL™ N-6941 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It provides good bubble resistance, has good durability, and is ideal for thin layer application. This product is well suited for use in electronics and adhesives. voir moins
COPONYL™ N-7136 Nippon Gohsei COPONYL™ N-7136 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and methyl ethyl ketone solvents. It is acid free and ideal for optical applications. This product is well suited for use in electronics and adhe...voir plus COPONYL™ N-7136 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and methyl ethyl ketone solvents. It is acid free and ideal for optical applications. This product is well suited for use in electronics and adhesives. voir moins
COPONYL™ N-7166 Nippon Gohsei COPONYL™ N-7166 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, methyl ethyl ketone solvents. It provides good corrosion resistance, and is ideal for thin layer application. This product is well suit...voir plus COPONYL™ N-7166 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, methyl ethyl ketone solvents. It provides good corrosion resistance, and is ideal for thin layer application. This product is well suited for use in electronics and adhesives. voir moins
COPONYL™ N-7245 Nippon Gohsei COPONYL™ N-7245 is a pressure-sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and methyl ethyl ketone solvents. This product is well suited for use in electronic and adhesive applications, especially thick-layer o...voir plus COPONYL™ N-7245 is a pressure-sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and methyl ethyl ketone solvents. This product is well suited for use in electronic and adhesive applications, especially thick-layer optical films. voir moins
COPONYL™ N-7482 Nippon Gohsei COPONYL™ N-7482 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It provides good adhesion at low temperature. Applications include double-sided tapes and foam tapes. This product is well suited for us...voir plus COPONYL™ N-7482 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It provides good adhesion at low temperature. Applications include double-sided tapes and foam tapes. This product is well suited for use in electronics and adhesives. voir moins
COPONYL™ N-7483 Nippon Gohsei COPONYL™ N-7483 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It provides good removability. Applications include double-sided tapes and foam tapes. This product is well suited for use in electronic...voir plus COPONYL™ N-7483 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It provides good removability. Applications include double-sided tapes and foam tapes. This product is well suited for use in electronics and adhesives. voir moins
COPONYL™ N-7486 Nippon Gohsei COPONYL™ N-7486 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and acetone solvents. It provides general type adhesive properties and punching processability. Applications include films and labels. This produ...voir plus COPONYL™ N-7486 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and acetone solvents. It provides general type adhesive properties and punching processability. Applications include films and labels. This product is well suited for use in adhesives. voir moins
COPONYL™ N-7487 Nippon Gohsei COPONYL™ N-7487 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and acetone solvents. It provides high transparency and punching processability. Applications include films and labels. This product is well suit...voir plus COPONYL™ N-7487 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and acetone solvents. It provides high transparency and punching processability. Applications include films and labels. This product is well suited for use in adhesives. voir moins
COPONYL™ N-7520 Nippon Gohsei COPONYL™ N-7520 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It provides good corrosion resistance, good whitening resistance, and is ideal for thin layer application. This product is well suited f...voir plus COPONYL™ N-7520 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It provides good corrosion resistance, good whitening resistance, and is ideal for thin layer application. This product is well suited for use in electronics and adhesives. voir moins
CUMAR® 105 Neville Chemical Company CUMAR® 105 is an aromatic flaked resin that promotes wetting of pigments and fillers, improves resistance to acids and alkalis, maintains thermal stability and enables leafing characteristics for metallic pigments. It is used in high solids solvent-borne ...voir plus CUMAR® 105 is an aromatic flaked resin that promotes wetting of pigments and fillers, improves resistance to acids and alkalis, maintains thermal stability and enables leafing characteristics for metallic pigments. It is used in high solids solvent-borne and epoxy based coatings, IV ink modifiers, adhesives and sealants. voir moins
Claytone® 40 Byk Claytone® 40 is an organophilic bentonite derivative which is used as thixotropic thickener and anti-settling agent in solvent based coating systems of low to medium polarity. It is a traditional organoclay requiring the addition of an activator to achiev...voir plus Claytone® 40 is an organophilic bentonite derivative which is used as thixotropic thickener and anti-settling agent in solvent based coating systems of low to medium polarity. It is a traditional organoclay requiring the addition of an activator to achieve full efficiency. As organophilic smectite product, it can swell in organic media and build a gel structure (card-house structure). Weak hydrogen bonding between the single smectite platelets is the reason for this thixotropic gel structure. For optimum efficiency the complete separation of the platelets (complete dispersion of agglomerates into primary particles) is necessary. voir moins
Claytone® AF Byk Claytone® AF is a modified montmorillonite designed for use in systems containing aliphatic solvents and aliphatic-aromatic solvent blends that display low to medium polarity. Claytone® AF produces reproducible viscosity and thixotropic development, a hig...voir plus Claytone® AF is a modified montmorillonite designed for use in systems containing aliphatic solvents and aliphatic-aromatic solvent blends that display low to medium polarity. Claytone® AF produces reproducible viscosity and thixotropic development, a high degree of sag control and prevents pigment settling. Claytone® AF is self dispersing and does not require a polar activator. Claytone® AF eliminates the need for high shear or pregels. voir moins
Claytone® APA Byk Claytone® APA is a modified montmorillonite designed for use in systems containing aromatic solvent or aromatic-oxygenated solvent blends that display medium to high polarity. Claytone® APA demonstrates high gelling efficiency, reproducible viscosity and ...voir plus Claytone® APA is a modified montmorillonite designed for use in systems containing aromatic solvent or aromatic-oxygenated solvent blends that display medium to high polarity. Claytone® APA demonstrates high gelling efficiency, reproducible viscosity and thixotropic development, a high degree of sag control and prevents hard settling of pigments and fillers. voir moins
Claytone® HT Byk Claytone® HT is a modified montmorillonite designed for use in systems containing aromatic and aliphatic solvents that display low to medium polarity. Claytone® HT demonstrates high gelling efficiency, reproducible viscosity and thixotropic development, a...voir plus Claytone® HT is a modified montmorillonite designed for use in systems containing aromatic and aliphatic solvents that display low to medium polarity. Claytone® HT demonstrates high gelling efficiency, reproducible viscosity and thixotropic development, a high degree of sag control and prevents hard settling of pigments and fillers. This product is a high performance rheological additive for use in high performance oil based paints and is especially suited to industrial, marine and maintenance coatings. voir moins
Claytone® HY Byk Claytone® HY is a modified montmorillonite designed for use in low to medium polarity printing inks. Claytone® HY demonstrates high gelling efficiency, increases the viscosity and yield value, prevents pigment agglomeration, and settling, reduces misting ...voir plus Claytone® HY is a modified montmorillonite designed for use in low to medium polarity printing inks. Claytone® HY demonstrates high gelling efficiency, increases the viscosity and yield value, prevents pigment agglomeration, and settling, reduces misting and allows the ink manufacturer to control tack viscosity. voir moins
DISPERBYK®-118 Byk DISPERBYK®-118 is a wetting and dispersing additive for solvent-borne systems to stabilize acidic, neutral and basic titanium dioxides, colored inorganic pigments, transparent iron oxides, fillers, and effect pigments. The additive improves the wetting an...voir plus DISPERBYK®-118 is a wetting and dispersing additive for solvent-borne systems to stabilize acidic, neutral and basic titanium dioxides, colored inorganic pigments, transparent iron oxides, fillers, and effect pigments. The additive improves the wetting and dispersing of all inorganic fillers such as calcium carbonate and aluminum hydroxide (ATH). DISPERBYK®-118 is all-purpose for titanium dioxides. The additive causes lower viscosity and enables higher filler loading. voir moins
DISPERBYK®-180 Byk Wetting and dispersing additive for aqueous, solvent-based and solvent-free adhesives and sealants.
DISPERBYK®-190 Byk Wetting and dispersing additive for aqueous adhesives and sealants.
DISPERBYK®-191 Byk Wetting and dispersing additive for aqueous adhesives and sealants.
DISPERBYK®-192 Byk Wetting and dispersing additive for aqueous adhesives and sealants.