| Amicure® CG-NA Curing Agent | Evonik Operations GmbH, BL Crosslinkers | Amicure® CG-NA Curing Agent is an unpulverized grade of dicyandiamide designed for use as a latent curing agent for epoxy resins in solventbased processes. It is ideal for use in electrical laminates, and solvent-based, pre-preg composites. | Request Sample |
| AMICURE® UR Curing Agent | Evonik Operations GmbH, BL Crosslinkers | AMICURE® UR Curing Agent is a substituted urea-based accelerator (1 Phenyl 3,3 dimethyl urea) for dicyandiamide- cured epoxy resins. It combines excellent latency at ambient temperature with rapid cure in systems heated above its activation temperature. I...voir plus AMICURE® UR Curing Agent is a substituted urea-based accelerator (1 Phenyl 3,3 dimethyl urea) for dicyandiamide- cured epoxy resins. It combines excellent latency at ambient temperature with rapid cure in systems heated above its activation temperature. It is ideal for use in one-pack paste and film adhesives, heat-sure composites, and prepreg composites. voir moins | Request Sample |
| Ancamide® 220 Curing Agent | Evonik Operations GmbH, BL Crosslinkers | Ancamide® 220 Curing Agent is one in a series of standard reactive polyamides for use in the curing of epoxy resins. It has been designed particularly for use in solvent-based surface coatings. | Request Sample |
| ANCAMIDE® 220-X-70 Curing Agent | Evonik Operations GmbH, BL Crosslinkers | ANCAMIDE® 220-X-70 Curing Agent is one in a series of standard reactive polyamides intended for use in the curing of epoxy resins. It is ideal for use in solvent-based maintenance coatings, primers, sealers and coatings for concrete. | Request Sample |
| ANCAMIDE 221® Curing Agent | Evonik Operations GmbH, BL Crosslinkers | ANCAMIDE 221® Curing Agent is a member of a series of reactive polyamides developed for use in the curing of epoxy resins in solvent-based surface coatings applications. Special features include good color, color stability, chemical resistance and excelle...voir plus ANCAMIDE 221® Curing Agent is a member of a series of reactive polyamides developed for use in the curing of epoxy resins in solvent-based surface coatings applications. Special features include good color, color stability, chemical resistance and excellent corrosion resistance properties. It is freely compatible with a wide range of solvents, including those generally used in epoxy resin based coatings. voir moins | Request Sample |
| ANCAMIDE® 3201 Curing Agent | Evonik Operations GmbH, BL Crosslinkers | ANCAMIDE® 3201 Curing Agent is a low viscosity, solvent-free formulated polyaminoamide adduct. The curing agent is an accelerated version of Ancamine® 3200 and is recommended for use with liquid epoxy resin for the development of primers, coatings particu...voir plus ANCAMIDE® 3201 Curing Agent is a low viscosity, solvent-free formulated polyaminoamide adduct. The curing agent is an accelerated version of Ancamine® 3200 and is recommended for use with liquid epoxy resin for the development of primers, coatings particularly for wet and high humid application areas. In addition the curing agent can be used for high-solid coatings for corrosion protection under severe conditions. voir moins | Request Sample |
| ANCAMIDE® 400 Curing Agent | Evonik Operations GmbH, BL Crosslinkers | ANCAMIDE® 400 Curing Agent is a unique, low viscosity reactive polyamide developed specifically for use in the curing of liquid epoxy resins. It can be used in a wide range of applications, including flooring and surface coatings, adhesives, sealant and p...voir plus ANCAMIDE® 400 Curing Agent is a unique, low viscosity reactive polyamide developed specifically for use in the curing of liquid epoxy resins. It can be used in a wide range of applications, including flooring and surface coatings, adhesives, sealant and putties, castings, laminates, and cable jointing compounds. voir moins | Request Sample |
| Ancamide® 910 | Evonik Operations GmbH, BL Crosslinkers | Ancamide® 910 curing agent is a versatile, flexible hardener designed for use with liquid epoxy resin. Its engineered chemistry provides a unique combination of properties not found in other epoxy hardeners. It delivers outstanding flexibility/peel streng...voir plus Ancamide® 910 curing agent is a versatile, flexible hardener designed for use with liquid epoxy resin. Its engineered chemistry provides a unique combination of properties not found in other epoxy hardeners. It delivers outstanding flexibility/peel strength, excellent thermal shock resistance, and good electrical properties. Additional features include lower viscosity than conventional polyamides and DOT non-corrosive status. Ancamide® 910 curing agent can be used either as a sole curing agent or as a modifier. voir moins | Request Sample |
| Ancamine® 2014AS/FG | Evonik Operations GmbH, BL Crosslinkers | Ancamine® 2014AS/FG is a modified aliphatic polyamine adduct designed for use as a latent catalyst and curing agent for liquid epoxy resins. They can also be used as accelerators for dicyandiamide (DICY). This white micronised powder is applied in one-com...voir plus Ancamine® 2014AS/FG is a modified aliphatic polyamine adduct designed for use as a latent catalyst and curing agent for liquid epoxy resins. They can also be used as accelerators for dicyandiamide (DICY). This white micronised powder is applied in one-component adhesives and solvent free laminating. voir moins | Request Sample |
| Ancamine® 2337S | Evonik Operations GmbH, BL Crosslinkers | Ancamine® 2337S curing agent is a modified aliphatic amine designed for use as a latent curing agent for epoxy resins. Applications for this product include one-component conduction or induction heat-cure adhesives, potting, coatings, and hot-melt prepreg...voir plus Ancamine® 2337S curing agent is a modified aliphatic amine designed for use as a latent curing agent for epoxy resins. Applications for this product include one-component conduction or induction heat-cure adhesives, potting, coatings, and hot-melt prepregs. This product is a light yellow powder. voir moins | Request Sample |
| Ancamine® 2441 Curing Agent | Evonik Operations GmbH, BL Crosslinkers | Ancamine® 2441 curing agent is a modified polyamine which was designed for use as a latent curing agentfor onecomponent adhesive formulations. The product can also be used as an accelerator fordicyandiamide (dicy). Its combinatio...voir plus Ancamine® 2441 curing agent is a modified polyamine which was designed for use as a latent curing agentfor onecomponent adhesive formulations. The product can also be used as an accelerator fordicyandiamide (dicy). Its combination of low temperature activation, good shelf life and high glass transitiontemperature permits use in many applications requiring latency and high performance. voir moins | Request Sample |
| Ancamine® 2442 Curing Agent | Evonik Operations GmbH, BL Crosslinkers | Ancamine® 2442 curing agent is a modified polyamine designed for use as a latent curing agent for one-component epoxy formulations. The product can also be used to accelerate dicyandiamide (DICY). It provides an excellent balance of low-temp...voir plus Ancamine® 2442 curing agent is a modified polyamine designed for use as a latent curing agent for one-component epoxy formulations. The product can also be used to accelerate dicyandiamide (DICY). It provides an excellent balance of low-temperature activation, good shelf stability and high glass transition temperature, and can be used in many applications requiring latency and high performance. voir moins | Request Sample |
| ANCAREZ® AR555 Waterborne Epoxy Resin | Evonik Operations GmbH, BL Crosslinkers | ANCAREZ® AR555 Waterborne Epoxy Resin is a waterborne solid epoxy resin dispersion delivered at 55% solids in water. It is designed for use in two-component, ambient-cure epoxy systems. It delivers superior performance at lower cost when compared to con...voir plus ANCAREZ® AR555 Waterborne Epoxy Resin is a waterborne solid epoxy resin dispersion delivered at 55% solids in water. It is designed for use in two-component, ambient-cure epoxy systems. It delivers superior performance at lower cost when compared to conventional solid resin dispersions. The unique nature of this product allows film formulation without high levels of coalescing solvent, which enables the formulation of low-odor, zero-VOC systems. voir moins | Request Sample |
| BurnEx™ 30-107 | Nyacol Nano Technology | BurnEx™ 30-107 is a flame retardant synergist for polyvinyl chloride and other materials employing halogens as its primary flame retardant. It is composed of agglomerated particles in the range of 10 to 40 microns and is used in textiles, adhesives, coati...voir plus BurnEx™ 30-107 is a flame retardant synergist for polyvinyl chloride and other materials employing halogens as its primary flame retardant. It is composed of agglomerated particles in the range of 10 to 40 microns and is used in textiles, adhesives, coatings, and water-based systems. voir moins | |
| BurnEx™ A1582 | Nyacol Nano Technology | BurnEx™ A1582, a Nano-Dispersible Dry Powder Colloidal Antimony Pentoxide Flame Retardant Additive, is used with halogenated flame retardants in polymers, solvents and adhesives. It has end use applications in flexible vinyl and thermoplastic polyester. | |
| BurnEx™ ADP480 | Nyacol Nano Technology | BurnEx™ ADP480 a nano-dispersible dry powder colloidal antimony Pentoxide flame retardant additive, is used with halogenated flame retardants in polymers, solvents and adhesives. It has end use applications in Polyolefins, HIPS, and Adhesives | |
| BurnEx™ ADP494 | Nyacol Nano Technology | BurnEx™ ADP494, a nano-dispersible dry powder colloidal antimony Pentoxide flame retardant additive, is used with halogenated flame retardants in polymers, solvents and adhesives. It has end use applications in Solution-spun fibers, ABS, Epoxy-ketones. | |
| BurnEx Plus™ A1588LP | Nyacol Nano Technology | BurnEx Plus™ A1588LP is a dry powder colloidal antimony pentoxide (Sb2O5) for use as a synergist with halogenated flame retardants in high performance epoxy. Its ultimate particle size is 0.03 microns and it has applications in textiles, adhesives, coatin...voir plus BurnEx Plus™ A1588LP is a dry powder colloidal antimony pentoxide (Sb2O5) for use as a synergist with halogenated flame retardants in high performance epoxy. Its ultimate particle size is 0.03 microns and it has applications in textiles, adhesives, coatings, and water-based systems. voir moins | |
| BurnEx Plus™ A1590 | Nyacol Nano Technology | BurnEx Plus™ A1590 is a dry powder colloidal antimony pentoxide (Sb2O5) for use as a synergist with halogenated flame retardants in high performance epoxy. Its ultimate particle size is 0.06 microns and it has applications in textiles, adhesives, coatings...voir plus BurnEx Plus™ A1590 is a dry powder colloidal antimony pentoxide (Sb2O5) for use as a synergist with halogenated flame retardants in high performance epoxy. Its ultimate particle size is 0.06 microns and it has applications in textiles, adhesives, coatings, and water-based systems. voir moins | |
| BurnEx™ ZTA | Nyacol Nano Technology | BurnEx™ ZTA is a dry powder colloidal antimony Pentoxide and a synergist with PVC and other halogenated polymers. Its particles are about 10-30 microns in size and it is used as a flame retardant synergist in vinyl plastisols, injection molding compounds ...voir plus BurnEx™ ZTA is a dry powder colloidal antimony Pentoxide and a synergist with PVC and other halogenated polymers. Its particles are about 10-30 microns in size and it is used as a flame retardant synergist in vinyl plastisols, injection molding compounds and calendar compounds. voir moins | |
| Crestabond® M1-04 | Scott Bader | Crestabond® M1-04 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating...voir plus Crestabond® M1-04 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating excellent impact, peel, shear, compressive strength, and fatigue resistance properties across all bonded parts. voir moins | |
| Crestabond® M1-05 | Scott Bader | Crestabond® M1-05 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating...voir plus Crestabond® M1-05 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating excellent impact, peel, shear, compressive strength, and fatigue resistance properties across all bonded parts. voir moins | |
| Crestabond® M1-20 | Scott Bader | Crestabond® M1-20 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating...voir plus Crestabond® M1-20 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating excellent impact, peel, shear, compressive strength, and fatigue resistance properties across all bonded parts. voir moins | |
| Crestabond® M1-30 | Scott Bader | Crestabond® M1-30 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating...voir plus Crestabond® M1-30 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating excellent impact, peel, shear, compressive strength, and fatigue resistance properties across all bonded parts. voir moins | |
| Crestabond® M1-60 | Scott Bader | Crestabond® M1-60 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating...voir plus Crestabond® M1-60 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating excellent impact, peel, shear, compressive strength, and fatigue resistance properties across all bonded parts. voir moins | |
| Crestabond® M1-90 | Scott Bader | Crestabond® M1-90 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating...voir plus Crestabond® M1-90 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating excellent impact, peel, shear, compressive strength, and fatigue resistance properties across all bonded parts. voir moins | |
| Crestabond® M7-05 | Scott Bader | Crestabond® M7-05 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating...voir plus Crestabond® M7-05 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating excellent impact, peel, shear, compressive strength, and fatigue resistance properties across all bonded parts. voir moins | |
| Crestabond® M7-15 | Scott Bader | Crestabond® M7-15 is a primerless two component acrylic adhesive designed for bonding compoisites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstratin...voir plus Crestabond® M7-15 is a primerless two component acrylic adhesive designed for bonding compoisites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating excellent impact, peel, shear, compressive strength, and fatigue resistance properties across all bonded parts. voir moins | |
| Crestomer® 1150PA | Scott Bader | Crestomer® 1150PA is a highly thixotropic structural adhesive that is pre-accelerated and based on unsaturated urethane acrylate in styrene monomer. It displays good adhesion and high elongation at break, shows no sagging on vertical surfaces and has good...voir plus Crestomer® 1150PA is a highly thixotropic structural adhesive that is pre-accelerated and based on unsaturated urethane acrylate in styrene monomer. It displays good adhesion and high elongation at break, shows no sagging on vertical surfaces and has good fatigue and impact resistance properties. Crestomer® 1150PA is mostly used in structural composite applications and has good adhesion to FRP laminates, wood and some metals as well as core materials. Crestomer® 1150PA can be used for bonding diesel tanks and contour joints in FRP components. voir moins | |
| Crestomer® 1151A | Scott Bader | Crestomer® 1151A is a structural adhesive and filleting compound that is fast curing, non-sagging and bonds a variety of substrates with little surface preparation. It has a lower odor than other competing structural adhesives and is based on innovative u...voir plus Crestomer® 1151A is a structural adhesive and filleting compound that is fast curing, non-sagging and bonds a variety of substrates with little surface preparation. It has a lower odor than other competing structural adhesives and is based on innovative urethane acrylate technology. Crestomer® 1151A shows good impact strength and toughness as well as exhibiting good adhesion and gap filling properties that enables the user greater flexibility in design, saving time and money. The adhesive is especially formulated for use in bulk metering systems. voir moins | |
| Crestomer® 1152PA | Scott Bader | Crestomer® 1152PA is a two part pre-accelerated structural adhesive that is highly thixotropic and is based on unsaturated urethane acrylate in styrene monomer. It displays good adhesion to core materials, wood, FRP laminates and some metals and because o...voir plus Crestomer® 1152PA is a two part pre-accelerated structural adhesive that is highly thixotropic and is based on unsaturated urethane acrylate in styrene monomer. It displays good adhesion to core materials, wood, FRP laminates and some metals and because of its good adhesion properties, Crestomer® 1152PA can be recommended for use as a general purpose adhesive. It can also be used to bond contour joints in FRP components, to bond diesel tanks as well as bonding damaged areas or "green" FRP. voir moins | |
| Crestomer® 1153PA | Scott Bader | Crestomer® 1153PA is a structural adhesive that is highly thixotropic and derived from unsaturated urethane acrylate in styrene monomer. The adhesive has a long open time of 90 minutes and shows good adhesion to core materials, metals, wood and FRP lamina...voir plus Crestomer® 1153PA is a structural adhesive that is highly thixotropic and derived from unsaturated urethane acrylate in styrene monomer. The adhesive has a long open time of 90 minutes and shows good adhesion to core materials, metals, wood and FRP laminates. Because of its good adhesion properties, Crestomer® 1153PA is ideal for use as a general purpose adhesive. The adhesive is also used to contour joints in FRP components, to bond "green" FRP and to build up damaged areas. Crestomer® 1153PA is mainly used in structural composite applications. voir moins | |
| Crestomer® 1186PA | Scott Bader | Crestomer® 1186PA is a structural adhesive from unique unsaturated urethane acrylate that shows resistance to crack propagation, toughness and good impact strength. It displays good adhesion to a variety of metals, polymeric materials and ceramics and off...voir plus Crestomer® 1186PA is a structural adhesive from unique unsaturated urethane acrylate that shows resistance to crack propagation, toughness and good impact strength. It displays good adhesion to a variety of metals, polymeric materials and ceramics and offers structural adhesion even when bonding FRP laminates with a 30mm thick bondline. The multi-purpose gap filling structural adhesive is used in a variety of FRP applications. voir moins | |
| Crestomer® 1196PA | Scott Bader | Crestomer® 1196PA is a low denisty core bonding structural adhesive based on unique urethane acrylate technology that displays outstanding strength and toughness. The adhesive is designed to bond core materials like balsa and rigid PVC foam to semi-cured ...voir plus Crestomer® 1196PA is a low denisty core bonding structural adhesive based on unique urethane acrylate technology that displays outstanding strength and toughness. The adhesive is designed to bond core materials like balsa and rigid PVC foam to semi-cured or cured FRP skins. It also displays a tougher and more durable structural bond than a polyester bonding adhesive or a polyester resin/glass structure. Crestomer® 1196PA also exhibits reduced styrene emissions, great weight savings and more improved cosmetics with the ridding of core print through. Crestomer® 1196PA is suited for use in sandwich construction where the needs are for a high impact-resistant, strong and tough structure. voir moins | |
| Crestomer® Advantage 30 | Scott Bader | Crestomer® Advantage 30 is a structural adhesive that is white in color and bonds with a variety of substrates with less surface preparation and a lower odor than competitive materials. It has a quick gel time of 30 minutes and bonded parts can be used in...voir plus Crestomer® Advantage 30 is a structural adhesive that is white in color and bonds with a variety of substrates with less surface preparation and a lower odor than competitive materials. It has a quick gel time of 30 minutes and bonded parts can be used in 2 hours and 20 minutes. It is based on unique urethane acrylate technology and displays good impact strength and toughness. With the strong adhesion and gap filling qualities shown by Crestomer® Advantage 30, great flexibility in design is offered, along with time and cost savings. voir moins | |
| Crystic® BP 621CC 30 | Scott Bader | Crystic® BP 621CC 30 is a preaccelerated, urethane acrylate- and isophthalic polyester-based, high performance bonding paste. It offers high shear strength for bonded joints, eliminating the need for mechanical fixings. This non-sagging, filled compound i...voir plus Crystic® BP 621CC 30 is a preaccelerated, urethane acrylate- and isophthalic polyester-based, high performance bonding paste. It offers high shear strength for bonded joints, eliminating the need for mechanical fixings. This non-sagging, filled compound is specifically designed for the assembly and bonding of GRP mouldings - including panels, inserts, internal frames, composite constructions, and car body components. voir moins | |
| Crystic® BP 621CC 45 | Scott Bader | Crystic® BP 621CC 45 is a preaccelerated, urethane acrylate- and isophthalic polyester-based, high performance bonding paste. It offers high shear strength for bonded joints, eliminating the need for mechanical fixings. This non-sagging, filled compound i...voir plus Crystic® BP 621CC 45 is a preaccelerated, urethane acrylate- and isophthalic polyester-based, high performance bonding paste. It offers high shear strength for bonded joints, eliminating the need for mechanical fixings. This non-sagging, filled compound is specifically designed for the assembly and bonding of GRP mouldings - including panels, inserts, internal frames, composite constructions, and car body components. voir moins | |
| Crystic® BP 621CC 65 | Scott Bader | Crystic® BP 621CC 65 is a preaccelerated, urethane acrylate- and isophthalic polyester-based, high performance bonding paste. It offers high shear strength for bonded joints, eliminating the need for mechanical fixings. This non-sagging, filled compound i...voir plus Crystic® BP 621CC 65 is a preaccelerated, urethane acrylate- and isophthalic polyester-based, high performance bonding paste. It offers high shear strength for bonded joints, eliminating the need for mechanical fixings. This non-sagging, filled compound is specifically designed for the assembly and bonding of GRP mouldings - including panels, inserts, internal frames, composite constructions, and car body components. voir moins | |
| Crystic® BP 621CC White 20 | Scott Bader | Crystic® BP 621CC White 20 is a preaccelerated, urethane acrylate- and isophthalic polyester-based, high performance bonding paste with a final product colour of white. It offers high shear strength for bonded joints, eliminating the need for mechanical f...voir plus Crystic® BP 621CC White 20 is a preaccelerated, urethane acrylate- and isophthalic polyester-based, high performance bonding paste with a final product colour of white. It offers high shear strength for bonded joints, eliminating the need for mechanical fixings. This non-sagging, filled compound is specifically designed for the assembly and bonding of GRP mouldings - including panels, inserts, internal frames, composite constructions, and car body components. voir moins | |
| Crystic® BP 90-78PA | Scott Bader | Crystic® BP 90-78PA is a white, preaccelerated, orthophthalic polyester bonding paste featuring high thixotropy, fast curing, good handling characteristics, and ease of application. This non-sagging, filled compound is specifically designed for the assemb...voir plus Crystic® BP 90-78PA is a white, preaccelerated, orthophthalic polyester bonding paste featuring high thixotropy, fast curing, good handling characteristics, and ease of application. This non-sagging, filled compound is specifically designed for the assembly and bonding of GRP mouldings - including panels, insert frames, ribs, and other non-structural bonding applications. voir moins | |
| Crystic® BP 90-79PA | Scott Bader | Crystic® BP 90-79PA is a grey, preaccelerated, orthophthalic polyester bonding paste featuring high thixotropy, fast curing, good handling characteristics, and ease of application. This non-sagging, filled compound is specifically designed for the assembl...voir plus Crystic® BP 90-79PA is a grey, preaccelerated, orthophthalic polyester bonding paste featuring high thixotropy, fast curing, good handling characteristics, and ease of application. This non-sagging, filled compound is specifically designed for the assembly and bonding of GRP mouldings - including panels, insert frames, ribs, and other non-structural bonding applications. voir moins | |
| Crystic® BP 90-80PA | Scott Bader | Crystic® BP 90-80PA is a pre-accelerated polyester bonding paste, consisting of a viscous, filled compound containing short glass fibers and flexible and low shrink additives. It features high shear strength, high thixotropy, and improved overall mechanic...voir plus Crystic® BP 90-80PA is a pre-accelerated polyester bonding paste, consisting of a viscous, filled compound containing short glass fibers and flexible and low shrink additives. It features high shear strength, high thixotropy, and improved overall mechanical properties. This product is specifically designed for the assembly and bonding of GRP moldings - including internal frames, inserts, ribs, panels, composite constructions, and car body components. voir moins | |
| Crystic® BP 90-82PA | Scott Bader | Crystic® BP 90-82PA is a pre-accelerated polyester bonding paste, consisting of a viscous, white, filled compound containing a flexible additive. It features high shear strength, high thixotropy, and improved impact resistance. This product is specificall...voir plus Crystic® BP 90-82PA is a pre-accelerated polyester bonding paste, consisting of a viscous, white, filled compound containing a flexible additive. It features high shear strength, high thixotropy, and improved impact resistance. This product is specifically designed for the assembly and bonding of GRP moldings - including panels, inserts, internal frames, ribs, composite constructions, and car body components. voir moins | |
| Crystic® BP 90-83PA | Scott Bader | Crystic® BP 90-83PA is a pre-accelerated orthophathlic polyester bonding paste consisting of a non-sagging, filled compound. Key features include ease of application, high thixotropy, and good handling characteristics. This product is specifically design...voir plus Crystic® BP 90-83PA is a pre-accelerated orthophathlic polyester bonding paste consisting of a non-sagging, filled compound. Key features include ease of application, high thixotropy, and good handling characteristics. This product is specifically designed for the assembly and bonding of GRP moldings, including internal frames, inserts, ribs, panels, and other non-structural bonding applications. voir moins | |
| Crystic® BP 90-83PAHV | Scott Bader | Crystic® BP 90-83PAHV is a low exotherm, preaccelerated polyester bonding paste consisting of a viscous, filled compound. It features high thixotropy, low shrink properties, good handling characteristics, and no print through. This product is specifically...voir plus Crystic® BP 90-83PAHV is a low exotherm, preaccelerated polyester bonding paste consisting of a viscous, filled compound. It features high thixotropy, low shrink properties, good handling characteristics, and no print through. This product is specifically designed for the assembly and bonding of GRP mouldings - including panels, inserts, internal frames, ribs, composite constructions, and car body components. voir moins | |
| Crystic® BP 90-84PA | Scott Bader | Crystic® BP 90-84PA is a lightweight, low exotherm, pre-accelerated, orthophthalic polyester bonding paste consisting of a non-sagging compound. It features high thixotropy, low specific gravity, good handling characteristics, and a visual check for effec...voir plus Crystic® BP 90-84PA is a lightweight, low exotherm, pre-accelerated, orthophthalic polyester bonding paste consisting of a non-sagging compound. It features high thixotropy, low specific gravity, good handling characteristics, and a visual check for effective catalyst mix. This product is designed for non-structural applications where gap filling may be a secondary requirement. voir moins | |
| Crystic® BP 91-21PA | Scott Bader | Crystic® BP 91-21PA is a preaccelerated isophthalic polyester bonding paste, in the form of a viscous, filled compound. Benefits include high shear strength, increased water resistance, and improved overall mechanical properties. This product is specifica...voir plus Crystic® BP 91-21PA is a preaccelerated isophthalic polyester bonding paste, in the form of a viscous, filled compound. Benefits include high shear strength, increased water resistance, and improved overall mechanical properties. This product is specifically designed for the assembly and bonding of GRP mouldings - including panels, inserts, internal frames, hull-to-deck assemblies, composite constructions, and car body components. voir moins | |
| Crystic® Scottbond 102PA White | Scott Bader | Crystic® Scottbond 102PA White is a white-colored pourable adhesive paste that is from a specially selected unsaturated polyester resin that is pre-accelerated to offer a convenient working time. The resin-based adhesive has a thixotropic polyester and is...voir plus Crystic® Scottbond 102PA White is a white-colored pourable adhesive paste that is from a specially selected unsaturated polyester resin that is pre-accelerated to offer a convenient working time. The resin-based adhesive has a thixotropic polyester and is meant for bonding GRP to rigid polyurethane foam in sandwich panel systems. Crystic® Scottbond 102PA is also used to bond GRP to plywood and plywood to polyurethane foam. It is designed to ensure ease of application and spreads easily under pressure, presenting a smoother surface in the finished product. However, it should not soak or drain too much into the polyurethane foam. Some penetration is necessary to ensure adhesion. voir moins | |
| Crystic® Scottbond 117PA | Scott Bader | Crystic® Scottbond 117PA is a high quality orthophthalic polyester resin in a gap filling adhesive paste that has been pre-accelerated to offer a convenient working time. The bonding paste is recognized as having the ability to bond most materials that a...voir plus Crystic® Scottbond 117PA is a high quality orthophthalic polyester resin in a gap filling adhesive paste that has been pre-accelerated to offer a convenient working time. The bonding paste is recognized as having the ability to bond most materials that are standard in the GRP industry. Crystic® Scottbond 117PA shows good adhesion to GRP laminates, offering a stronger bond compared to resin and glass fiber in the laminate. voir moins | |
| CUMAR® 105 | Neville Chemical Company | CUMAR® 105 is an aromatic flaked resin that promotes wetting of pigments and fillers, improves resistance to acids and alkalis, maintains thermal stability and enables leafing characteristics for metallic pigments. It is used in high solids solvent-borne ...voir plus CUMAR® 105 is an aromatic flaked resin that promotes wetting of pigments and fillers, improves resistance to acids and alkalis, maintains thermal stability and enables leafing characteristics for metallic pigments. It is used in high solids solvent-borne and epoxy based coatings, IV ink modifiers, adhesives and sealants. voir moins | |
| DYHARD® 100 | AlzChem | DYHARD® 100 is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations...voir plus DYHARD® 100 is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat. voir moins | |
| DYHARD® 100M | AlzChem | DYHARD® 100M is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomeration...voir plus DYHARD® 100M is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat. voir moins | |
| DYHARD® 100S | AlzChem | DYHARD® 100S is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomeration...voir plus DYHARD® 100S is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat. voir moins | |
| DYHARD® 100SF | AlzChem | DYHARD® 100SF is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomeratio...voir plus DYHARD® 100SF is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat. voir moins | |
| DYHARD® 100SH | AlzChem | DYHARD® 100SH is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomeratio...voir plus DYHARD® 100SH is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat. voir moins | |
| DYHARD® A5M30 | AlzChem | DYHARD® A5M30 is widely used as a highly active but also latent accelerator master batch of DYHARD® UR500 in thermosetting epoxy resin formulations. It is especially designed for dust free work environments and easy to mix in productions | |
| DYHARD® CAAB | AlzChem | DYHARD® CAAB is a curing agent for matt finish powder coatings based on epoxy or epoxy-polyester hybrid formulations. Usually it is used together with DYHARD® PIN to realize these matt finishes. For low gloss applications the optimal mixing ratio between ...voir plus DYHARD® CAAB is a curing agent for matt finish powder coatings based on epoxy or epoxy-polyester hybrid formulations. Usually it is used together with DYHARD® PIN to realize these matt finishes. For low gloss applications the optimal mixing ratio between DYHARD® PIN and DYHARD® CAAB is 45:55. This ideal mixture is also available in the ready to use premix DYHARD® PMC for an easy handling. voir moins | |
| DYHARD® D50EP | AlzChem | DYHARD® D50EP is a master batch of 50% DYHARD® 100S in standard bisphenol A epoxy resin (EEW 182-192). Advantages include a dust-free production environment, as well as easier dosage and incorporation. It is cost-effective due to easy handling, and offers...voir plus DYHARD® D50EP is a master batch of 50% DYHARD® 100S in standard bisphenol A epoxy resin (EEW 182-192). Advantages include a dust-free production environment, as well as easier dosage and incorporation. It is cost-effective due to easy handling, and offers the same reactivity, latency, and mechanical properties as the DYHARD® 100 series. This product is recommended for one-component thermosetting epoxy resin formulations for the automotive, sporting goods, and aerospace industry, for adhesives, for encapsulation compounds, and more. voir moins | |
| DYHARD® DF50EP | AlzChem | DYHARD® DF50EP is a master batch of 50% DYHARD® 100SF in standard bisphenol A epoxy resin (EEW 182-192). Products of the DYHARD® master batches are widely used for all kinds of one component thermosetting epoxy resin formulations | |
| DYHARD® Fluid 111 | AlzChem | DYHARD® Fluid 111 is a liquid latent curing agent for thermosetting epoxy resin formulations. | |
| DYHARD® Fluid 151 | AlzChem | DYHARD® Fluid 151 is part of a fully formulated latent epoxy resin system, which has been specifically designed for resin transfer molding applications. | |
| DYHARD® Fluid 212 | AlzChem | DYHARD® Fluid 212 is a liquid latent curing agent. It features a long pot life in the impregnation bath, a rapid cure at 120ºC, optical clearness, and high transparency. This makes it ideal for use in filament winding applications. | |
| DYHARD® Fluid AC11 | AlzChem | DYHARD® Fluid AC11 is part of a fully formulated latent epoxy resin system, which has been specifically designed for resin transfer molding applications. | |
| DYHARD® MCA10 | AlzChem | DYHARD® MCA10 is a special formulated curing agent for low temperature cure, or very fast cure at standard cure temperatures. A formulated 1K-Epoxy resins system with DYHARD® MCA10 still has an acceptable long latency of a few weeks at room temperature. | |
| DYHARD® MCA30 | AlzChem | DYHARD® MCA30 is a non toxic, special formulated curing agent for low temperature cure, high gloss epoxy powder coatings. | |
| DYHARD® MI-C | AlzChem | DYHARD® MI-C is used as a very active but also reasonably latent accelerator in thermosetting epoxy resin formulations. It is typically used for fast curing, or low temperature cure, resin systems with low latency requirements. | |
| DYHARD® MI-FF | AlzChem | DYHARD® MI-FF is used as a very active but also reasonably latent accelerator in thermosetting epoxy resin formulations. It is typically used for fast curing, or low temperature cure, resin systems with low latency requirements. | |
| DYHARD® MIA5 | AlzChem | DYHARD® MIA5 is used as a very active but also reasonably latent accelerator in thermosetting epoxy resin formulations. It’s use is particularly suited in combination with micronized dicyandiamide from the DYHARD® CU-Line, or with the dicyandiamide master...voir plus DYHARD® MIA5 is used as a very active but also reasonably latent accelerator in thermosetting epoxy resin formulations. It’s use is particularly suited in combination with micronized dicyandiamide from the DYHARD® CU-Line, or with the dicyandiamide master batches from the DYHARD® MB-Line. voir moins | |
| DYHARD® OTB | AlzChem | DYHARD® OTB represents a medium reactive curing agent for high gloss epoxy powder coatings. With it’s ideal distribution properties in epoxy resins high quality finishes at low curing temperatures are provided. | |
| DYHARD® PI | AlzChem | DYHARD® PI represents an imidazole based accelerator and/or hardener for thermosetting epoxy resin systems. It has a larger particle size than DYHARD® PI-FF, which is more suitable where lower reactiviy's are needed. | |
| DYHARD® PI-FF | AlzChem | DYHARD® PI-FF represents an imidazole based accelerator and/or hardener for thermosetting epoxy resin systems. DYHARD® PI-FF has a smaller particle size than DYHARD® PI and hence is more suitable where higher reactivity's are needed. | |
| DYHARD® PIN | AlzChem | DYHARD® PIN represents a curing agent which is used in low gloss epoxy and epoxy-polyester hybrid powder coatings. It’s ideal distribution properties in both resin systems provides high quality finishes with a very good color stability. | |
| DYHARD® PMC | AlzChem | DYHARD® PMC represents a matt curing agent for low gloss epoxy and epoxy-polyester hybrid powder coatings. With its ideal distribution properties in both resins systems, high quality finishes with a very good color stability are provided. | |
| DYHARD® RF1000 | AlzChem | DYHARD® RF1000 is part of a fully formulated latent epoxy resin system, which has been specifically designed for resin transfer molding applications. | |
| DYHARD® RF2100 | AlzChem | DYHARD® RF2100 is a low viscos modified bisphenol A epoxy resin. It features a long pot life in the impregnation bath, a rapid cure at 120ºC, optical clearness, and high transparency. This makes it ideal for use in filament winding applications. | |
| DYHARD® UR200 | AlzChem | DYHARD® UR200 represents a latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. | |
| DYHARD® UR300 | AlzChem | DYHARD® UR300 represents a latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. | |
| DYHARD® UR300AB | AlzChem | DYHARD® UR300AB represents a latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. | |
| DYHARD® UR400 | AlzChem | DYHARD® UR400 represents a bi-functional, micronized accelerator based on a substituted urea. Being an active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in...voir plus DYHARD® UR400 represents a bi-functional, micronized accelerator based on a substituted urea. Being an active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. voir moins | |
| DYHARD® UR500 | AlzChem | DYHARD® UR500 represents a bi-functional, micronized accelerator based on a substituted urea. Being a highly active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 ser...voir plus DYHARD® UR500 represents a bi-functional, micronized accelerator based on a substituted urea. Being a highly active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. voir moins | |
| DYHARD® UR700 | AlzChem | DYHARD® UR700 represents a highly latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. In addit...voir plus DYHARD® UR700 represents a highly latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. In addition, DYHARD® UR700 is soluble in water, which makes it a preferred accelerator for waterborne applications. voir moins | |
| DYHARD® UR800 | AlzChem | DYHARD® UR800 represents a very latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. | |
| DYHARD® URAcc13 | AlzChem | DYHARD® URAcc13 represents a formulated latent, micronized accelerator based on a substituted urea. Being an active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 ser...voir plus DYHARD® URAcc13 represents a formulated latent, micronized accelerator based on a substituted urea. Being an active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. voir moins | |
| DYHARD® URAcc57 | AlzChem | DYHARD® URAcc57 represents a latent, micronized accelerator based on a substituted urea. Being a very highly active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 ser...voir plus DYHARD® URAcc57 represents a latent, micronized accelerator based on a substituted urea. Being a very highly active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. voir moins | |
| EPODIL® 742 | Evonik Operations GmbH, BL Crosslinkers | An epoxy resin system modifier. | Request Sample |
| EPODIL® 748 REACTIVE DILUENT | Evonik Operations GmbH, BL Crosslinkers | General-purpose diluent. Low toxicity and low vapor pressure. Slows reactivity. Good viscosity reduction, improves flexibility, and improves adhesion to no-polar surfaces. | Request Sample |
| EPODIL® 749 REACTIVE DILUENT | Evonik Operations GmbH, BL Crosslinkers | Low volatility diluent. Low reduction in physical properties and reactivity. Used in civil engineering applications, electrical potting, and encapsulation. | Request Sample |
| EPODIL® 759 Reactive Diluent | Evonik Operations GmbH, BL Crosslinkers | EPODIL® 759 Reactive Diluent is an aliphatic glycidyl ether (C12– C13). The product is a monofunctional reactive diluent used to reduce the viscosity of epoxy resin systems. Since monofunctional diluents, in general, cause molecular weight chain terminati...voir plus EPODIL® 759 Reactive Diluent is an aliphatic glycidyl ether (C12– C13). The product is a monofunctional reactive diluent used to reduce the viscosity of epoxy resin systems. Since monofunctional diluents, in general, cause molecular weight chain termination, the minimum amount necessary to achieve the desired viscosity reduction should be used. voir moins | Request Sample |
| EPODIL® LV5 DILUENT | Evonik Operations GmbH, BL Crosslinkers | Epodil LV5 diluent is a chemically inert, low viscosity liquid hydrocarbon resin. It is soluble in and compatible with a wide variety of epoxy resins as well as most curing agents. | Request Sample |
| HB-132 | Guangzhou GBS High-Tech & Industry Co., Ltd. | HB-132 is a structure-modified hydrophobic fumed silica. Featuring low thickening, excellent processability, and good free-flow characteristics, it is well-suited for transparent powder systems. This product is designed for use in adhesives & sealants, de...voir plus HB-132 is a structure-modified hydrophobic fumed silica. Featuring low thickening, excellent processability, and good free-flow characteristics, it is well-suited for transparent powder systems. This product is designed for use in adhesives & sealants, defoamers, and printing toners. voir moins | |
| HB-135 | Guangzhou GBS High-Tech & Industry Co., Ltd. | HB-135 is a structure-modified hydrophobic fumed silica. Featuring low thickening, excellent processability, and good free-flow characteristics, it is well-suited for transparent powder systems. This product is designed for use in adhesives & sealants, de...voir plus HB-135 is a structure-modified hydrophobic fumed silica. Featuring low thickening, excellent processability, and good free-flow characteristics, it is well-suited for transparent powder systems. This product is designed for use in adhesives & sealants, defoamers, and printing toners. voir moins | |
| HB-139 | Guangzhou GBS High-Tech & Industry Co., Ltd. | HB-139 is a structure-modified hydrophobic fumed silica. Featuring good thickening effects, high water resistance, and good free-flow characteristics, it is well-suited for transparent powder systems. This product is designed for use in coatings, inks, an...voir plus HB-139 is a structure-modified hydrophobic fumed silica. Featuring good thickening effects, high water resistance, and good free-flow characteristics, it is well-suited for transparent powder systems. This product is designed for use in coatings, inks, and adhesives & sealants. voir moins | |
| HB-612 | Guangzhou GBS High-Tech & Industry Co., Ltd. | HB-612 is a hydrophobic fumed silica, in the form of a high purity white colloidal powder, which has been treated with HMDS. It features good rheological control, anti-sagging, free-flow, and anti-caking characteristics. This product is designed for use i...voir plus HB-612 is a hydrophobic fumed silica, in the form of a high purity white colloidal powder, which has been treated with HMDS. It features good rheological control, anti-sagging, free-flow, and anti-caking characteristics. This product is designed for use in adhesives & sealants and paints & coatings. voir moins | |
| HB-615 | Guangzhou GBS High-Tech & Industry Co., Ltd. | HB-615 is a hydrophobic fumed silica, in the form of a high purity white colloidal powder, which has been treated with HMDS. It features high hydrophobicity, thixotropic stability, and free-flow & anti-caking properties. This product is designed for use i...voir plus HB-615 is a hydrophobic fumed silica, in the form of a high purity white colloidal powder, which has been treated with HMDS. It features high hydrophobicity, thixotropic stability, and free-flow & anti-caking properties. This product is designed for use in coatings, inks, negative toners, and adhesives & sealants. voir moins | |
| HB-620 | Guangzhou GBS High-Tech & Industry Co., Ltd. | HB-620 is a hydrophobic fumed silica, in the form of a high purity white colloidal powder, which has been treated with HMDS. It features high hydrophobicity, thixotropic stability, and free-flow & anti-caking properties. This product is designed for use i...voir plus HB-620 is a hydrophobic fumed silica, in the form of a high purity white colloidal powder, which has been treated with HMDS. It features high hydrophobicity, thixotropic stability, and free-flow & anti-caking properties. This product is designed for use in paints & coatings, inks, and adhesives & sealants. voir moins | |
| HL-150 | Guangzhou GBS High-Tech & Industry Co., Ltd. | HL-150 is a hydrophilic fumed silica, in the form of a high purity white colloidal powder, which provides good rheological & thixotropic control and improved free-flow & anti-caking characteristics. This product is designed for use in adhesives & sealants...voir plus HL-150 is a hydrophilic fumed silica, in the form of a high purity white colloidal powder, which provides good rheological & thixotropic control and improved free-flow & anti-caking characteristics. This product is designed for use in adhesives & sealants and paints & coatings. voir moins | |
| HL-200 | Guangzhou GBS High-Tech & Industry Co., Ltd. | HL-200 is a hydrophilic fumed silica, in the form of a high purity white colloidal powder, which provides high transparency, good rheological & thixotropic control, and improved free-flow & anti-caking characteristics. This product is designed for use in ...voir plus HL-200 is a hydrophilic fumed silica, in the form of a high purity white colloidal powder, which provides high transparency, good rheological & thixotropic control, and improved free-flow & anti-caking characteristics. This product is designed for use in paints & coatings, adhesives & sealants, and printing inks. voir moins | |
| HL-300 | Guangzhou GBS High-Tech & Industry Co., Ltd. | HL-300 is a hydrophilic fumed silica, in the form of a high purity white colloidal powder, which provides good rheological & thixotropic control, improved free-flow & anti-caking characteristics, and excellent transparency. This product is designed for us...voir plus HL-300 is a hydrophilic fumed silica, in the form of a high purity white colloidal powder, which provides good rheological & thixotropic control, improved free-flow & anti-caking characteristics, and excellent transparency. This product is designed for use in paints & coatings, adhesives & sealants, and printing inks. voir moins | |
| HL-380 | Guangzhou GBS High-Tech & Industry Co., Ltd. | HL-380 is a hydrophilic fumed silica, in the form of a high purity white colloidal powder, which provides good rheological & thixotropic control, improved free-flow & anti-caking characteristics, and excellent transparency. This product is designed for us...voir plus HL-380 is a hydrophilic fumed silica, in the form of a high purity white colloidal powder, which provides good rheological & thixotropic control, improved free-flow & anti-caking characteristics, and excellent transparency. This product is designed for use in paints & coatings, adhesives & sealants, and printing inks. voir moins | |
| HYBRIDUR® 580 Polymer Dispersion | Evonik Operations GmbH, BL Crosslinkers | HYBRIDUR® 580 Polymer Dispersion is an acrylic-urethane hybrid polymer dispersion. Cost-effective alternative to standard polyurethane dispersions. Provides outstanding adhesion to a wide variety of substrates, superior abrasion, and chemical and stain re...voir plus HYBRIDUR® 580 Polymer Dispersion is an acrylic-urethane hybrid polymer dispersion. Cost-effective alternative to standard polyurethane dispersions. Provides outstanding adhesion to a wide variety of substrates, superior abrasion, and chemical and stain resistance. voir moins | Request Sample |
