| BurnEx™ 30-107 | Nyacol Nano Technology | BurnEx™ 30-107 is a flame retardant synergist for polyvinyl chloride and other materials employing halogens as its primary flame retardant. It is composed of agglomerated particles in the range of 10 to 40 microns and is used in textiles, adhesives, coati...voir plus BurnEx™ 30-107 is a flame retardant synergist for polyvinyl chloride and other materials employing halogens as its primary flame retardant. It is composed of agglomerated particles in the range of 10 to 40 microns and is used in textiles, adhesives, coatings, and water-based systems. voir moins | |
| BurnEx™ A1582 | Nyacol Nano Technology | BurnEx™ A1582, a Nano-Dispersible Dry Powder Colloidal Antimony Pentoxide Flame Retardant Additive, is used with halogenated flame retardants in polymers, solvents and adhesives. It has end use applications in flexible vinyl and thermoplastic polyester. | |
| BurnEx™ ADP480 | Nyacol Nano Technology | BurnEx™ ADP480 a nano-dispersible dry powder colloidal antimony Pentoxide flame retardant additive, is used with halogenated flame retardants in polymers, solvents and adhesives. It has end use applications in Polyolefins, HIPS, and Adhesives | |
| BurnEx™ ADP494 | Nyacol Nano Technology | BurnEx™ ADP494, a nano-dispersible dry powder colloidal antimony Pentoxide flame retardant additive, is used with halogenated flame retardants in polymers, solvents and adhesives. It has end use applications in Solution-spun fibers, ABS, Epoxy-ketones. | |
| BurnEx Plus™ A1588LP | Nyacol Nano Technology | BurnEx Plus™ A1588LP is a dry powder colloidal antimony pentoxide (Sb2O5) for use as a synergist with halogenated flame retardants in high performance epoxy. Its ultimate particle size is 0.03 microns and it has applications in textiles, adhesives, coatin...voir plus BurnEx Plus™ A1588LP is a dry powder colloidal antimony pentoxide (Sb2O5) for use as a synergist with halogenated flame retardants in high performance epoxy. Its ultimate particle size is 0.03 microns and it has applications in textiles, adhesives, coatings, and water-based systems. voir moins | |
| BurnEx Plus™ A1590 | Nyacol Nano Technology | BurnEx Plus™ A1590 is a dry powder colloidal antimony pentoxide (Sb2O5) for use as a synergist with halogenated flame retardants in high performance epoxy. Its ultimate particle size is 0.06 microns and it has applications in textiles, adhesives, coatings...voir plus BurnEx Plus™ A1590 is a dry powder colloidal antimony pentoxide (Sb2O5) for use as a synergist with halogenated flame retardants in high performance epoxy. Its ultimate particle size is 0.06 microns and it has applications in textiles, adhesives, coatings, and water-based systems. voir moins | |
| BurnEx™ ZTA | Nyacol Nano Technology | BurnEx™ ZTA is a dry powder colloidal antimony Pentoxide and a synergist with PVC and other halogenated polymers. Its particles are about 10-30 microns in size and it is used as a flame retardant synergist in vinyl plastisols, injection molding compounds ...voir plus BurnEx™ ZTA is a dry powder colloidal antimony Pentoxide and a synergist with PVC and other halogenated polymers. Its particles are about 10-30 microns in size and it is used as a flame retardant synergist in vinyl plastisols, injection molding compounds and calendar compounds. voir moins | |
| Crestabond® M1-04 | Scott Bader | Crestabond® M1-04 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating...voir plus Crestabond® M1-04 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating excellent impact, peel, shear, compressive strength, and fatigue resistance properties across all bonded parts. voir moins | |
| Crestabond® M1-05 | Scott Bader | Crestabond® M1-05 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating...voir plus Crestabond® M1-05 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating excellent impact, peel, shear, compressive strength, and fatigue resistance properties across all bonded parts. voir moins | |
| Crestabond® M1-20 | Scott Bader | Crestabond® M1-20 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating...voir plus Crestabond® M1-20 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating excellent impact, peel, shear, compressive strength, and fatigue resistance properties across all bonded parts. voir moins | |
| Crestabond® M1-30 | Scott Bader | Crestabond® M1-30 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating...voir plus Crestabond® M1-30 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating excellent impact, peel, shear, compressive strength, and fatigue resistance properties across all bonded parts. voir moins | |
| Crestabond® M1-60 | Scott Bader | Crestabond® M1-60 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating...voir plus Crestabond® M1-60 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating excellent impact, peel, shear, compressive strength, and fatigue resistance properties across all bonded parts. voir moins | |
| Crestabond® M1-90 | Scott Bader | Crestabond® M1-90 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating...voir plus Crestabond® M1-90 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating excellent impact, peel, shear, compressive strength, and fatigue resistance properties across all bonded parts. voir moins | |
| Crestabond® M7-05 | Scott Bader | Crestabond® M7-05 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating...voir plus Crestabond® M7-05 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating excellent impact, peel, shear, compressive strength, and fatigue resistance properties across all bonded parts. voir moins | |
| Crestabond® M7-15 | Scott Bader | Crestabond® M7-15 is a primerless two component acrylic adhesive designed for bonding compoisites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstratin...voir plus Crestabond® M7-15 is a primerless two component acrylic adhesive designed for bonding compoisites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating excellent impact, peel, shear, compressive strength, and fatigue resistance properties across all bonded parts. voir moins | |
| Crestomer® 1150PA | Scott Bader | Crestomer® 1150PA is a highly thixotropic structural adhesive that is pre-accelerated and based on unsaturated urethane acrylate in styrene monomer. It displays good adhesion and high elongation at break, shows no sagging on vertical surfaces and has good...voir plus Crestomer® 1150PA is a highly thixotropic structural adhesive that is pre-accelerated and based on unsaturated urethane acrylate in styrene monomer. It displays good adhesion and high elongation at break, shows no sagging on vertical surfaces and has good fatigue and impact resistance properties. Crestomer® 1150PA is mostly used in structural composite applications and has good adhesion to FRP laminates, wood and some metals as well as core materials. Crestomer® 1150PA can be used for bonding diesel tanks and contour joints in FRP components. voir moins | |
| Crestomer® 1151A | Scott Bader | Crestomer® 1151A is a structural adhesive and filleting compound that is fast curing, non-sagging and bonds a variety of substrates with little surface preparation. It has a lower odor than other competing structural adhesives and is based on innovative u...voir plus Crestomer® 1151A is a structural adhesive and filleting compound that is fast curing, non-sagging and bonds a variety of substrates with little surface preparation. It has a lower odor than other competing structural adhesives and is based on innovative urethane acrylate technology. Crestomer® 1151A shows good impact strength and toughness as well as exhibiting good adhesion and gap filling properties that enables the user greater flexibility in design, saving time and money. The adhesive is especially formulated for use in bulk metering systems. voir moins | |
| Crestomer® 1152PA | Scott Bader | Crestomer® 1152PA is a two part pre-accelerated structural adhesive that is highly thixotropic and is based on unsaturated urethane acrylate in styrene monomer. It displays good adhesion to core materials, wood, FRP laminates and some metals and because o...voir plus Crestomer® 1152PA is a two part pre-accelerated structural adhesive that is highly thixotropic and is based on unsaturated urethane acrylate in styrene monomer. It displays good adhesion to core materials, wood, FRP laminates and some metals and because of its good adhesion properties, Crestomer® 1152PA can be recommended for use as a general purpose adhesive. It can also be used to bond contour joints in FRP components, to bond diesel tanks as well as bonding damaged areas or "green" FRP. voir moins | |
| Crestomer® 1153PA | Scott Bader | Crestomer® 1153PA is a structural adhesive that is highly thixotropic and derived from unsaturated urethane acrylate in styrene monomer. The adhesive has a long open time of 90 minutes and shows good adhesion to core materials, metals, wood and FRP lamina...voir plus Crestomer® 1153PA is a structural adhesive that is highly thixotropic and derived from unsaturated urethane acrylate in styrene monomer. The adhesive has a long open time of 90 minutes and shows good adhesion to core materials, metals, wood and FRP laminates. Because of its good adhesion properties, Crestomer® 1153PA is ideal for use as a general purpose adhesive. The adhesive is also used to contour joints in FRP components, to bond "green" FRP and to build up damaged areas. Crestomer® 1153PA is mainly used in structural composite applications. voir moins | |
| Crestomer® 1186PA | Scott Bader | Crestomer® 1186PA is a structural adhesive from unique unsaturated urethane acrylate that shows resistance to crack propagation, toughness and good impact strength. It displays good adhesion to a variety of metals, polymeric materials and ceramics and off...voir plus Crestomer® 1186PA is a structural adhesive from unique unsaturated urethane acrylate that shows resistance to crack propagation, toughness and good impact strength. It displays good adhesion to a variety of metals, polymeric materials and ceramics and offers structural adhesion even when bonding FRP laminates with a 30mm thick bondline. The multi-purpose gap filling structural adhesive is used in a variety of FRP applications. voir moins | |
| Crestomer® 1196PA | Scott Bader | Crestomer® 1196PA is a low denisty core bonding structural adhesive based on unique urethane acrylate technology that displays outstanding strength and toughness. The adhesive is designed to bond core materials like balsa and rigid PVC foam to semi-cured ...voir plus Crestomer® 1196PA is a low denisty core bonding structural adhesive based on unique urethane acrylate technology that displays outstanding strength and toughness. The adhesive is designed to bond core materials like balsa and rigid PVC foam to semi-cured or cured FRP skins. It also displays a tougher and more durable structural bond than a polyester bonding adhesive or a polyester resin/glass structure. Crestomer® 1196PA also exhibits reduced styrene emissions, great weight savings and more improved cosmetics with the ridding of core print through. Crestomer® 1196PA is suited for use in sandwich construction where the needs are for a high impact-resistant, strong and tough structure. voir moins | |
| Crestomer® Advantage 30 | Scott Bader | Crestomer® Advantage 30 is a structural adhesive that is white in color and bonds with a variety of substrates with less surface preparation and a lower odor than competitive materials. It has a quick gel time of 30 minutes and bonded parts can be used in...voir plus Crestomer® Advantage 30 is a structural adhesive that is white in color and bonds with a variety of substrates with less surface preparation and a lower odor than competitive materials. It has a quick gel time of 30 minutes and bonded parts can be used in 2 hours and 20 minutes. It is based on unique urethane acrylate technology and displays good impact strength and toughness. With the strong adhesion and gap filling qualities shown by Crestomer® Advantage 30, great flexibility in design is offered, along with time and cost savings. voir moins | |
| Crystic® BP 621CC 30 | Scott Bader | Crystic® BP 621CC 30 is a preaccelerated, urethane acrylate- and isophthalic polyester-based, high performance bonding paste. It offers high shear strength for bonded joints, eliminating the need for mechanical fixings. This non-sagging, filled compound i...voir plus Crystic® BP 621CC 30 is a preaccelerated, urethane acrylate- and isophthalic polyester-based, high performance bonding paste. It offers high shear strength for bonded joints, eliminating the need for mechanical fixings. This non-sagging, filled compound is specifically designed for the assembly and bonding of GRP mouldings - including panels, inserts, internal frames, composite constructions, and car body components. voir moins | |
| Crystic® BP 621CC 45 | Scott Bader | Crystic® BP 621CC 45 is a preaccelerated, urethane acrylate- and isophthalic polyester-based, high performance bonding paste. It offers high shear strength for bonded joints, eliminating the need for mechanical fixings. This non-sagging, filled compound i...voir plus Crystic® BP 621CC 45 is a preaccelerated, urethane acrylate- and isophthalic polyester-based, high performance bonding paste. It offers high shear strength for bonded joints, eliminating the need for mechanical fixings. This non-sagging, filled compound is specifically designed for the assembly and bonding of GRP mouldings - including panels, inserts, internal frames, composite constructions, and car body components. voir moins | |
| Crystic® BP 621CC 65 | Scott Bader | Crystic® BP 621CC 65 is a preaccelerated, urethane acrylate- and isophthalic polyester-based, high performance bonding paste. It offers high shear strength for bonded joints, eliminating the need for mechanical fixings. This non-sagging, filled compound i...voir plus Crystic® BP 621CC 65 is a preaccelerated, urethane acrylate- and isophthalic polyester-based, high performance bonding paste. It offers high shear strength for bonded joints, eliminating the need for mechanical fixings. This non-sagging, filled compound is specifically designed for the assembly and bonding of GRP mouldings - including panels, inserts, internal frames, composite constructions, and car body components. voir moins | |
| Crystic® BP 621CC White 20 | Scott Bader | Crystic® BP 621CC White 20 is a preaccelerated, urethane acrylate- and isophthalic polyester-based, high performance bonding paste with a final product colour of white. It offers high shear strength for bonded joints, eliminating the need for mechanical f...voir plus Crystic® BP 621CC White 20 is a preaccelerated, urethane acrylate- and isophthalic polyester-based, high performance bonding paste with a final product colour of white. It offers high shear strength for bonded joints, eliminating the need for mechanical fixings. This non-sagging, filled compound is specifically designed for the assembly and bonding of GRP mouldings - including panels, inserts, internal frames, composite constructions, and car body components. voir moins | |
| Crystic® BP 90-78PA | Scott Bader | Crystic® BP 90-78PA is a white, preaccelerated, orthophthalic polyester bonding paste featuring high thixotropy, fast curing, good handling characteristics, and ease of application. This non-sagging, filled compound is specifically designed for the assemb...voir plus Crystic® BP 90-78PA is a white, preaccelerated, orthophthalic polyester bonding paste featuring high thixotropy, fast curing, good handling characteristics, and ease of application. This non-sagging, filled compound is specifically designed for the assembly and bonding of GRP mouldings - including panels, insert frames, ribs, and other non-structural bonding applications. voir moins | |
| Crystic® BP 90-79PA | Scott Bader | Crystic® BP 90-79PA is a grey, preaccelerated, orthophthalic polyester bonding paste featuring high thixotropy, fast curing, good handling characteristics, and ease of application. This non-sagging, filled compound is specifically designed for the assembl...voir plus Crystic® BP 90-79PA is a grey, preaccelerated, orthophthalic polyester bonding paste featuring high thixotropy, fast curing, good handling characteristics, and ease of application. This non-sagging, filled compound is specifically designed for the assembly and bonding of GRP mouldings - including panels, insert frames, ribs, and other non-structural bonding applications. voir moins | |
| Crystic® BP 90-80PA | Scott Bader | Crystic® BP 90-80PA is a pre-accelerated polyester bonding paste, consisting of a viscous, filled compound containing short glass fibers and flexible and low shrink additives. It features high shear strength, high thixotropy, and improved overall mechanic...voir plus Crystic® BP 90-80PA is a pre-accelerated polyester bonding paste, consisting of a viscous, filled compound containing short glass fibers and flexible and low shrink additives. It features high shear strength, high thixotropy, and improved overall mechanical properties. This product is specifically designed for the assembly and bonding of GRP moldings - including internal frames, inserts, ribs, panels, composite constructions, and car body components. voir moins | |
| Crystic® BP 90-82PA | Scott Bader | Crystic® BP 90-82PA is a pre-accelerated polyester bonding paste, consisting of a viscous, white, filled compound containing a flexible additive. It features high shear strength, high thixotropy, and improved impact resistance. This product is specificall...voir plus Crystic® BP 90-82PA is a pre-accelerated polyester bonding paste, consisting of a viscous, white, filled compound containing a flexible additive. It features high shear strength, high thixotropy, and improved impact resistance. This product is specifically designed for the assembly and bonding of GRP moldings - including panels, inserts, internal frames, ribs, composite constructions, and car body components. voir moins | |
| Crystic® BP 90-83PA | Scott Bader | Crystic® BP 90-83PA is a pre-accelerated orthophathlic polyester bonding paste consisting of a non-sagging, filled compound. Key features include ease of application, high thixotropy, and good handling characteristics. This product is specifically design...voir plus Crystic® BP 90-83PA is a pre-accelerated orthophathlic polyester bonding paste consisting of a non-sagging, filled compound. Key features include ease of application, high thixotropy, and good handling characteristics. This product is specifically designed for the assembly and bonding of GRP moldings, including internal frames, inserts, ribs, panels, and other non-structural bonding applications. voir moins | |
| Crystic® BP 90-83PAHV | Scott Bader | Crystic® BP 90-83PAHV is a low exotherm, preaccelerated polyester bonding paste consisting of a viscous, filled compound. It features high thixotropy, low shrink properties, good handling characteristics, and no print through. This product is specifically...voir plus Crystic® BP 90-83PAHV is a low exotherm, preaccelerated polyester bonding paste consisting of a viscous, filled compound. It features high thixotropy, low shrink properties, good handling characteristics, and no print through. This product is specifically designed for the assembly and bonding of GRP mouldings - including panels, inserts, internal frames, ribs, composite constructions, and car body components. voir moins | |
| Crystic® BP 90-84PA | Scott Bader | Crystic® BP 90-84PA is a lightweight, low exotherm, pre-accelerated, orthophthalic polyester bonding paste consisting of a non-sagging compound. It features high thixotropy, low specific gravity, good handling characteristics, and a visual check for effec...voir plus Crystic® BP 90-84PA is a lightweight, low exotherm, pre-accelerated, orthophthalic polyester bonding paste consisting of a non-sagging compound. It features high thixotropy, low specific gravity, good handling characteristics, and a visual check for effective catalyst mix. This product is designed for non-structural applications where gap filling may be a secondary requirement. voir moins | |
| Crystic® BP 91-21PA | Scott Bader | Crystic® BP 91-21PA is a preaccelerated isophthalic polyester bonding paste, in the form of a viscous, filled compound. Benefits include high shear strength, increased water resistance, and improved overall mechanical properties. This product is specifica...voir plus Crystic® BP 91-21PA is a preaccelerated isophthalic polyester bonding paste, in the form of a viscous, filled compound. Benefits include high shear strength, increased water resistance, and improved overall mechanical properties. This product is specifically designed for the assembly and bonding of GRP mouldings - including panels, inserts, internal frames, hull-to-deck assemblies, composite constructions, and car body components. voir moins | |
| Crystic® Scottbond 102PA White | Scott Bader | Crystic® Scottbond 102PA White is a white-colored pourable adhesive paste that is from a specially selected unsaturated polyester resin that is pre-accelerated to offer a convenient working time. The resin-based adhesive has a thixotropic polyester and is...voir plus Crystic® Scottbond 102PA White is a white-colored pourable adhesive paste that is from a specially selected unsaturated polyester resin that is pre-accelerated to offer a convenient working time. The resin-based adhesive has a thixotropic polyester and is meant for bonding GRP to rigid polyurethane foam in sandwich panel systems. Crystic® Scottbond 102PA is also used to bond GRP to plywood and plywood to polyurethane foam. It is designed to ensure ease of application and spreads easily under pressure, presenting a smoother surface in the finished product. However, it should not soak or drain too much into the polyurethane foam. Some penetration is necessary to ensure adhesion. voir moins | |
| Crystic® Scottbond 117PA | Scott Bader | Crystic® Scottbond 117PA is a high quality orthophthalic polyester resin in a gap filling adhesive paste that has been pre-accelerated to offer a convenient working time. The bonding paste is recognized as having the ability to bond most materials that a...voir plus Crystic® Scottbond 117PA is a high quality orthophthalic polyester resin in a gap filling adhesive paste that has been pre-accelerated to offer a convenient working time. The bonding paste is recognized as having the ability to bond most materials that are standard in the GRP industry. Crystic® Scottbond 117PA shows good adhesion to GRP laminates, offering a stronger bond compared to resin and glass fiber in the laminate. voir moins | |
| CUMAR® 105 | Neville Chemical Company | CUMAR® 105 is an aromatic flaked resin that promotes wetting of pigments and fillers, improves resistance to acids and alkalis, maintains thermal stability and enables leafing characteristics for metallic pigments. It is used in high solids solvent-borne ...voir plus CUMAR® 105 is an aromatic flaked resin that promotes wetting of pigments and fillers, improves resistance to acids and alkalis, maintains thermal stability and enables leafing characteristics for metallic pigments. It is used in high solids solvent-borne and epoxy based coatings, IV ink modifiers, adhesives and sealants. voir moins | |
| DYHARD® 100 | AlzChem | DYHARD® 100 is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations...voir plus DYHARD® 100 is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat. voir moins | |
| DYHARD® 100M | AlzChem | DYHARD® 100M is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomeration...voir plus DYHARD® 100M is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat. voir moins | |
| DYHARD® 100S | AlzChem | DYHARD® 100S is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomeration...voir plus DYHARD® 100S is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat. voir moins | |
| DYHARD® 100SF | AlzChem | DYHARD® 100SF is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomeratio...voir plus DYHARD® 100SF is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat. voir moins | |
| DYHARD® 100SH | AlzChem | DYHARD® 100SH is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomeratio...voir plus DYHARD® 100SH is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat. voir moins | |
| DYHARD® A5M30 | AlzChem | DYHARD® A5M30 is widely used as a highly active but also latent accelerator master batch of DYHARD® UR500 in thermosetting epoxy resin formulations. It is especially designed for dust free work environments and easy to mix in productions | |
| DYHARD® CAAB | AlzChem | DYHARD® CAAB is a curing agent for matt finish powder coatings based on epoxy or epoxy-polyester hybrid formulations. Usually it is used together with DYHARD® PIN to realize these matt finishes. For low gloss applications the optimal mixing ratio between ...voir plus DYHARD® CAAB is a curing agent for matt finish powder coatings based on epoxy or epoxy-polyester hybrid formulations. Usually it is used together with DYHARD® PIN to realize these matt finishes. For low gloss applications the optimal mixing ratio between DYHARD® PIN and DYHARD® CAAB is 45:55. This ideal mixture is also available in the ready to use premix DYHARD® PMC for an easy handling. voir moins | |
| DYHARD® D50EP | AlzChem | DYHARD® D50EP is a master batch of 50% DYHARD® 100S in standard bisphenol A epoxy resin (EEW 182-192). Advantages include a dust-free production environment, as well as easier dosage and incorporation. It is cost-effective due to easy handling, and offers...voir plus DYHARD® D50EP is a master batch of 50% DYHARD® 100S in standard bisphenol A epoxy resin (EEW 182-192). Advantages include a dust-free production environment, as well as easier dosage and incorporation. It is cost-effective due to easy handling, and offers the same reactivity, latency, and mechanical properties as the DYHARD® 100 series. This product is recommended for one-component thermosetting epoxy resin formulations for the automotive, sporting goods, and aerospace industry, for adhesives, for encapsulation compounds, and more. voir moins | |
| DYHARD® DF50EP | AlzChem | DYHARD® DF50EP is a master batch of 50% DYHARD® 100SF in standard bisphenol A epoxy resin (EEW 182-192). Products of the DYHARD® master batches are widely used for all kinds of one component thermosetting epoxy resin formulations | |
| DYHARD® Fluid 111 | AlzChem | DYHARD® Fluid 111 is a liquid latent curing agent for thermosetting epoxy resin formulations. | |
| DYHARD® Fluid 151 | AlzChem | DYHARD® Fluid 151 is part of a fully formulated latent epoxy resin system, which has been specifically designed for resin transfer molding applications. | |
| DYHARD® Fluid 212 | AlzChem | DYHARD® Fluid 212 is a liquid latent curing agent. It features a long pot life in the impregnation bath, a rapid cure at 120ºC, optical clearness, and high transparency. This makes it ideal for use in filament winding applications. | |
| DYHARD® Fluid AC11 | AlzChem | DYHARD® Fluid AC11 is part of a fully formulated latent epoxy resin system, which has been specifically designed for resin transfer molding applications. | |
| DYHARD® MCA10 | AlzChem | DYHARD® MCA10 is a special formulated curing agent for low temperature cure, or very fast cure at standard cure temperatures. A formulated 1K-Epoxy resins system with DYHARD® MCA10 still has an acceptable long latency of a few weeks at room temperature. | |
| DYHARD® MCA30 | AlzChem | DYHARD® MCA30 is a non toxic, special formulated curing agent for low temperature cure, high gloss epoxy powder coatings. | |
| DYHARD® MI-C | AlzChem | DYHARD® MI-C is used as a very active but also reasonably latent accelerator in thermosetting epoxy resin formulations. It is typically used for fast curing, or low temperature cure, resin systems with low latency requirements. | |
| DYHARD® MI-FF | AlzChem | DYHARD® MI-FF is used as a very active but also reasonably latent accelerator in thermosetting epoxy resin formulations. It is typically used for fast curing, or low temperature cure, resin systems with low latency requirements. | |
| DYHARD® MIA5 | AlzChem | DYHARD® MIA5 is used as a very active but also reasonably latent accelerator in thermosetting epoxy resin formulations. It’s use is particularly suited in combination with micronized dicyandiamide from the DYHARD® CU-Line, or with the dicyandiamide master...voir plus DYHARD® MIA5 is used as a very active but also reasonably latent accelerator in thermosetting epoxy resin formulations. It’s use is particularly suited in combination with micronized dicyandiamide from the DYHARD® CU-Line, or with the dicyandiamide master batches from the DYHARD® MB-Line. voir moins | |
| DYHARD® OTB | AlzChem | DYHARD® OTB represents a medium reactive curing agent for high gloss epoxy powder coatings. With it’s ideal distribution properties in epoxy resins high quality finishes at low curing temperatures are provided. | |
| DYHARD® PI | AlzChem | DYHARD® PI represents an imidazole based accelerator and/or hardener for thermosetting epoxy resin systems. It has a larger particle size than DYHARD® PI-FF, which is more suitable where lower reactiviy's are needed. | |
| DYHARD® PI-FF | AlzChem | DYHARD® PI-FF represents an imidazole based accelerator and/or hardener for thermosetting epoxy resin systems. DYHARD® PI-FF has a smaller particle size than DYHARD® PI and hence is more suitable where higher reactivity's are needed. | |
| DYHARD® PIN | AlzChem | DYHARD® PIN represents a curing agent which is used in low gloss epoxy and epoxy-polyester hybrid powder coatings. It’s ideal distribution properties in both resin systems provides high quality finishes with a very good color stability. | |
| DYHARD® PMC | AlzChem | DYHARD® PMC represents a matt curing agent for low gloss epoxy and epoxy-polyester hybrid powder coatings. With its ideal distribution properties in both resins systems, high quality finishes with a very good color stability are provided. | |
| DYHARD® RF1000 | AlzChem | DYHARD® RF1000 is part of a fully formulated latent epoxy resin system, which has been specifically designed for resin transfer molding applications. | |
| DYHARD® RF2100 | AlzChem | DYHARD® RF2100 is a low viscos modified bisphenol A epoxy resin. It features a long pot life in the impregnation bath, a rapid cure at 120ºC, optical clearness, and high transparency. This makes it ideal for use in filament winding applications. | |
| DYHARD® UR200 | AlzChem | DYHARD® UR200 represents a latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. | |
| DYHARD® UR300 | AlzChem | DYHARD® UR300 represents a latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. | |
| DYHARD® UR300AB | AlzChem | DYHARD® UR300AB represents a latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. | |
| DYHARD® UR400 | AlzChem | DYHARD® UR400 represents a bi-functional, micronized accelerator based on a substituted urea. Being an active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in...voir plus DYHARD® UR400 represents a bi-functional, micronized accelerator based on a substituted urea. Being an active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. voir moins | |
| DYHARD® UR500 | AlzChem | DYHARD® UR500 represents a bi-functional, micronized accelerator based on a substituted urea. Being a highly active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 ser...voir plus DYHARD® UR500 represents a bi-functional, micronized accelerator based on a substituted urea. Being a highly active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. voir moins | |
| DYHARD® UR700 | AlzChem | DYHARD® UR700 represents a highly latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. In addit...voir plus DYHARD® UR700 represents a highly latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. In addition, DYHARD® UR700 is soluble in water, which makes it a preferred accelerator for waterborne applications. voir moins | |
| DYHARD® UR800 | AlzChem | DYHARD® UR800 represents a very latent, micronized accelerator based on a substituted urea. Its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. | |
| DYHARD® URAcc13 | AlzChem | DYHARD® URAcc13 represents a formulated latent, micronized accelerator based on a substituted urea. Being an active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 ser...voir plus DYHARD® URAcc13 represents a formulated latent, micronized accelerator based on a substituted urea. Being an active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. voir moins | |
| DYHARD® URAcc57 | AlzChem | DYHARD® URAcc57 represents a latent, micronized accelerator based on a substituted urea. Being a very highly active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 ser...voir plus DYHARD® URAcc57 represents a latent, micronized accelerator based on a substituted urea. Being a very highly active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the DYHARD® 100 series in thermosetting epoxy resin formulations. voir moins | |
| Epoxies® 10-2055I | Epoxies, Etc. | Epoxies® 10-2055I is a light amber semi flexible polyurethane adhesive. Primarily used for bonding a wide variety of plastics and metal substrates with high coefficients of thermal expansion (CTE) and substrates with different CTE's. Epoxies® 10-2055I pro...voir plus Epoxies® 10-2055I is a light amber semi flexible polyurethane adhesive. Primarily used for bonding a wide variety of plastics and metal substrates with high coefficients of thermal expansion (CTE) and substrates with different CTE's. Epoxies® 10-2055I produces a consistency similar to honey with low viscosity handling characteristics and turns thixotropic upon mixing. voir moins | |
| Epoxies® 10-2055P | Epoxies, Etc. | Epoxies® 10-2055P is a light amber semi flexible polyurethane adhesive. Primarily used for bonding a wide variety of plastics and metal substrates with high coefficients of thermal expansion (CTE) and substrates with different CTE's. Epoxies® 10-2055P pro...voir plus Epoxies® 10-2055P is a light amber semi flexible polyurethane adhesive. Primarily used for bonding a wide variety of plastics and metal substrates with high coefficients of thermal expansion (CTE) and substrates with different CTE's. Epoxies® 10-2055P produces a consistency similar to honey with low viscosity handling characteristics and turns thixotropic upon mixing. voir moins | |
| Epoxies® 10-2055PHV | Epoxies, Etc. | Epoxies® 10-2055PHV is a light amber semi flexible polyurethane adhesive. Primarily used for bonding a wide variety of plastics and metal substrates with high coefficients of thermal expansion (CTE) and substrates with different CTE's. Epoxies® 10-2055PHV...voir plus Epoxies® 10-2055PHV is a light amber semi flexible polyurethane adhesive. Primarily used for bonding a wide variety of plastics and metal substrates with high coefficients of thermal expansion (CTE) and substrates with different CTE's. Epoxies® 10-2055PHV produces a consistency similar to grease with low viscosity handling characteristics and turns thixotropic upon mixing. voir moins | |
| Epoxies® 10-2080I | Epoxies, Etc. | Epoxies® 10-2080I is a light amber semi rigid polyurethane adhesive. Primarily used for bonding a wide variety of plastics and metal substrates with high coefficients of thermal expansion (CTE) and substrates with different CTE's. Epoxies® 10-2080I produc...voir plus Epoxies® 10-2080I is a light amber semi rigid polyurethane adhesive. Primarily used for bonding a wide variety of plastics and metal substrates with high coefficients of thermal expansion (CTE) and substrates with different CTE's. Epoxies® 10-2080I produces a consistency similar to honey with low viscosity handling characteristics and turns thixotropic upon mixing. voir moins | |
| Epoxies® 10-2080P | Epoxies, Etc. | Epoxies® 10-2080P is a light amber semi rigid polyurethane adhesive. Primarily used for bonding a wide variety of plastics and metal substrates with high coefficients of thermal expansion (CTE) and substrates with different CTE's. Epoxies® 10-2080P produc...voir plus Epoxies® 10-2080P is a light amber semi rigid polyurethane adhesive. Primarily used for bonding a wide variety of plastics and metal substrates with high coefficients of thermal expansion (CTE) and substrates with different CTE's. Epoxies® 10-2080P produces a consistency similar to honey with low viscosity handling characteristics and turns thixotropic upon mixing. voir moins | |
| Epoxies® 10-2080PHV | Epoxies, Etc. | Epoxies® 10-2080PHV is a light amber semi rigid polyurethane adhesive. Primarily used for bonding a wide variety of plastics and metal substrates with high coefficients of thermal expansion (CTE) and substrates with different CTE's. Epoxies® 10-2080PHV pr...voir plus Epoxies® 10-2080PHV is a light amber semi rigid polyurethane adhesive. Primarily used for bonding a wide variety of plastics and metal substrates with high coefficients of thermal expansion (CTE) and substrates with different CTE's. Epoxies® 10-2080PHV produces a consistency similar to honey with low viscosity handling characteristics and turns thixotropic upon mixing. voir moins | |
| Epoxies® 10-3002 | Epoxies, Etc. | Epoxies® 10-3002 is a clear, high bond strength, high viscosity, epoxy adhesive with outstanding physical, thermal, and electrical insulation properties. It has a non-critical mix ratio and adjustable flexibility that has been formulated for ease in handl...voir plus Epoxies® 10-3002 is a clear, high bond strength, high viscosity, epoxy adhesive with outstanding physical, thermal, and electrical insulation properties. It has a non-critical mix ratio and adjustable flexibility that has been formulated for ease in handling and convenience for the end user. 10-3002 yields high peel strength and excellent tensile strength with thermal shock, impact and vibration resistance. voir moins | |
| Epoxies® 10-3003 | Epoxies, Etc. | Epoxies® 10-3003 is a clear, high bond strength epoxy adhesive with outstanding physical, thermal, and electrical insulation properties. It has a non-critical mix ratio and adjustable flexibility that has been formulated for ease in handling and convenien...voir plus Epoxies® 10-3003 is a clear, high bond strength epoxy adhesive with outstanding physical, thermal, and electrical insulation properties. It has a non-critical mix ratio and adjustable flexibility that has been formulated for ease in handling and convenience for the end user. 10-3003 yields high peel strength and excellent tensile strength with thermal shock, impact and vibration resistance. voir moins | |
| Epoxies® 10-3004 NC | Epoxies, Etc. | Epoxies® 10-3004 NC is a clear, high bond strength, low viscosity, epoxy adhesive with outstanding physical, thermal, and electrical insulation properties. It has a non-critical mix ratio and adjustable flexibility that has been formulated for ease in han...voir plus Epoxies® 10-3004 NC is a clear, high bond strength, low viscosity, epoxy adhesive with outstanding physical, thermal, and electrical insulation properties. It has a non-critical mix ratio and adjustable flexibility that has been formulated for ease in handling and convenience for the end user. 10-3004 NC yields high peel strength and excellent tensile strength with thermal shock, impact and vibration resistance. voir moins | |
| Epoxies® 10-3005 | Epoxies, Etc. | Epoxies® 10-3005 is a clear, low viscosity, high bond strength, epoxy adhesive with a quick setting time of 5 minutes at room temperature. It is well suited for a wide range of electronic, industrial, structural and jewelery applications with great water,...voir plus Epoxies® 10-3005 is a clear, low viscosity, high bond strength, epoxy adhesive with a quick setting time of 5 minutes at room temperature. It is well suited for a wide range of electronic, industrial, structural and jewelery applications with great water, chemical and shock resistance. Epoxies® 10-3005 can be used to bond plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. voir moins | |
| Epoxies® 10-3005 NS | Epoxies, Etc. | Epoxies® 10-3005 NS is a semi-transparent, high bond strength, non-sag epoxy adhesive with a quick setting time of 5 minutes at room temperature. It is well suited for a wide range of electronic, industrial, structural and jewelery applications with great...voir plus Epoxies® 10-3005 NS is a semi-transparent, high bond strength, non-sag epoxy adhesive with a quick setting time of 5 minutes at room temperature. It is well suited for a wide range of electronic, industrial, structural and jewelery applications with great water, chemical and shock resistance. Epoxies® 10-3005 NS can be used to bond plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. voir moins | |
| Epoxies® 10-3008 | Epoxies, Etc. | Epoxies® 10-3008 is a two part, high performance structural epoxy adhesive made of a grey resin and a beige catalyst. It is a flexible adhesive with outstanding lap shear and peel strength and has a great choice for bonding substrates of differing coeffic...voir plus Epoxies® 10-3008 is a two part, high performance structural epoxy adhesive made of a grey resin and a beige catalyst. It is a flexible adhesive with outstanding lap shear and peel strength and has a great choice for bonding substrates of differing coefficients of thermal expansion. Epoxies® 10-3008 is well suited for applications requiring impact and vibration resistance. voir moins | |
| Epoxies® 10-3012 | Epoxies, Etc. | Epoxies® 10-3012 is a clear, high strength, fast setting epoxy adhesive and potting compound that is formulated for high clarity, good impact strength and water resistance. Epoxies® 10-3012 suited for a wide range of jewelry, industrial, structural and el...voir plus Epoxies® 10-3012 is a clear, high strength, fast setting epoxy adhesive and potting compound that is formulated for high clarity, good impact strength and water resistance. Epoxies® 10-3012 suited for a wide range of jewelry, industrial, structural and electrical applications. This adhesive is an excellent choice for field repairs. voir moins | |
| Epoxies® 10-3020 | Epoxies, Etc. | Epoxies® 10-3020 is a clear, low viscosity, high bond strength, epoxy adhesive with a quick setting time of 20 minutes at room temperature. It is well suited for a wide range of electronic, industrial, structural and jewelery applications with great water...voir plus Epoxies® 10-3020 is a clear, low viscosity, high bond strength, epoxy adhesive with a quick setting time of 20 minutes at room temperature. It is well suited for a wide range of electronic, industrial, structural and jewelery applications with great water, chemical and shock resistance. Epoxies® 10-3020 can be used to bond plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. voir moins | |
| Epoxies® 10-3020 NS | Epoxies, Etc. | Epoxies® 10-3020 NS is a semi-transparent, high bond strength, non-sag epoxy adhesive with a quick setting time of 20 minutes at room temperature. It is well suited for a wide range of electronic, industrial, structural and jewelery applications with grea...voir plus Epoxies® 10-3020 NS is a semi-transparent, high bond strength, non-sag epoxy adhesive with a quick setting time of 20 minutes at room temperature. It is well suited for a wide range of electronic, industrial, structural and jewelery applications with great water, chemical and shock resistance. Epoxies® 10-3020 NS can be used to bond plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. voir moins | |
| Epoxies® 10-3044 | Epoxies, Etc. | Epoxies® 10-3044 is a fast curing, two part epoxy adhesive and sealant with great chemical and heat resistance. It is widely used as a stencil and screen adhesive due to its bonding strength and toughness. Epoxies® 10-3044 is well suited to bond polyester...voir plus Epoxies® 10-3044 is a fast curing, two part epoxy adhesive and sealant with great chemical and heat resistance. It is widely used as a stencil and screen adhesive due to its bonding strength and toughness. Epoxies® 10-3044 is well suited to bond polyester mesh to aluminum frames and for the bonding of stainless steel foil to polyester mesh. voir moins | |
| Epoxies® 10-3046 | Epoxies, Etc. | Epoxies® 10-3046 is a clear, low viscosity, high bond strength, epoxy adhesive with a quick setting time of 46 minutes at room temperature. It is well suited for a wide range of electronic, industrial, structural and jewelery applications with great water...voir plus Epoxies® 10-3046 is a clear, low viscosity, high bond strength, epoxy adhesive with a quick setting time of 46 minutes at room temperature. It is well suited for a wide range of electronic, industrial, structural and jewelery applications with great water, chemical and shock resistance. Epoxies® 10-3046 can be used to bond plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. voir moins | |
| Epoxies® 10-3046 NS | Epoxies, Etc. | Epoxies® 10-3046 NS is a semi-transparent, high bond strength, non-sag epoxy adhesive with a quick setting time of 46 minutes at room temperature. It is well suited for a wide range of electronic, industrial, structural and jewelery applications with grea...voir plus Epoxies® 10-3046 NS is a semi-transparent, high bond strength, non-sag epoxy adhesive with a quick setting time of 46 minutes at room temperature. It is well suited for a wide range of electronic, industrial, structural and jewelery applications with great water, chemical and shock resistance. Epoxies® 10-3046 NS can be used to bond plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. voir moins | |
| Epoxies® 10-3062 | Epoxies, Etc. | Epoxies® 10-3062 is a two part epoxy potting compound and adhesive made of a clear resin and an amber curing agent. This product is well suited encapsulating electronics and electrical equipment and can provide good water resistance, adhesion, and toughne...voir plus Epoxies® 10-3062 is a two part epoxy potting compound and adhesive made of a clear resin and an amber curing agent. This product is well suited encapsulating electronics and electrical equipment and can provide good water resistance, adhesion, and toughness. voir moins | |
| Epoxies® 10-3216 | Epoxies, Etc. | Epoxies® 10-3216 is a toughened, flexible, and impact resistant epoxy adhesive. it is a two component system that forms strong structural bonds at room temperature. This unique adhesive system provides high peel and shear strengths. 10-3216 is excellent f...voir plus Epoxies® 10-3216 is a toughened, flexible, and impact resistant epoxy adhesive. it is a two component system that forms strong structural bonds at room temperature. This unique adhesive system provides high peel and shear strengths. 10-3216 is excellent for bonding many metals and woods, most plastics and rubbers and masonry products. This system is designed for electronic, aerospace and other demanding industrial applications. voir moins | |
| Epoxies® 10-3216 TR | Epoxies, Etc. | Epoxies® 10-3216 TR is a translucent, flexible, and impact resistant unfilled epoxy adhesive. It is a two part system that forms strong structural bonds at room temperature. This unique adhesive system provides high peel and shear strengths. 10-3216 TR is...voir plus Epoxies® 10-3216 TR is a translucent, flexible, and impact resistant unfilled epoxy adhesive. It is a two part system that forms strong structural bonds at room temperature. This unique adhesive system provides high peel and shear strengths. 10-3216 TR is excellent for bonding many metals and woods, most plastics and rubbers and masonry products. This system is designed for electronic, aerospace and other demanding industrial applications. voir moins | |
| Epoxies® 10-3713 | Epoxies, Etc. | Epoxies® 10-3713 is a two part, very strong and clear epoxy adhesive designed for a variety of bonding applications. Formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy it forms a crystal clear bond line. 10-3713 is...voir plus Epoxies® 10-3713 is a two part, very strong and clear epoxy adhesive designed for a variety of bonding applications. Formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy it forms a crystal clear bond line. 10-3713 is low in viscosity and therefore offers maximum wetting and penetration of substrates and is well suited to be used anywhere a clear, strong bond is required. voir moins | |
| Epoxies® 10-3782 | Epoxies, Etc. | Epoxies® 10-3782 is a one part, heat cured epoxy adhesive. Grey in color, it is made of a fast setting materials formulated with a very low viscosity. Primarily used in a variety of electronic bonding and potting applications, filer end cap assemblies, ma...voir plus Epoxies® 10-3782 is a one part, heat cured epoxy adhesive. Grey in color, it is made of a fast setting materials formulated with a very low viscosity. Primarily used in a variety of electronic bonding and potting applications, filer end cap assemblies, magnetic bonding applications. It can be used anywhere a tough indestructible bond is required. Epoxies® 10-3782 is well suited for use with a variety of substrates including metals, ceramics, wood, magnets, plastics, glass, etc. voir moins | |
| Epoxies® 10-3783 | Epoxies, Etc. | Epoxies® 10-3783 is a one part, heat cured epoxy adhesive. Grey in color, it is made of a fast setting materials formulated with a medium viscosity. Primarily used in a variety of electronic bonding and potting applications, filer end cap assemblies, magn...voir plus Epoxies® 10-3783 is a one part, heat cured epoxy adhesive. Grey in color, it is made of a fast setting materials formulated with a medium viscosity. Primarily used in a variety of electronic bonding and potting applications, filer end cap assemblies, magnetic bonding applications. It can be used anywhere a tough indestructible bond is required. Epoxies® 10-3783 is well suited for use with a variety of substrates including metals, ceramics, wood, magnets, plastics, glass, etc. voir moins | |
| Epoxies® 10-3784 | Epoxies, Etc. | Epoxies® 10-3784 is a one part, heat cured epoxy adhesive. Grey in color, it is made of a fast setting materials formulated as a non-sag paste. Primarily used in a variety of electronic bonding and potting applications, filer end cap assemblies, magnetic ...voir plus Epoxies® 10-3784 is a one part, heat cured epoxy adhesive. Grey in color, it is made of a fast setting materials formulated as a non-sag paste. Primarily used in a variety of electronic bonding and potting applications, filer end cap assemblies, magnetic bonding applications. It can be used anywhere a tough indestructible bond is required. Epoxies® 10-3784 is well suited for use with a variety of substrates including metals, ceramics, wood, magnets, plastics, glass, etc. voir moins | |
| Epoxies® 20-3004 HV | Epoxies, Etc. | Epoxies® 20-3004 HV is a high viscosity, two part, chemical resistant epoxy system that has been developed for potting, coating and adhesive applications requiring superior chemical resistance. It exhibits outstanding bonds to a variety of substrates incl...voir plus Epoxies® 20-3004 HV is a high viscosity, two part, chemical resistant epoxy system that has been developed for potting, coating and adhesive applications requiring superior chemical resistance. It exhibits outstanding bonds to a variety of substrates including most metals and plastics. 20-3004's high viscosity prevents sagging and is noncorrosive. voir moins | |
| Epoxies® 20-3004 LV | Epoxies, Etc. | Epoxies® 20-3004 LV is a low viscosity, two part, chemical resistant epoxy system that has been developed for potting, coating and adhesive applications requiring superior chemical resistance. It exhibits outstanding bonds to a variety of substrates inclu...voir plus Epoxies® 20-3004 LV is a low viscosity, two part, chemical resistant epoxy system that has been developed for potting, coating and adhesive applications requiring superior chemical resistance. It exhibits outstanding bonds to a variety of substrates including most metals and plastics. 20-3004's low viscosity lends itself to being a self leveling system and is noncorrosive. voir moins | |
| Epoxies® 20-3064 NC | Epoxies, Etc. | Epoxies® 20-3064 NC is a filled, flexible epoxy potting compound and adhesive, developed to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio the hardness can be varied from 60 Shore A to 85 Shore D. 20-3...voir plus Epoxies® 20-3064 NC is a filled, flexible epoxy potting compound and adhesive, developed to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio the hardness can be varied from 60 Shore A to 85 Shore D. 20-3064 NC provides excellent thermal shock resistance and outstanding adhesion. voir moins | |
| Epoxies® 20-3064 NC LV | Epoxies, Etc. | Epoxies® 20-3064 NC LV is a low viscosity, flexible epoxy potting compound and adhesive, developed to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio the hardness can be varied from 60 Shore A to 85 Sho...voir plus Epoxies® 20-3064 NC LV is a low viscosity, flexible epoxy potting compound and adhesive, developed to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio the hardness can be varied from 60 Shore A to 85 Shore D. 20-3064 NC provides excellent thermal shock resistance and outstanding adhesion. voir moins |
