Prospector

Liquid Crystal Polymer (LCP) by Sumitomo Chemical Co., Ltd.

Product Availability Product Description
SUMIKASUPER® E4006L Asia Pacific
SUMIKASUPER E4006L is a Liquid Crystal Polymer (LCP) product filled with glass fiber. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E4000 series are distinguished by their very-high heat resistance and retention of stiffness and strength at temperature above 200°C, meaning they can be used for high-temperature surface-mount reflow soldering. E4000 Series grades are typically processed at 380°C. E4006L is a 30% glass fiber grade with high heat resistance and low mold shrinkage. E4006L is used for injection molded bobbins of various types as well as relay cases and other parts.
SUMIKASUPER® E4008 MR Asia Pacific
SUMIKASUPER E4008 MR is a Liquid Crystal Polymer (LCP) product filled with glass fiber. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E4000 series are distinguished by their very-high heat resistance and retention of stiffness and strength at temperature above 200°C, meaning they can be used for high-temperature surface-mount reflow soldering. E4000 Series grades are typically processed at 380°C. E4008 MR is a 40% glass fiber grade with high heat resistance, high strength, lubrication package. E4008 MR is used for injection molded bobbins of various types as well as relay parts such as sealed relay covers/cases and relay bases and other parts.
SUMIKASUPER® E4008 Asia Pacific
SUMIKASUPER E4008 is a Liquid Crystal Polymer (LCP) product filled with glass fiber. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E4000 series are distinguished by their very-high heat resistance and retention of stiffness and strength at temperature above 200°C, meaning they can be used for high-temperature surface-mount reflow soldering. E4000 Series grades are typically processed at 380°C. E4008 is a 40% glass fiber grade with high heat resistance, high strength. E4008 is used for injection molded bobbins of various types as well as relay parts such as sealed relay covers/cases and relay bases and other parts.
SUMIKASUPER® E4009 Asia Pacific
SUMIKASUPER E4009 is a Liquid Crystal Polymer (LCP) product filled with glass fiber. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E4000 series are distinguished by their very-high heat resistance and retention of stiffness and strength at temperature above 200°C, meaning they can be used for high-temperature surface-mount reflow soldering. E4000 Series grades are typically processed at 380°C. E4009 is a 45% glass fiber grade with high heat resistance, and high strength. E4009 is used for injection molded bobbins of various types as well as relay parts such as sealed relay covers/cases and relay bases and other parts.
SUMIKASUPER® E4205R Asia Pacific
SUMIKASUPER E4205R is a Liquid Crystal Polymer (LCP) product filled with glass fiber/inorganic. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E4000 series are distinguished by their very-high heat resistance and retention of stiffness and strength at temperature above 200°C, meaning they can be used for high-temperature surface-mount reflow soldering. E4000 Series grades are typically processed at 380°C. E4205R is a 25% glass fiber/inorganic filler grade with high heat resistance, low thermal conductivity, low relative permittivity, and thermal insulation. E4205R is used for injection molded various connectors as well as parts for office equipment such as printer components.
SUMIKASUPER® E5006L Asia Pacific
SUMIKASUPER E5006L is a Liquid Crystal Polymer (LCP) product filled with glass fiber. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E5000 series are distinguished by their ultrahigh heat resistance and ability to maintain stiffness and strength at temperature above 200°C, meaning they can be used for high-temperature surface-mount reflow soldering. E5000 Series grades are typically processed at 400°C. E5006L is a 30% glass fiber grade with ultra-high heat resistance, high strength, low CLTE and high dimensional accuracy. E5006L is used for injection molded bobbins of various types as well as sealed-cover relays and relay cases, lamp holders/sockets, office printer components, and engine peripheral parts (e.g., insulation board).
SUMIKASUPER® E5008 Asia Pacific
SUMIKASUPER E5008 is a Liquid Crystal Polymer (LCP) product filled with glass fiber. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E5000 series are distinguished by their ultrahigh heat resistance and ability to maintain stiffness and strength at temperature above 200°C, meaning they can be used for high-temperature surface-mount reflow soldering. E5000 Series grades are typically processed at 400°C. E5008 is a 40% glass fiber grade with ultra-high heat resistance, low CLTE and Sealed relay covers/cases and relay bases. E5008 is used for injection molded bobbins of various types as well as sealed-cover relays and relay cases, lamp holders/sockets, office printer components, and engine peripheral parts (e.g., insulation board).
SUMIKASUPER® E5008L Asia Pacific
SUMIKASUPER E5008L is a Liquid Crystal Polymer (LCP) product filled with glass fiber. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E5000 series are distinguished by their ultrahigh heat resistance and ability to maintain stiffness and strength at temperature above 200°C, meaning they can be used for high-temperature surface-mount reflow soldering. E5000 Series grades are typically processed at 400°C. E5008L is a 40% glass fiber grade with ultra-high heat resistance, low mold shrinkage and low CLTE. E5008L is used for injection molded bobbins of various types as well as sealed-cover relays and relay cases, lamp holders/sockets, office printer components, and engine peripheral parts (e.g., insulation board).
SUMIKASUPER® E52008 Asia Pacific
SUMIKASUPER E52008 is a Liquid Crystal Polymer (LCP) product filled with glass fiber. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E5000 series are distinguished by their ultrahigh heat resistance and ability to maintain stiffness and strength at temperature above 200°C, meaning they can be used for high-temperature surface-mount reflow soldering. E5000 Series grades are typically processed at 400°C. E52008 is a 40% glass fiber grade with ultra-high heat resistance and good moldability. E52008 is used for injection molded bobbins of various types as well as sealed-cover relays and relay cases, lamp holders/sockets, office printer components, and engine peripheral parts (e.g., insulation board).
SUMIKASUPER® E5204L Asia Pacific
SUMIKASUPER E5204L is a Liquid Crystal Polymer (LCP) product filled with glass fiber/inorganic. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E5000 series are distinguished by their ultrahigh heat resistance and ability to maintain stiffness and strength at temperature above 200°C, meaning they can be used for high-temperature surface-mount reflow soldering. E5000 Series grades are typically processed at 400°C. E5204L is a 20% glass fiber/inorganic filler grade with ultra-high heat resistance, low thermal conductivity, low relative permittivity and thermal insulation. E5204L is used for injection molded various Electrical & Electronic Components as well as parts for office equipment such as printer components.
SUMIKASUPER® E6006 MR Asia Pacific
SUMIKASUPER E6006 MR is a Liquid Crystal Polymer (LCP) product filled with glass fiber. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E6000 series which is general-purpose grades are distinguished by their high heat resistance and strength, good moldability and ability to hold tight tolerances, low mold shrinkage, and good mold release. E6000 Series grades are typically processed at 360°C. E6006 MR is a 30% glass fiber grade with high heat resistance, high strength, good moldability, low mold shrinkage, dimensional accuracy, and high mold-release. E6006 MR is used for injection molding various connectors, relay parts, coil seals, bobbins, and office printer and automotive parts.
SUMIKASUPER® E6006L MR Asia Pacific
SUMIKASUPER E6006L MR is a Liquid Crystal Polymer (LCP) product filled with glass fiber. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E6000 series which is general-purpose grades are distinguished by their high heat resistance and strength, good moldability and ability to hold tight tolerances, low mold shrinkage, and good mold release. E6000 Series grades are typically processed at 360°C. E6006L MR is a 30% glass fiber grade with high heat and strength, good moldability, low mold shrinkage, dimensional accuracy, and highmold-release. E6006L MR is used for injection molding various connectors, relay parts, coil seals, bobbins, and office printer and automotive parts.
SUMIKASUPER® E6006LHF Asia Pacific
SUMIKASUPER E6006LHF is a Liquid Crystal Polymer (LCP) product filled with glass fiber. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E6000HF series are distinguished by their high-flow, low-warpage, and high strength. They also provide high heat resistance to withstand reflow soldering. E6000HF Series grades are typically processed at 350°C. E6006LHF is a 30% glass fiber grade with high strength and low warpage. E6006LHF is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for board-to-board (B2B) and Wire-to-board (W2B) connectors, flexible printed circuit (FPC) connectors, and I/O connectors.
SUMIKASUPER® E6007AS Asia Pacific
SUMIKASUPER E6007AS is a Liquid Crystal Polymer (LCP) product filled with glass fiber/Mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E6000 series which is general-purpose grades are distinguished by their high heat resistance and strength, good moldability and ability to hold tight tolerances, low mold shrinkage, and good mold release. E6000 Series grades are typically processed at 360°C. E6007AS is a 35% glass fiber/inorganic filler grade with antistatic and high heat resistance. E6007AS is used for injection molding various connectors, relay parts, coil seals, bobbins, and office equipment and printer parts.
SUMIKASUPER® E6007LHF Asia Pacific
SUMIKASUPER E6007LHF is a Liquid Crystal Polymer (LCP) product filled with glass fiber. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E6000HF series are distinguished by their high-flow, low-warpage, and high strength. They also provide high heat resistance to withstand reflow soldering. E6000HF Series grades are typically processed at 350°C. E6007LHF is a 35% glass fiber grade with high strength and low warpage. E6007LHF is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for board-to-board (B2B) and Wire-to-board (W2B) connectors, floating connectors, flexible printed circuit (FPC) connectors, and I/O connectors.
SUMIKASUPER® E6007LHF-MR Asia Pacific
SUMIKASUPER E6007LHF-MR is a Liquid Crystal Polymer (LCP) product filled with glass fiber. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E6000HF series are distinguished by their high-flow, low-warpage, and high strength. They also provide high heat resistance to withstand reflow soldering. E6000HF Series grades are typically processed at 350°C. E6007LHF-MR is a 35% glass fiber grade with high strength and low warpage. E6007LHF-MR is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for board-to-board (B2B) and Wire-to-board (W2B) connectors, floating connectors, flexible printed circuit (FPC) connectors, and I/O connectors.
SUMIKASUPER® E6008 KE Asia Pacific
SUMIKASUPER E6008 is a Liquid Crystal Polymer (LCP) product filled with glass fiber. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E6000 series which is general-purpose grades are distinguished by their high heat resistance and strength, good moldability and ability to hold tight tolerances, low mold shrinkage, and good mold release. E6000 Series grades are typically processed at 360°C. E6008 KE is a 40% glass fiber grade with high heat resistance, high strength, and high moldability. E6008 KE is used for injection molding various connectors, relay parts, coil seals, bobbins, and office printer and automotive parts.
SUMIKASUPER® E6008 MR Asia Pacific
SUMIKASUPER E6008 MR is a Liquid Crystal Polymer (LCP) product filled with glass fiber. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E6000 series which is general-purpose grades are distinguished by their high heat resistance and strength, good moldability and ability to hold tight tolerances, low mold shrinkage, and good mold release. E6000 Series grades are typically processed at 360°C. E6008 MR is a 40% glass fiber grade with high heat resistance, high strength, and high moldability. E6008 MR is used for injection molding various connectors, relay parts, coil seals, bobbins, and office printer and automotive parts.
SUMIKASUPER® E6008 Asia Pacific
SUMIKASUPER E6008 is a Liquid Crystal Polymer (LCP) product filled with glass fiber. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E6000 series which is general-purpose grades are distinguished by their high heat resistance and strength, good moldability and ability to hold tight tolerances, low mold shrinkage, and good mold release. E6000 Series grades are typically processed at 360°C. E6008 is a 40% glass fiber grade with high heat resistance, high strength, and high moldability. E6008 is used for injection molding various connectors, relay parts, coil seals, bobbins, and office printer and automotive parts.
SUMIKASUPER® E6205L Asia Pacific
SUMIKASUPER E6205L is a Liquid Crystal Polymer (LCP) product filled with glass fiber/inorganic. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E6000 series which is general-purpose grades are distinguished by their high heat resistance and strength, good moldability and ability to hold tight tolerances, low mold shrinkage, and good mold release. E6000 Series grades are typically processed at 360°C. E6205L is a 25% glass fiber/inorganic filler grade with low thermal conductivity, low relative permittivity, high lubricity and low friction. E6205L is used for injection molding high-frequency connectors, relay parts, coil seals, bobbins, and office equipment and printer parts.
SUMIKASUPER® E6807LHF Asia Pacific
SUMIKASUPER E6807LHF is a Liquid Crystal Polymer (LCP) product filled with glass fiber/mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E6000HF series are distinguished by their high-flow, low-warpage, and high strength. They also provide high heat resistance to withstand reflow soldering. E6000HF Series grades are typically processed at 350°C. E6807LHF is a 35% glass fiber/mineral grade with high strength and low warpage. E6807LHF is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for board-to-board (B2B) and Wire-to-board (W2B) connectors, floating connectors, flexible printed circuit (FPC), and I/O connectors.
SUMIKASUPER® E6807T Asia Pacific
SUMIKASUPER E6807T is a Liquid Crystal Polymer (LCP) product filled with mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E6000 series which is general-purpose grades are distinguished by their high heat resistance and strength, good moldability and ability to hold tight tolerances, low mold shrinkage, and good mold release. E6000 Series grades are typically processed at 360°C. E6807T is a 35% mineral grade with high heat resistance and high surface smoothness. E6807T is used for injection molding various connectors, relay parts, coil seals, bobbins, and office printer and automotive parts.
SUMIKASUPER® E6808GHF Asia Pacific
SUMIKASUPER E6808GHF is a Liquid Crystal Polymer (LCP) product filled with glass fiber/mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E6000HF series are distinguished by their high-flow, low-warpage, and high strength. They also provide high heat resistance to withstand reflow soldering. E6000HF Series grades are typically processed at 350°C. E6808GHF is a 40% glass fiber/mineral grade with low warpage, high flowability, and high thin-wall strength. E6808GHF is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for micro Board to Board connectors, FPC/FFC fine-pitch connectors, DDR , M2, S-ATA connectors, I/O connectors, and Card connectors.
SUMIKASUPER® E6808LHF Asia Pacific
SUMIKASUPER E6808LHF is a Liquid Crystal Polymer (LCP) product filled with glass fiber/mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E6000HF series are distinguished by their high-flow, low-warpage, and high strength. They also provide high heat resistance to withstand reflow soldering. E6000HF Series grades are typically processed at 350°C. E6808LHF is a 40% glass fiber/mineral grade with high strength, low warpage and dimensional accuracy. E6808LHF is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for board-to-board (B2B) and Wire-to-board (W2B) connectors, floating connectors, flexible printed circuit (FPC) connectors, and I/O connectors.
SUMIKASUPER® E6808UHF Asia Pacific
SUMIKASUPER E6808UHF is a Liquid Crystal Polymer (LCP) product filled with glass fiber/mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E6000HF series are distinguished by their high-flow, low-warpage, and high strength. They also provide high heat resistance to withstand reflow soldering. E6000HF Series grades are typically processed at 350°C. E6808UHF is a 40% glass fiber/mineral grade with low warpage, high flowability, and high moldability. E6808UHF is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for micro Board to Board connectors, FPC/FFC fine-pitch connectors, DDR, M2, S-ATA connectors, I/O connectors, and Card connectors.
SUMIKASUPER® E6809T Asia Pacific
SUMIKASUPER E6809T is a Liquid Crystal Polymer (LCP) product filled with mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E6000 series which is general-purpose grades are distinguished by their high heat resistance and strength, good moldability and ability to hold tight tolerances, low mold shrinkage, and good mold release. E6000 Series grades are typically processed at 360°C. E6809T is a 45% mineral grade with high heat resistance and high surface smoothness. E6809T is used for injection molding various connectors, relay parts, coil seals, bobbins, and office printer and automotive parts, plus heat-resistant cookware.
SUMIKASUPER® E6809U Asia Pacific
SUMIKASUPER E6809U is a Liquid Crystal Polymer (LCP) product filled with glass fiber/mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E6000 series which is general-purpose grades are distinguished by their high heat resistance and strength, good moldability and ability to hold tight tolerances, low mold shrinkage, and good mold release. E6000 Series grades are typically processed at 360°C. E6809U is a 45% glass fiber/mineral grade with high heat resistance, good moldability and low warpage. E6809U is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for DDR, M2 and S-ATA connectors, FPC/FFC connectors, and I/O connectors.
SUMIKASUPER® E6810KHF Asia Pacific
SUMIKASUPER E6810KHF is a Liquid Crystal Polymer (LCP) product filled with glass fiber/mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E6000HF series are distinguished by their high-flow, low-warpage, and high strength. They also provide high heat resistance to withstand reflow soldering. E6000HF Series grades are typically processed at 350°C. E6810KHF is a 50% glass fiber/mineral grade with low warpage, low shrinkage and low anisotropy. E6810KHF is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for board-to-board (B2B) and Wire-to-board (W2B) connectors, DDR, M2, S-ATA connectors, FPC connectors, and I/O connectors.
SUMIKASUPER® E6810LHF Asia Pacific
SUMIKASUPER E6810LHF is a Liquid Crystal Polymer (LCP) product filled with glass fiber/mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E6000HF series are distinguished by their high-flow, low-warpage, and high strength. They also provide high heat resistance to withstand reflow soldering. E6000HF Series grades are typically processed at 350°C. E6810LHF is a 50% glass fiber/mineral grade with low warpage, low shrinkage and low anisotropy. E6810LHF is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for board-to-board (B2B) and Wire-to-board (W2B) connectors, floating connectors, flexible printed circuit (FPC) connectors, and I/O connectors.
SUMIKASUPER® SR1009 Asia Pacific
SUMIKASUPER SR1009 is a Liquid Crystal Polymer (LCP) product filled with glass fiber. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. SR1000 series are distinguished by their high heat resistance, ultrahigh flow, moldability, and low warpage. They also provide high heat resistance to withstand reflow soldering. SR1000 series are typically processed at 360°C. SR1009 is a 45% glass fiber grade with low warpage, good flowability, thin-wall ultra-high strength, and high hardness. SR1009 is used for injection various connectors, relay parts, coil seals, bobbins. It is the recommended grade for FPC connectors for Actuators, Board to Board connectors.
SUMIKASUPER® SR1009L Asia Pacific
SUMIKASUPER SR1009L is a Liquid Crystal Polymer (LCP) product filled with glass fiber. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. SR1000 series are distinguished by their high heat resistance, ultrahigh flow, moldability, and low warpage. They also provide high heat resistance to withstand reflow soldering. SR1000 series are typically processed at 360°C. SR1009L is a 45% glass fiber grade with low warpage, thin-wall ultra-high strength, and high hardness. SR1009L is used for injection various connectors, relay parts, coil seals, bobbins. It is the recommended grade for FPC connectors for Actuators, Board to Board connectors.
SUMIKASUPER® SR1205L Asia Pacific
SUMIKASUPER SR1205L is a Liquid Crystal Polymer (LCP) product filled with glass fiber/inorganic. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. SR1000 series are distinguished by their high heat resistance, ultrahigh flow, moldability, and low warpage. They also provide high heat resistance to withstand reflow soldering. SR1000 series are typically processed at 360°C. SR1205L is a 25% glass fiber/inorganic filler grade with low warpage, high strength, low relative permittivity and low dielectric dissipation factor. SR1205L is used for injection various connectors, relay parts, coil seals, bobbins. It is the recommended grade for High-frequency connectors, mezzanine connectors and backplane connectors.
SUMIKASUPER® SR2506 Asia Pacific
SUMIKASUPER SR2506 is a Liquid Crystal Polymer (LCP) product filled with glass fiber&mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. SR2000 series are distinguished by their high heat resistance, ultrahigh flow, moldability, and low warpage. They also provide high heat resistance to withstand reflow soldering. SR2000 series are typically processed at 350°C. SR2506 is a 30% glass fiber/mineral grade with low warpage, thin-wall ultra-high flowability and high thin-wall strength. SR2506 is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for micor Board to Board connectors, FPC/FFC fine-pitch connectors and Card connectors.
SUMIKASUPER® SR2507 Asia Pacific
SUMIKASUPER SR2507 is a Liquid Crystal Polymer (LCP) product filled with mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. SR2000 series are distinguished by their high heat resistance, ultrahigh flow, moldability, and low warpage. They also provide high heat resistance to withstand reflow soldering. SR2000 series are typically processed at 350°C. SR2507 is a 35% mineral grade with urtra-low warpage, thin-wall ultra-high flowability, and surface smoothness. SR2507 is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for micor Board to Board connectors, FPC/FFC fine-pitch connectors and Card connectors.
SUMIKASUPER® SV6808GHF Asia Pacific
SUMIKASUPER SV6808GHF is a Liquid Crystal Polymer (LCP) product filled with glass fiber/mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. SV6000 Series are used for injection molded connectors (including board-to-board (B2B) fine-pitch connectors, flexible printed circuit (FPC) fine-pitch connectors, and memory connectors), Card connectors and thin-wall connectors, as well as CPU sockets. SV6808GHF is a 40% glass fiber/mineral grade with low warpage, high flowability and thin wall strength. SV6808GHF is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for micro Board to Board connectors, FPC/FFC fine-pitch connectors, DDR, M2, S-ATA connectors, I/O connectors, and Card connectors.
SUMIKASUPER® SV6808L Asia Pacific
SUMIKASUPER SV6808L is a Liquid Crystal Polymer (LCP) product filled with glass fiber/mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. SV6000 Series are used for injection molded connectors (including board-to-board (B2B) fine-pitch connectors, flexible printed circuit (FPC) fine-pitch connectors, and memory connectors), Card connectors and thin-wall connectors, as well as CPU sockets. SV6808L is a 40% glass fiber/mineral grade with low warpage, high heat resistance, high flowability and high strength. SV6808L is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for CPU Socket connectors, Board to Board connectors, and I/O connectors.
SUMIKASUPER® SV6808THF Asia Pacific
SUMIKASUPER SV6808THF is a Liquid Crystal Polymer (LCP) product filled with glass fiber/mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. SV6000 Series are used for injection molded connectors (including board-to-board (B2B) fine-pitch connectors, flexible printed circuit (FPC) fine-pitch connectors, and memory connectors), Card connectors and thin-wall connectors, as well as CPU sockets. SV6808THF is a 40% glass fiber/mineral grade with ultra-low warpage, high flowability and thin wall strength. SV6808THF is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for Board to Board connectors, FPC/FFC connectors, DDR, M2, S-ATA connectors, I/O connectors, and Card connectors.
SUMIKASUPER® SZ4506 Asia Pacific
SUMIKASUPER SZ4506 is a Liquid Crystal Polymer (LCP) product filled with mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. SZ series grades are distinguished by their high heat resistance, enabling them to withstand reflow soldering. They also offer special functional properties, such as ultrahigh flow, moldability, and low warpage (Grades in the SZ Series are used in many connector applications (includinghigh-frequency, B-to-B fine-pitch, FPC fine-pitch, and memory-card). SZ4506 is a 30% mineral grade with high heat resistance, high flowability, low warpage, and high surface smoothness. SZ4506 is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for micor Board to Board connectors, FPC/FFC connectors and Card connectors.
SUMIKASUPER® SZ6505HF Asia Pacific
SUMIKASUPER SZ6505HF is a Liquid Crystal Polymer (LCP) product filled with mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. SZ series grades are distinguished by their high heat resistance, enabling them to withstand reflow soldering. They also offer special functional properties, such as ultrahigh flow, moldability, and low warpage (Grades in the SZ Series are used in many connector applications (includinghigh-frequency, B-to-B fine-pitch, FPC fine-pitch, and memory-card). SZ6505HF is a 25% mineral grade with low warpage, super high flowability and high surface smoothness. SZ6505HF is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for micor Board to Board connectors, FPC/FFC fine-pitch connectors and Card connectors.
SUMIKASUPER® SZ6506HF Asia Pacific
SUMIKASUPER SZ6506HF is a Liquid Crystal Polymer (LCP) product filled with mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. SZ series grades are distinguished by their high heat resistance, enabling them to withstand reflow soldering. They also offer special functional properties, such as ultrahigh flow, moldability, and low warpage (Grades in the SZ Series are used in many connector applications (includinghigh-frequency, B-to-B fine-pitch, FPC fine-pitch, and memory-card). SZ6506HF is a 30% mineral grade with low warpage, super high flowability and high surface smoothness. SZ6506HF is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for micor Board to Board connectors, FPC/FFC fine-pitch connectors and Card connectors.