PC Alloy - ESD Range Electrical Conductivity with High HDT and improved processability.

Nemcon™ E-series products are designed for use in ESDA electronic assembly environments where strict control of ESD and cleanliness are critical. Nemcon™ E PC 08CF is a carbon fiber reinforced polycarbonate characterized by high stiffness, consistent moldability, low sloughing and uniform conductivity. Applications - Shipping/handling trays for HDD components, IC's and display assemblies - Internal components/assemblies - Cleanroom tools/test equipment

Nemcon™ E-series products are designed for use in ESDA electronic assembly environments. Nemcon™ E PC CB is a carbon black-filled polycarbonate characterized by consistent moldability, recyclability, low outgassing, and good conductivity. Applications - Shipping/handling trays for components, IC's and circuit assemblies - Internal components/assemblies

Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H ES DP110/X3 is a thermally conductive polycarbonate alloy, combining good thermal conductivity with improved HDT and processability relative to conventional polycarbonate compounds. Typical Applications - Housings for power components. - Encapsulation/housings for bobbins, actuators, and coils. - IC thermal management components, such as heat sinks, heat spreaders, or heat pipes. - LED lighting assemblies.

Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H PC DP105/X3 BK is a black colored, thermally conductive polycarbonate compound, combining excellent thermal conductivity with high HDT and good processability. Typical Applications - Housings for power components. - Encapsulation/housings for bobbins, actuators, and coils. - IC thermal management components, such as heat sinks, heat spreaders, or heat pipes. - LED lighting assemblies.

Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H PC DP111/X1 is a thermally and electrically conductive polycarbonate compound, combining good thermal conductivity with ESD control, high HDT and good processability. Typical Applications - ESD-safe housings for use in aggressive thermal environments. - ESD assemblies for use in power assemblies. - Board level ESD control components.

Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H PC DP113/X5 is a thermally conductive, electrically insulating polycarbonate compound, combining good thermal conductivity with high HDT and good processability. Typical Applications - Housings for power components. - Encapsulation/housings for bobbins, actuators, and coils. - IC thermal management components, such as heat sinks, heat spreaders, or heat pipes. - LED lighting assemblies.

Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H ES DP110/X3 is a natural, thermally conductive polycarbonate, combining good thermal conductivity with improved HDT and processability relative to conventional polycarbonate compounds. Applications: - Housings for power components. - Encapsulation/housings for bobbins, actuators, and coils. - IC thermal management components, such as heat sinks, heat spreaders, or heat pipes. - LED lighting assemblies.

Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H PC DP105/X3 BK is a black colored, thermally conductive polycarbonate compound, combining excellent thermal conductivity with high HDT and good processability. Applications: - Housings for power components. - Encapsulation/housings for bobbins, actuators, and coils. - IC thermal management components, such as heat sinks, heat spreaders, or heat pipes. - LED lighting assemblies.

PC based, thermally conducting, electrically insulating grade with improved processability.

Thermally conductive Polycarbonate

Polycarbonate/Acrylonitrile Butadiene Styrene, thermally and electrically conducting grade.

Polycarbonate/Acrylonitrile Butadiene Styrene, thermally and electrically conducting grade.

OpteSTAT™ NC compounds are Ovation Polymers' line of nano-compounds based on carbon nanotubes. Our proprietary dispersion technology debundles and disentangles carbon nanotubes without compromising their integrity. OpteSTAT™ compounds exhibit good conductivity at minimal nanotube loadings, achieving exceptional cleanliness and physical property retention. OpteSTAT™ NC-PC 1020 is Polycarbonate-based carbon nanotube compound. The material resistivity can be tailored to the application, while retaining the physical and thermal properties of the base polymer. Target applications include components of disk drives, business machines or other electronic assemblies where ESD control is required while retaining exceptional cleanliness, dimensional control and physical properties.

OpteSTAT™ compounds are Ovation Polymers' line of nano-compounds based on carbon nanotubes. Our proprietary dispersion technology debundles and disentangles carbon nanotubes without compromising their integrity. OpteSTAT™ compounds exhibit good conductivity at minimal nanotube loadings, achieving exceptional cleanliness and physical property retention. OpteSTAT™ PC/ABS DP486x1 is a PC/ABS based carbon nanotube compound.

Polycarbonate Alloy - High temperature (HDT), high Impact, with excellent short and long term heat stability.