Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H ES DP110/X3 is a thermally conductive polycarbonate alloy, combining good thermal conductivity with improved HDT and processability relative to conventional polycarbonate compounds. Typical Applications - Housings for power components. - Encapsulation/housings for bobbins, actuators, and coils. - IC thermal management components, such as heat sinks, heat spreaders, or heat pipes. - LED lighting assemblies.

Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H PC DP105/X3 BK is a black colored, thermally conductive polycarbonate compound, combining excellent thermal conductivity with high HDT and good processability. Typical Applications - Housings for power components. - Encapsulation/housings for bobbins, actuators, and coils. - IC thermal management components, such as heat sinks, heat spreaders, or heat pipes. - LED lighting assemblies.

Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H PC DP111/X1 is a thermally and electrically conductive polycarbonate compound, combining good thermal conductivity with ESD control, high HDT and good processability. Typical Applications - ESD-safe housings for use in aggressive thermal environments. - ESD assemblies for use in power assemblies. - Board level ESD control components.

Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H PC DP113/X5 is a thermally conductive, electrically insulating polycarbonate compound, combining good thermal conductivity with high HDT and good processability. Typical Applications - Housings for power components. - Encapsulation/housings for bobbins, actuators, and coils. - IC thermal management components, such as heat sinks, heat spreaders, or heat pipes. - LED lighting assemblies.

Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H ES DP110/X3 is a natural, thermally conductive polycarbonate, combining good thermal conductivity with improved HDT and processability relative to conventional polycarbonate compounds. Applications: - Housings for power components. - Encapsulation/housings for bobbins, actuators, and coils. - IC thermal management components, such as heat sinks, heat spreaders, or heat pipes. - LED lighting assemblies.

Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H PC DP105/X3 BK is a black colored, thermally conductive polycarbonate compound, combining excellent thermal conductivity with high HDT and good processability. Applications: - Housings for power components. - Encapsulation/housings for bobbins, actuators, and coils. - IC thermal management components, such as heat sinks, heat spreaders, or heat pipes. - LED lighting assemblies.

PC based, thermally conducting, electrically insulating grade with improved processability.

Thermally conductive Polycarbonate

Polycarbonate/Acrylonitrile Butadiene Styrene, thermally and electrically conducting grade.

Polycarbonate/Acrylonitrile Butadiene Styrene, thermally and electrically conducting grade.