UL Prospector™

Polyimide (PI): Arlon®

Product Availability Product Description
Arlon® 35N Asia Pacific
35N is a pure polyimide laminate and prepreg system for applications requiring high temperature performance. High Tg (250°C) results in low Z-direction expansion for resistance to PTH failure during PWB processing, and minimizes risk of latent PTH defects in-service. Reduced temperature and time to cure offers improved throughput compared to traditional polyimide cycles.
Arlon® 35NQ Asia Pacific
35NQ is a pure polyimide laminate and prepreg system. Reinforced with woven Quartz fabric, combining the advantages of a reduced cure cycle, high temperature polyimide system (Tg >/=250°C), with low dielectric constant and loss tangent (DK = 3.5, loss 0.009 at 1 MHz) for applications requiring operation at RF/Microwave frequencies. Polyimide Quartz materials also exhibit reduced in-plane CTE for expansion matched SMT applications.
Arlon® 37N Asia Pacific
37N is a polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is required.
Arlon® 38N Asia Pacific
38N is an improved polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is required.
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