| Bitoner® C5 Resin BT-2104 | Qingdao Bater Chemical Co., Ltd. | Bitoner® C5 Resin BT-2104, in the form of a slightly yellow granular, is thermoplastic, low molecular weight, aliphatic resin obtained from petroleum-derived monomers. It has good compatibility with a wide range of polymers, good thermal stability, low wa...veja mais Bitoner® C5 Resin BT-2104, in the form of a slightly yellow granular, is thermoplastic, low molecular weight, aliphatic resin obtained from petroleum-derived monomers. It has good compatibility with a wide range of polymers, good thermal stability, low wax cloud point, low odor, and water resistance. BT-2104 has recommended applications in solvent based PSA, sealants, coatings, hot melt adhesives, and HMPSA. veja menos | |
| Bitoner® C9 Resin BP-100 | Qingdao Bater Chemical Co., Ltd. | Bitoner® C9 Resin BP-100, in the form of a slightly yellow granular, is thermoplastic, low molecular weight, aromatic resin obtained from petroleum-derived monomers. It has good compatibility with SAS, EVA, and other polymers, good thermal resistance, low...veja mais Bitoner® C9 Resin BP-100, in the form of a slightly yellow granular, is thermoplastic, low molecular weight, aromatic resin obtained from petroleum-derived monomers. It has good compatibility with SAS, EVA, and other polymers, good thermal resistance, low odor, low VOC, and water resistance. BP-100 has recommended applications in sealants, shoe adhesives, rubber, coatings, and hot melt adhesives. veja menos | |
| Bitoner® C9 Resin BP-120 | Qingdao Bater Chemical Co., Ltd. | Bitoner® C9 Resin BP-120, in the form of a slightly yellow granular, is thermoplastic, low molecular weight, aromatic resin obtained from petroleum-derived monomers. It has good compatibility with resins and polymers, good thermal resistance, low odor, lo...veja mais Bitoner® C9 Resin BP-120, in the form of a slightly yellow granular, is thermoplastic, low molecular weight, aromatic resin obtained from petroleum-derived monomers. It has good compatibility with resins and polymers, good thermal resistance, low odor, low VOC, and water resistance. BP-120 has recommended applications in sealants, solvent based adhesives, rubber, coatings, printing ink, and hot melt adhesives. veja menos | |
| Bitoner® C9 Resin BP-140 | Qingdao Bater Chemical Co., Ltd. | Bitoner® C9 Resin BP-140, in the form of a slightly yellow granular, is thermoplastic, low molecular weight, aromatic resin obtained from petroleum-derived monomers. It has good compatibility with resins and polymers, good thermal resistance, low odor, lo...veja mais Bitoner® C9 Resin BP-140, in the form of a slightly yellow granular, is thermoplastic, low molecular weight, aromatic resin obtained from petroleum-derived monomers. It has good compatibility with resins and polymers, good thermal resistance, low odor, low VOC, and water resistance. BP-140 has recommended applications in sealants, solvent based adhesives, rubber, coatings, PSA, asphalt modification, printing ink, and hot melt adhesives. veja menos | |
| Bitoner® C9 Resin BP-150 | Qingdao Bater Chemical Co., Ltd. | Bitoner® C9 Resin BP-150, in the form of a slightly yellow granular, is thermoplastic, low molecular weight, aromatic resin. It has good compatibility with rosin modified phenolic resins, water resistance, and recommended applications in sealants, solvent...veja mais Bitoner® C9 Resin BP-150, in the form of a slightly yellow granular, is thermoplastic, low molecular weight, aromatic resin. It has good compatibility with rosin modified phenolic resins, water resistance, and recommended applications in sealants, solvent based adhesives, rubber, coatings, PSA, printing ink, and hot melt adhesives. veja menos | |
| Bitoner® H-100 | Qingdao Bater Chemical Co., Ltd. | Bitoner® H-100, in the form of a white granular, is thermoplastic hydrogenated aromatic resin obtained from petroleum-derived monomers. It has good thermal resistance, low odor, water resistance, and good compatibility with SBS, SIS, and EVA. H-100 has re...veja mais Bitoner® H-100, in the form of a white granular, is thermoplastic hydrogenated aromatic resin obtained from petroleum-derived monomers. It has good thermal resistance, low odor, water resistance, and good compatibility with SBS, SIS, and EVA. H-100 has recommended applications in solvent adhesives, plastic modification, hot melt adhesives, and wax modification. veja menos | |
| Bitoner® Hydrogenated C9 Resins H-120 | Qingdao Bater Chemical Co., Ltd. | Bitoner® Hydrogenated C9 Resins H-120, in the form of a white granular, is thermoplastic hydrogenated aromatic resin obtained from petroleum-derived monomers. It has good thermal resistance, low odor, water resistance, and good compatibility with SBS, SIS...veja mais Bitoner® Hydrogenated C9 Resins H-120, in the form of a white granular, is thermoplastic hydrogenated aromatic resin obtained from petroleum-derived monomers. It has good thermal resistance, low odor, water resistance, and good compatibility with SBS, SIS, and EVA. H-120 has recommended applications in solvent adhesives, hot melt adhesives, and wax modification. veja menos | |
| Bitoner® Resin BA-120 | Qingdao Bater Chemical Co., Ltd. | Bitoner® Resin BA-120, in the form of a slightly yellow granular, is thermoplastic, low molecular weight, aromatic resin obtained from petroleum-derived monomers. It has good compatibility with other polymers and resins, good thermal resistance, water res...veja mais Bitoner® Resin BA-120, in the form of a slightly yellow granular, is thermoplastic, low molecular weight, aromatic resin obtained from petroleum-derived monomers. It has good compatibility with other polymers and resins, good thermal resistance, water resistance, low odor, and very low VOC. BA-120 has recommended applications in sealants, rubber, coatings, printing ink, hot melt adhesive, and solvent based adhesives. veja menos | |
| Bitoner® Resin DH-1110 | Qingdao Bater Chemical Co., Ltd. | Bitoner® Resin DH-1110, in the form of a white granular, is a thermoplastic resin obtained from hydrogenation and polymerization of cyclic ingredients such as derived monomers. It has good heat stability, good initial color, low VOC, water resistance, and...veja mais Bitoner® Resin DH-1110, in the form of a white granular, is a thermoplastic resin obtained from hydrogenation and polymerization of cyclic ingredients such as derived monomers. It has good heat stability, good initial color, low VOC, water resistance, and good compatibility. DH-1110 has recommended applications in hot melt adhesives, sealants, pressure sensitive adhesives, and wax modifications. veja menos | |
| Ceridust® 3910 | Clariant Plastics & Coatings Ltd. | Ceridust® 3910 is a micronized amide wax. | |
| Disvamide-615 | D.S.V. Chemicals Pvt. Ltd. | Disvamide-615 is a reactive polyamide resin. This product appears as a highly viscous liquid. It can be used in general-purpose epoxy polyamide coatings that provide excellent resistance, as well as in epoxy adhesives. | |
| Disvamide-625 | D.S.V. Chemicals Pvt. Ltd. | Disvamide-625 is a reactive polyamide resin. This product appears as a viscous liquid. It can be used as a curing agent for epoxy-based adhesives and coatings. | |
| Disvamide-640 | D.S.V. Chemicals Pvt. Ltd. | Disvamide-640 is a reactive polyamide resin. This product appears as a viscous liquid. It can be used as a curing agent for epoxy-based adhesives and coatings. | |
| Domide G-0240 | Kukdo Chemical Co., Ltd. | Domide G-0240 is a reactive low viscosity polyamide resin, which shows excellent adhesion, chemical resistance as a curing agent for epoxy coatings. This product is well suited for use in the making of grouts, moldings and other types of adhesives and sea...veja mais Domide G-0240 is a reactive low viscosity polyamide resin, which shows excellent adhesion, chemical resistance as a curing agent for epoxy coatings. This product is well suited for use in the making of grouts, moldings and other types of adhesives and sealants. veja menos | |
| Domide G-0331 | Kukdo Chemical Co., Ltd. | Domide G-0331 is a reactive medium viscosity polyamide resin, which shows excellent adhesion, chemical resistance as a curing agent for epoxy coatings. This product is well suited for making grouts, moldings, adhesives and sealants. | |
| Domide G-0930 | Kukdo Chemical Co., Ltd. | Domide G-0930 is a reactive Polyamide Resin used as a curing agent of Epoxy Resin. It has relatively high amine value and is generally used with liquid Epoxy Resins. It is well suited for use in producing laminates, castings, coatings, concrete repair com...veja mais Domide G-0930 is a reactive Polyamide Resin used as a curing agent of Epoxy Resin. It has relatively high amine value and is generally used with liquid Epoxy Resins. It is well suited for use in producing laminates, castings, coatings, concrete repair compounds, adhesives and sealants. veja menos | |
| Domide G-5022 | Kukdo Chemical Co., Ltd. | Domide G-5022 is a reactive polyamide resin which shows excellent adhesion, toughness, water and chemical resistance as a curing agent for epoxy coatings and adhesives. It is particularly designed for use in solvent-based surface coatings. | |
| Domide G-5022X70 | Kukdo Chemical Co., Ltd. | Domide G-5022X70 is a reactive polyamide resin including Xylene solvent. This product is designed for use with solid or liquid epoxy resins. It is used for flexible and anti-corrosive coatings under room temperature curing system. This product is well sui...veja mais Domide G-5022X70 is a reactive polyamide resin including Xylene solvent. This product is designed for use with solid or liquid epoxy resins. It is used for flexible and anti-corrosive coatings under room temperature curing system. This product is well suited for use in maintenance coatings and primers. veja menos | |
| Domide G-640 | Kukdo Chemical Co., Ltd. | Domide G-640 is a standard high-imidazoline Polyamide Resin and used as a curing agent of Epoxy Resin. It has relatively high amine value and is generally used with liquid Epoxy Resins. It is well suited for use in the production of putties, castings, hig...veja mais Domide G-640 is a standard high-imidazoline Polyamide Resin and used as a curing agent of Epoxy Resin. It has relatively high amine value and is generally used with liquid Epoxy Resins. It is well suited for use in the production of putties, castings, high solid coatings, concrete repair compounds, adhesives and sealants. veja menos | |
| Domide G-700 | Kukdo Chemical Co., Ltd. | Domide G-700 is a reactive semisolid Polyamide Rresin which shows excellent adhesion, chemical resistance as a curing agent for epoxy coatings. Also, it is used as hot-melt plasticizer. Also it is well suited for use in production of solvent-based mainten...veja mais Domide G-700 is a reactive semisolid Polyamide Rresin which shows excellent adhesion, chemical resistance as a curing agent for epoxy coatings. Also, it is used as hot-melt plasticizer. Also it is well suited for use in production of solvent-based maintenance coatings, primers, sealers and coatings for concrete. veja menos | |
| Domide G-A0432 | Kukdo Chemical Co., Ltd. | Domide G-A0432 is a low viscosity Polyamidoamine Resin for reaction with liquid or solid Epoxy Resins. GA0432 is lower in viscosity than G-A0533. This product is well suited for use in sealants, electrical potting and casting. | |
| Domide G-A0533 | Kukdo Chemical Co., Ltd. | Domide G-A0533 is a low-viscosity Polyamidoamine Resin designed for reaction with liquid or solid Epoxy Resins. It can be used as all or part for use in making sealants, electrical potting, casting, coatings and flooring applications. | |
| Kingmide 310 | Sanho Chemical Co., Ltd. | Kingmide 310 is a high molecular weight, high viscosity, reactive polyamide resin in a brown-colored, viscous liquid form. This product has a viscosity of 30,000-50,000 mPa.s and a specific gravity of 0.97. Kingmide 310 is most commonly used in adhesive a...veja mais Kingmide 310 is a high molecular weight, high viscosity, reactive polyamide resin in a brown-colored, viscous liquid form. This product has a viscosity of 30,000-50,000 mPa.s and a specific gravity of 0.97. Kingmide 310 is most commonly used in adhesive and coating formulation applications. veja menos | |
| Kingmide 315-S | Sanho Chemical Co., Ltd. | Kingmide 315-S is a high viscosity, reactive polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 8000-12,000 mPa.s and a specific gravity of 0.97. Kingmide 315-S is most commonly used in adhesive and high-solids anti-co...veja mais Kingmide 315-S is a high viscosity, reactive polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 8000-12,000 mPa.s and a specific gravity of 0.97. Kingmide 315-S is most commonly used in adhesive and high-solids anti-corrosive coating formulation applications. veja menos | |
| Kingmide 338 | Sanho Chemical Co., Ltd. | Kingmide 338 is a low-viscosity, ractive polyamide resin in a light yellow-colored viscous liquid form. This product has a viscosity of 1000-3000 mPa.s and a specific gravity of 0.97. Kingmide 338 is most commonly used in adhesive and putty formulation ap...veja mais Kingmide 338 is a low-viscosity, ractive polyamide resin in a light yellow-colored viscous liquid form. This product has a viscosity of 1000-3000 mPa.s and a specific gravity of 0.97. Kingmide 338 is most commonly used in adhesive and putty formulation applications. veja menos | |
| Kingmide 340 | Sanho Chemical Co., Ltd. | Kingmide 340 is a low-viscosity, reactive polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 400-600 mPa.s and a specific gravity of 0.96. Kingmide 340 is most commonly used in coating, mortar, adhesive, and putty form...veja mais Kingmide 340 is a low-viscosity, reactive polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 400-600 mPa.s and a specific gravity of 0.96. Kingmide 340 is most commonly used in coating, mortar, adhesive, and putty formulation applications. veja menos | |
| Kingmide 370 | Sanho Chemical Co., Ltd. | Kingmide 370 is a medium-viscosity, reactive polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 2500-4500 mPa.s and a specific gravity of 0.95. Kingmide 370 is most commonly used in adhesive and putty formulation appli...veja mais Kingmide 370 is a medium-viscosity, reactive polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 2500-4500 mPa.s and a specific gravity of 0.95. Kingmide 370 is most commonly used in adhesive and putty formulation applications. veja menos | |
| Kingmide 374-L | Sanho Chemical Co., Ltd. | Kingmide 374-L is a low-viscosity, reactive polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 200-400 mPa.s and a specific gravity of 0.95. Kingmide 374-L is most commonly used in mortar, adhesive, and putty formulati...veja mais Kingmide 374-L is a low-viscosity, reactive polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 200-400 mPa.s and a specific gravity of 0.95. Kingmide 374-L is most commonly used in mortar, adhesive, and putty formulation applications. veja menos | |
| Kingmide 533 | Sanho Chemical Co., Ltd. | Kingmide 533 is a fatty polyamide resin in a brown pellet form. This product has a softening point of 100-110°C. Kingmide 533 is most commonly used in flexographic printing ink formulation applications. | |
| Kingmide 550-A | Sanho Chemical Co., Ltd. | Kingmide 550-A is a high molecular weight polyamide resin in a brown-yellow pellet form. This product has a softening point of 105-115°C. Kingmide 550-A is most commonly used in hot-melt adhesive formulation applications. | |
| Kingmide 550-G | Sanho Chemical Co., Ltd. | Kingmide 550-G is a high molecular weight polyamide resin in a brown-yellow pellet form. This product has a softening point of 105-115°C. Kingmide 550-G is most commonly used in hot-melt adhesive formulation applications. | |
| Kingmide 551 | Sanho Chemical Co., Ltd. | Kingmide 551 is a high molecular weight polyamide resin in a brown-yellow pellet form. This product has a softening point of 105-115°C and an application temperature of 150-180°C. Kingmide 551 is most commonly used in hot-melt adhesive formulation applica...veja mais Kingmide 551 is a high molecular weight polyamide resin in a brown-yellow pellet form. This product has a softening point of 105-115°C and an application temperature of 150-180°C. Kingmide 551 is most commonly used in hot-melt adhesive formulation applications. veja menos | |
| Kingmide 705 | Sanho Chemical Co., Ltd. | Kingmide 705 is a low-viscosity, reactive polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 150-400 mPa.s and a specific gravity of 0.98. Kingmide 705 is most commonly used in mortar, putty, and adhesive formulation a...veja mais Kingmide 705 is a low-viscosity, reactive polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 150-400 mPa.s and a specific gravity of 0.98. Kingmide 705 is most commonly used in mortar, putty, and adhesive formulation applications. veja menos | |
| Kingmide 715-A | Sanho Chemical Co., Ltd. | Kingmide 715-A is a medium viscosity, modified polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 1000-3000 mPa.s. Kingmide 715-A is most commonly used in putty and adhesive formulation applications. | |
| Kingmide H-110 | Sanho Chemical Co., Ltd. | Kingmide H-110 is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 500-1000 mPa.s and a softening point of 105-115°C. Kingmide H-110 is most commonly used in hot-melt adhesive formulation application...veja mais Kingmide H-110 is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 500-1000 mPa.s and a softening point of 105-115°C. Kingmide H-110 is most commonly used in hot-melt adhesive formulation applications. veja menos | |
| Kingmide H-120 | Sanho Chemical Co., Ltd. | Kingmide H-120 is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 2200-2800 mPa.s and a softening point of 115-125°C. Kingmide H-120 is most commonly used in hot-melt adhesive formulation applicatio...veja mais Kingmide H-120 is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 2200-2800 mPa.s and a softening point of 115-125°C. Kingmide H-120 is most commonly used in hot-melt adhesive formulation applications. veja menos | |
| Kingmide H-130 | Sanho Chemical Co., Ltd. | Kingmide H-130 is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 2000-4000 mPa.s and a softening point of 125-135°C. Kingmide H-130 is most commonly used in hot-melt adhesive formulation applicatio...veja mais Kingmide H-130 is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 2000-4000 mPa.s and a softening point of 125-135°C. Kingmide H-130 is most commonly used in hot-melt adhesive formulation applications. veja menos | |
| Kingmide H-130W | Sanho Chemical Co., Ltd. | Kingmide H-130W is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 2500-5000 mPa.s and a softening point of 125-135°C. Kingmide H-130W is most commonly used in hot-melt adhesive formulation applicat...veja mais Kingmide H-130W is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 2500-5000 mPa.s and a softening point of 125-135°C. Kingmide H-130W is most commonly used in hot-melt adhesive formulation applications. veja menos | |
| Kingmide H-140HP | Sanho Chemical Co., Ltd. | Kingmide H-140HP is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 5000-10,000 mPa.s and a softening point of 140-150°C. Kingmide H-140HP is most commonly used in hot-melt adhesive formulation appl...veja mais Kingmide H-140HP is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 5000-10,000 mPa.s and a softening point of 140-150°C. Kingmide H-140HP is most commonly used in hot-melt adhesive formulation applications. veja menos | |
| Kingmide H-170HV | Sanho Chemical Co., Ltd. | Kingmide H-170HV is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 3000-7000 mPa.s and a softening point of 165-175°C. Kingmide H-170HV is most commonly used in hot-melt adhesive formulation applic...veja mais Kingmide H-170HV is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 3000-7000 mPa.s and a softening point of 165-175°C. Kingmide H-170HV is most commonly used in hot-melt adhesive formulation applications. veja menos | |
| Kingmide X-2100 | Sanho Chemical Co., Ltd. | Kingmide X-2100 is a medium viscosity, modified reactive polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 6000-12,000 mPa.s and a specific gravity of 1.04. Kingmide X-2100 is most commonly used in adhesive, coating, ...veja mais Kingmide X-2100 is a medium viscosity, modified reactive polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 6000-12,000 mPa.s and a specific gravity of 1.04. Kingmide X-2100 is most commonly used in adhesive, coating, and putty formulation applications. veja menos | |
| Kingmide X-220B | Sanho Chemical Co., Ltd. | Kingmide X-220B is a low viscosity, modified reactive polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 450-650 mPa.s. Kingmide X-220B is most commonly used in adhesive, coating, and patch repair mortar formulation ap...veja mais Kingmide X-220B is a low viscosity, modified reactive polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 450-650 mPa.s. Kingmide X-220B is most commonly used in adhesive, coating, and patch repair mortar formulation applications. veja menos | |
| nolax A21.2014 PE40 | nolax AG (Vanora) | nolax A21.2014 PE40 is a sheet of slightly opaque colored thermoplastic hotmelt adhesive film built on copolyamides. It can be handled with all established lamination, calendaring, and bonding techniques except for high frequency welding. nolax A21.2014 P...veja mais nolax A21.2014 PE40 is a sheet of slightly opaque colored thermoplastic hotmelt adhesive film built on copolyamides. It can be handled with all established lamination, calendaring, and bonding techniques except for high frequency welding. nolax A21.2014 PE40 has a melting point of 170 to 190°C, relative density of 1.1 g/cm³, is insoluble in water, is dry cleaning resistant, and not readily biodegradable. veja menos | |
| nolax A21.2015 | nolax AG (Vanora) | nolax A21.2015 is a sheet of slightly opaque colored thermoplastic hotmelt adhesive film built on copolyamides. It can be handled with all established lamination, calendaring, and bonding techniques except for high frequency welding. nolax A21.2015 has a ...veja mais nolax A21.2015 is a sheet of slightly opaque colored thermoplastic hotmelt adhesive film built on copolyamides. It can be handled with all established lamination, calendaring, and bonding techniques except for high frequency welding. nolax A21.2015 has a melting point of 105 to 115°C, relative density of 1.2 g/cm³, is insoluble in water, is dry cleaning resistant, and not readily biodegradable. veja menos | |
| nolax A21.2015 S | nolax AG (Vanora) | nolax A21.2015-S is a sheet of slightly opaque colored thermoplastic hotmelt adhesive film built on copolyamides. It can be handled with all established lamination, calendaring, and bonding techniques except for high frequency welding. nolax A21.2015-S ha...veja mais nolax A21.2015-S is a sheet of slightly opaque colored thermoplastic hotmelt adhesive film built on copolyamides. It can be handled with all established lamination, calendaring, and bonding techniques except for high frequency welding. nolax A21.2015-S has a melting point of 105 to 115°C, relative density of 1.2 g/cm³, is insoluble in water, is dry cleaning resistant, and not readily biodegradable. veja menos | |
| Polyamide Resin PA-108 | Ningbo Briscent Trade Co., Ltd. | Polyamide Resin PA-108 is a benzene-soluble stable polyamide resin. It has good solvent release, excellent glossiness, strong adhesive power, and fine gel resistance. This product is well suited for use in gravure printing ink, paper and thin film printin...veja mais Polyamide Resin PA-108 is a benzene-soluble stable polyamide resin. It has good solvent release, excellent glossiness, strong adhesive power, and fine gel resistance. This product is well suited for use in gravure printing ink, paper and thin film printing ink, and over-printing varnish. veja menos | |
| Polyamide Resin PA-188 | Ningbo Briscent Trade Co., Ltd. | Polyamide Resin PA-188 is a benzene-soluble polyamide resin. It has good solvent release, good adhesive power, and good freezing resistance. This product is well suited for use in gravure printing ink, paper and thin film printing ink, and over-printing v...veja mais Polyamide Resin PA-188 is a benzene-soluble polyamide resin. It has good solvent release, good adhesive power, and good freezing resistance. This product is well suited for use in gravure printing ink, paper and thin film printing ink, and over-printing varnish. veja menos | |
| Polyamide Resin PA-308 | Ningbo Briscent Trade Co., Ltd. | Polyamide Resin PA-308 is a benzene-soluble polyamide resin. It has good heat resistance, strong adhesive power, fine glossiness, anti-friction, and anti-scratch. This product is well suited for use in heat-resistance printing ink, paper and thin film pri...veja mais Polyamide Resin PA-308 is a benzene-soluble polyamide resin. It has good heat resistance, strong adhesive power, fine glossiness, anti-friction, and anti-scratch. This product is well suited for use in heat-resistance printing ink, paper and thin film printing ink, over-printing varnish, and over-printing ink. veja menos | |
| Polyamide Resin PA-388 | Ningbo Briscent Trade Co., Ltd. | Polyamide Resin PA-388 is a benzene-soluble polyamide resin. It has good transparency, strong adhesive power, outstanding glossiness, and good pigment wettability. This product is well suited for use in gravure printing ink, paper and thin film printing i...veja mais Polyamide Resin PA-388 is a benzene-soluble polyamide resin. It has good transparency, strong adhesive power, outstanding glossiness, and good pigment wettability. This product is well suited for use in gravure printing ink, paper and thin film printing ink, and over-printing varnish. veja menos | |
| Polyamide Resin PA-508 | Ningbo Briscent Trade Co., Ltd. | Polyamide Resin PA-508 is a alcohol-soluble polyamide resin. It has good solvent release and strong adhesive power. This product is well suited for use in gravure printing ink, flexo printing ink, and over-printing varnish. | |
| Polyamide Resin TK 1014 | Hangzhou Tiankai (China) Enterprise Co., Ltd. | Polyamide Resin TK 1014 is a yellowish granule reacted from dimer acid and diamine that functions as a co-solvent polyamide resin. This product features high gloss, a low freezing point, solvent release, and folding endurance. It is water-fast, has a visc...veja mais Polyamide Resin TK 1014 is a yellowish granule reacted from dimer acid and diamine that functions as a co-solvent polyamide resin. This product features high gloss, a low freezing point, solvent release, and folding endurance. It is water-fast, has a viscosity of 100-140 mpa.s at 25°C, and has a softening point of 105-118°C. Polyamide Resin TK 1014 finds application in gravure plastic printing inks, paper printing inks, and hot-melt adhesives. veja menos | |
| Polyamide Resin TK 1417 | Hangzhou Tiankai (China) Enterprise Co., Ltd. | Polyamide Resin TK 1417 is a yellowish granule reacted from dimer acid and diamine that functions as a co-solvent polyamide resin. This product features high gloss, a low freezing point, solvent release, and folding endurance. It is water-fast, has a visc...veja mais Polyamide Resin TK 1417 is a yellowish granule reacted from dimer acid and diamine that functions as a co-solvent polyamide resin. This product features high gloss, a low freezing point, solvent release, and folding endurance. It is water-fast, has a viscosity of 140-170 mpa.s at 25°C, and has a softening point of 105-118°C. Polyamide Resin TK 1417 finds application in gravure plastic printing inks, paper printing inks, and hot-melt adhesives. veja menos | |
| Polyamide Resin TK 1720 | Hangzhou Tiankai (China) Enterprise Co., Ltd. | Polyamide Resin TK 1720 is a yellowish granule reacted from dimer acid and diamine that functions as a co-solvent polyamide resin. This product features high gloss, a low freezing point, solvent release, and folding endurance. It is water-fast, has a visc...veja mais Polyamide Resin TK 1720 is a yellowish granule reacted from dimer acid and diamine that functions as a co-solvent polyamide resin. This product features high gloss, a low freezing point, solvent release, and folding endurance. It is water-fast, has a viscosity of 170-200 mpa.s at 25°C, and has a softening point of 105-118°C. Polyamide Resin TK 1720 finds application in gravure plastic printing inks, paper printing inks, and hot-melt adhesives. veja menos | |
| Polyamide Resin TK 2000 | Hangzhou Tiankai (China) Enterprise Co., Ltd. | Polyamide Resin TK 2000 is a yellowish granule reacted from dimer acid and diamine that functions as a co-solvent polyamide resin. This product features high gloss, a low freezing point, solvent release, and folding endurance. It is water-fast, has a visc...veja mais Polyamide Resin TK 2000 is a yellowish granule reacted from dimer acid and diamine that functions as a co-solvent polyamide resin. This product features high gloss, a low freezing point, solvent release, and folding endurance. It is water-fast, has a viscosity of 120-170 mpa.s at 25°C, and has a softening point of 115-125°C. Polyamide Resin TK 2000 finds application in gravure plastic printing inks, paper printing inks, and hot-melt adhesives. veja menos | |
| Polyamide Resin TK 588B | Hangzhou Tiankai (China) Enterprise Co., Ltd. | Polyamide Resin TK 588B is a yellowish granule reacted from dimer acid and diamine that functions as a co-solvent polyamide resin. This product features high gloss, a low freezing point, solvent release, and folding endurance. It is water-fast, has a visc...veja mais Polyamide Resin TK 588B is a yellowish granule reacted from dimer acid and diamine that functions as a co-solvent polyamide resin. This product features high gloss, a low freezing point, solvent release, and folding endurance. It is water-fast, has a viscosity of 100-180 mpa.s at 25°C, and has a softening point of 105-115°C. Polyamide Resin TK 588B finds application in gravure plastic printing inks, paper printing inks, and hot-melt adhesives. veja menos | |
| Polyamide Resin TK 588C | Hangzhou Tiankai (China) Enterprise Co., Ltd. | Polyamide Resin TK 588C is a yellowish granule reacted from dimer acid and diamine that functions as a co-solvent polyamide resin. This product features high gloss, a low freezing point, solvent release, and folding endurance. It is water-fast, has a visc...veja mais Polyamide Resin TK 588C is a yellowish granule reacted from dimer acid and diamine that functions as a co-solvent polyamide resin. This product features high gloss, a low freezing point, solvent release, and folding endurance. It is water-fast, has a viscosity of 100-150 mpa.s at 25°C, and has a softening point of 100-180°C. Polyamide Resin TK 588C finds application in gravure plastic printing inks, paper printing inks, and hot-melt adhesives. veja menos | |
| Polyamide Resin TK 688B | Hangzhou Tiankai (China) Enterprise Co., Ltd. | Polyamide Resin TK 688B is a yellowish granule produced from reacted dimer acid and diamine that functions as a co-solvent polyamide resin. This product is compatible with nitrocotton, adheres to polyethylene material, and features high gloss, a low freez...veja mais Polyamide Resin TK 688B is a yellowish granule produced from reacted dimer acid and diamine that functions as a co-solvent polyamide resin. This product is compatible with nitrocotton, adheres to polyethylene material, and features high gloss, a low freezing point, solvent release, and folding endurance. It is water-fast, has a viscosity of 110-180 mpa.s at 25°C, and has a softening point of 120-200°C. Polyamide Resin TK 688B finds application in gravure plastics, printing inks, paper printing inks, and hot-melt adhesives. veja menos | |
| Polyamide Resin TK 688C | Hangzhou Tiankai (China) Enterprise Co., Ltd. | Polyamide Resin TK 688C is a yellowish granule reacted from dimer acid and diamine that functions as a co-solvent polyamide resin. This product features high gloss, a low freezing point, solvent release, and folding endurance. It is water-fast, has a visc...veja mais Polyamide Resin TK 688C is a yellowish granule reacted from dimer acid and diamine that functions as a co-solvent polyamide resin. This product features high gloss, a low freezing point, solvent release, and folding endurance. It is water-fast, has a viscosity of 100-150 mpa.s at 25°C, and has a softening point of 120-180°C. Polyamide Resin TK 688C finds application in gravure plastic printing inks, paper printing inks, and hot-melt adhesives. veja menos | |
| Polyamide Resin TK 7010 | Hangzhou Tiankai (China) Enterprise Co., Ltd. | Polyamide Resin TK 7010 is a yellowish granule reacted from dimer acid and diamine that functions as a co-solvent polyamide resin. This product features high gloss, a low freezing point, solvent release, and folding endurance. It is water-fast, has a visc...veja mais Polyamide Resin TK 7010 is a yellowish granule reacted from dimer acid and diamine that functions as a co-solvent polyamide resin. This product features high gloss, a low freezing point, solvent release, and folding endurance. It is water-fast, has a viscosity of 70-100 mpa.s at 25°C, and has a softening point of 105-118°C. Polyamide Resin TK 7010 finds application in gravure plastic printing inks, paper printing inks, and hot-melt adhesives. veja menos | |
| SP-125 | Macro Polymers Pvt. Ltd. | SP-125 is a polyamide resin. This product should be used in combination with epoxy coatings as a hardener, in order to induce good adhesion, flexibility, and anti-corrosion protection. It can be used in cold-curing, solvent-containing coatings for steel...veja mais SP-125 is a polyamide resin. This product should be used in combination with epoxy coatings as a hardener, in order to induce good adhesion, flexibility, and anti-corrosion protection. It can be used in cold-curing, solvent-containing coatings for steel and mineral substrates, and in coatings for paints and adhesives. veja menos | |
| Tohmide 1310 | Sanho Chemical Co., Ltd. | Tohmide 1310 is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 1500-4500 mPa.s and a softening point of 115-125°C. Tohmide 1310 is most commonly used in hot-melt adhesive formulation applications. | |
| Tohmide 1360 | Sanho Chemical Co., Ltd. | Tohmide 1360 is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 1500-4500 mPa.s and a softening point of 165-175°C. Tohmide 1360 is most commonly used in hot-melt adhesive formulation applications. | |
| Tohmide 225-R | Sanho Chemical Co., Ltd. | Tohmide 225-R is a medium viscosity, reactive polyaminoamide in a brown-colored viscous liquid form. This product has a viscosity of 3500-10,000 mPa.s and a specific gravity of 0.97. Tohmide 225-R is most commonly used in adhesive, sealant, putty, and sur...veja mais Tohmide 225-R is a medium viscosity, reactive polyaminoamide in a brown-colored viscous liquid form. This product has a viscosity of 3500-10,000 mPa.s and a specific gravity of 0.97. Tohmide 225-R is most commonly used in adhesive, sealant, putty, and surface coating formulation applications. veja menos | |
| Tohmide 245-HS | Sanho Chemical Co., Ltd. | Tohmide 245-HS is a very low viscosity, fatty polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 800-1100 cPs. Tohmide 245-HS is most commonly used in structural adhesive and protective coating formulation applications...veja mais Tohmide 245-HS is a very low viscosity, fatty polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 800-1100 cPs. Tohmide 245-HS is most commonly used in structural adhesive and protective coating formulation applications. veja menos | |
| Tohmide 390 | Sanho Chemical Co., Ltd. | Tohmide 390 is a solid-type polyamide resin in a brown pellet form. This product has a viscosity of 200-400 mPa.s and a softening point of 175-185°C. Tohmide 390 is most commonly used in hot-melt structural adhesive formulation applications. | |
| Tohmide 394 | Sanho Chemical Co., Ltd. | Tohmide 394 is a solid-type fatty polyamide resin in a brown pellet form. This product has a viscosity of 500-1000 mPa.s and a softening point of 105-115°C. Tohmide 394 is most commonly used in hot-melt structural adhesive formulation applications. | |
| Tohmide 558 | Sanho Chemical Co., Ltd. | Tohmide 558 is a solid-type fatty polyamide resin in a brown-colored pellet form. This product has a viscosity of 300-850 mPa.s and a softening point of 155-165°C. Tohmide 558 is most commonly used in structural hot-melt adhesive formulation applications. | |
| Tohmide 558-N | Sanho Chemical Co., Ltd. | Tohmide 558-N is a solid-type fatty polyamide resin in a brown-colored pellet form. This product has a viscosity of 300-800 mPa.s and a softening point of 155-165°C. Tohmide 558-N is most commonly used in structural hot-melt adhesive formulation applicati...veja mais Tohmide 558-N is a solid-type fatty polyamide resin in a brown-colored pellet form. This product has a viscosity of 300-800 mPa.s and a softening point of 155-165°C. Tohmide 558-N is most commonly used in structural hot-melt adhesive formulation applications. veja menos | |
| Tohmide 560 | Sanho Chemical Co., Ltd. | Tohmide 560 is a low-melting viscosity polyamide resin in a brown-colored pellet form. This product has a viscosity of 200-400 mPa.s and a softening point of 155-165°C. Tohmide 560 is most commonly used in hot-melt adhesive formulation applications. | |
| Tohmide TXA-254B | Sanho Chemical Co., Ltd. | Tohmide TXA-254B is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 3500-5500 mPa.s and a softening point of 150-160°C. Tohmide TXA-254B is most commonly used in hot-melt adhesive formulation applica...veja mais Tohmide TXA-254B is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 3500-5500 mPa.s and a softening point of 150-160°C. Tohmide TXA-254B is most commonly used in hot-melt adhesive formulation applications. veja menos | |
| Tohmide TXA-265 | Sanho Chemical Co., Ltd. | Tohmide TXA-265 is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 2000-4000 mPa.s and a softening point of 140-150°C. Tohmide TXA-265 is most commonly used in hot-melt adhesive formulation applicati...veja mais Tohmide TXA-265 is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 2000-4000 mPa.s and a softening point of 140-150°C. Tohmide TXA-265 is most commonly used in hot-melt adhesive formulation applications. veja menos | |
| Tohmide TXC-241B | Sanho Chemical Co., Ltd. | Tohmide TXC-241B is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 11,000-20,000 mPa.s and a softening point of 95-105°C. Tohmide TXC-241B is most commonly used in hot-melt adhesive formulation appl...veja mais Tohmide TXC-241B is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 11,000-20,000 mPa.s and a softening point of 95-105°C. Tohmide TXC-241B is most commonly used in hot-melt adhesive formulation applications. veja menos | |
| Tohmide TXC-241F | Sanho Chemical Co., Ltd. | Tohmide TXC-241F is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 11,000-20,000 mPa.s and a softening point of 105-110°C. Tohmide TXC-241F is most commonly used in hot-melt adhesive formulation app...veja mais Tohmide TXC-241F is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 11,000-20,000 mPa.s and a softening point of 105-110°C. Tohmide TXC-241F is most commonly used in hot-melt adhesive formulation applications. veja menos | |
| Tohmide TXC-241H | Sanho Chemical Co., Ltd. | Tohmide TXC-241H is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 15,000-25,000 mPa.s and a softening point of 100-110°C. Tohmide TXC-241H is most commonly used in hot-melt adhesive formulation app...veja mais Tohmide TXC-241H is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 15,000-25,000 mPa.s and a softening point of 100-110°C. Tohmide TXC-241H is most commonly used in hot-melt adhesive formulation applications. veja menos | |
| Tohmide TXC-243A | Sanho Chemical Co., Ltd. | Tohmide TXC-243A is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 5000-10,000 mPa.s and a softening point of 100-110°C. Tohmide TXC-243A is most commonly used in hot-melt adhesive formulation appli...veja mais Tohmide TXC-243A is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 5000-10,000 mPa.s and a softening point of 100-110°C. Tohmide TXC-243A is most commonly used in hot-melt adhesive formulation applications. veja menos | |
| Tohmide TXC-244C | Sanho Chemical Co., Ltd. | Tohmide TXC-244C is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 2000-5000 mPa.s and a softening point of 155-165°C. Tohmide TXC-244C is most commonly used in hot-melt adhesive formulation applica...veja mais Tohmide TXC-244C is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 2000-5000 mPa.s and a softening point of 155-165°C. Tohmide TXC-244C is most commonly used in hot-melt adhesive formulation applications. veja menos | |
| Tohmide TXC-269 | Sanho Chemical Co., Ltd. | Tohmide TXC-269 is a polyamide resin in a brown-colored pellet form. This product has a viscosity of 3000-4000 mPa.s and a softening point of 170-180°C. Tohmide TXC-269 is most commonly used in hot-melt low-pressure molding adhesive formulation applicatio...veja mais Tohmide TXC-269 is a polyamide resin in a brown-colored pellet form. This product has a viscosity of 3000-4000 mPa.s and a softening point of 170-180°C. Tohmide TXC-269 is most commonly used in hot-melt low-pressure molding adhesive formulation applications. veja menos | |
| Tohmide TXC-271 | Sanho Chemical Co., Ltd. | Tohmide TXC-271 is a polyamide resin in a brown-colored pellet form. This product has a viscosity of 500-1200 mPa.s and a softening point of 141-153°C. Tohmide TXC-271 is most commonly used in hot-melt low-pressure molding adhesive formulation application...veja mais Tohmide TXC-271 is a polyamide resin in a brown-colored pellet form. This product has a viscosity of 500-1200 mPa.s and a softening point of 141-153°C. Tohmide TXC-271 is most commonly used in hot-melt low-pressure molding adhesive formulation applications. veja menos | |
| Versamid® 100 | Gabriel Performance Products | Versamid® 100 is a semi-solid, reactive polyamide resin designed for use with solid or liquid epoxy resins for room temperature cure thermoset coating applications. Versamid® 100 and epoxy resin systems provide long pot lives and fast tack-free formulatio...veja mais Versamid® 100 is a semi-solid, reactive polyamide resin designed for use with solid or liquid epoxy resins for room temperature cure thermoset coating applications. Versamid® 100 and epoxy resin systems provide long pot lives and fast tack-free formulations. Formulations based on this resin system cure less quickly than Versamid® 115 systems and exhibit somewhat lower chemical and solvent resistance than Versamid® 125 coating systems. Versamid® 100 and epoxy resin systems are recommended for applications such as: Maintenance coating applications, primers, and enamel paint formulations. veja menos | |
| Versamid® 100 I-70 | Gabriel Performance Products | Versamid® 100 I-70 is an iso-propanol solution of a semi-solid, reactive polyamide resin designed for use with solid or liquid epoxy resins for room temperature cure thermoset coating applications. Versamid® 100 I-70 and epoxy resin systems provide long ...veja mais Versamid® 100 I-70 is an iso-propanol solution of a semi-solid, reactive polyamide resin designed for use with solid or liquid epoxy resins for room temperature cure thermoset coating applications. Versamid® 100 I-70 and epoxy resin systems provide long pot lives and fast tack-free formulations. Formulations based on this resin system cure less quickly than Versamid® 115 systems and exhibit somewhat lower chemical and solvent resistance than Versamid® 125 coating systems. veja menos | |
| Versamid® 100 T-60 | Gabriel Performance Products | Versamid® 100 T-60 is a toluene solution of a semi-solid, reactive polyamide resin designed for use with solid or liquid epoxy resins for room temperature cure thermoset coating applications. Versamid® 100 T-60 and epoxy resin systems provide long pot liv...veja mais Versamid® 100 T-60 is a toluene solution of a semi-solid, reactive polyamide resin designed for use with solid or liquid epoxy resins for room temperature cure thermoset coating applications. Versamid® 100 T-60 and epoxy resin systems provide long pot lives and fast tack-free formulations. Formulations based on this resin system cure less quickly than Versamid® 115 systems and exhibit somewhat lower chemical and solvent resistance than Versamid® 125 coating systems. veja menos | |
| Versamid® 115 | Gabriel Performance Products | Versamid® 115 is a high viscosity, reactive polyamide resin designed for use with solid or liquid epoxy resins for flexible and resistant thermoset coating applications that cure at room temperature. This resin is also useful in adhesive applications. Ver...veja mais Versamid® 115 is a high viscosity, reactive polyamide resin designed for use with solid or liquid epoxy resins for flexible and resistant thermoset coating applications that cure at room temperature. This resin is also useful in adhesive applications. Versamid® 115 and epoxy resin systems provide excellent resistance properties, adhesion and superior corrosion resistance. They are more solvent and chemical resistant than Versamid® 100 systems and generally dry faster than Versamid® 125 systems. Versamid® 115 and epoxy resin systems are recommended for applications such as: Maintenance coating applications, Primers, and Enamel paint formulations. veja menos | |
| Versamid® 125 | Gabriel Performance Products | Versamid® 125 is a medium viscosity, reactive polyamide resin designed for use with solid or liquid epoxy resins for tough, chemical-resistant thermoset coating applications that cure at room temperature. This resin is also useful in adhesive applications...veja mais Versamid® 125 is a medium viscosity, reactive polyamide resin designed for use with solid or liquid epoxy resins for tough, chemical-resistant thermoset coating applications that cure at room temperature. This resin is also useful in adhesive applications. Versamid® 125 and epoxy resin systems are generally harder than and cure more rapidly than Versamid® 140 systems. It is often blended with Versamid® G 250 US, a fatty amido amine resin, to provide a range of viscosities, cure speeds and resistance properties. veja menos | |
| Versamid® 140 | Gabriel Performance Products | Versamid® 140 is a medium to low viscosity, reactive polyamide resin solution designed for use with solid or liquid epoxy resins to provide tough, chemical-resistant thermoset coating applications that cure at room temperature. This resin is also useful i...veja mais Versamid® 140 is a medium to low viscosity, reactive polyamide resin solution designed for use with solid or liquid epoxy resins to provide tough, chemical-resistant thermoset coating applications that cure at room temperature. This resin is also useful in adhesive applications. Versamid® 140 and epoxy resin coating systems are more chemical and solvent resistant than Versamid® 115 systems and generally lower in viscosity than Versamid® 125 systems. It offers a unique combination of hardness and flexibility along with the highest chemical and solvent resistance of the dimer-based polyamide resin series. veja menos | |
| Versamid® 228 | Gabriel Performance Products | Versamid® 228 is a modified polyamide/epoxy adduct designed for reactions with low viscosity liquid epoxy resins. Versamid® 228 and epoxy resin systems are recommended for applications such as industrial maintenance coating applications, primers, and enam...veja mais Versamid® 228 is a modified polyamide/epoxy adduct designed for reactions with low viscosity liquid epoxy resins. Versamid® 228 and epoxy resin systems are recommended for applications such as industrial maintenance coating applications, primers, and enamel paint formulations. veja menos | |
| Versamid® C-30 | Gabriel Performance Products | Versamid® C-30 is a low viscosity, light colored, amine curing agent that is moisture insensitive at room temperature. It has been designed specifically for use in high solids coatings, self-leveling flooring and castings where excellent chemical resistan...veja mais Versamid® C-30 is a low viscosity, light colored, amine curing agent that is moisture insensitive at room temperature. It has been designed specifically for use in high solids coatings, self-leveling flooring and castings where excellent chemical resistance, good color retention and excellent flow and blush resistance are required. veja menos | |
| Versamid® EH-30 | Gabriel Performance Products | Versamid® EH-30 is a tertiary amine accelerator and curing agent for epoxy resin systems. The anionic catalyst is a Lewis base that contains unshared electrons to facilitate opening the oxirane ring. Versamid® EH-30, a Mannich base, shows marked accelerat...veja mais Versamid® EH-30 is a tertiary amine accelerator and curing agent for epoxy resin systems. The anionic catalyst is a Lewis base that contains unshared electrons to facilitate opening the oxirane ring. Versamid® EH-30, a Mannich base, shows marked acceleration because of the presence of the phenolic hydroxyl. veja menos | |
| Versamid® G-151 | Gabriel Performance Products | Versamid® G-151 is an amidoamine resin of low viscosity suitable for catalyzing both liquid and solid epoxy. It offers the same advantages as other types of amino-amides, however, Versamid® G-151 has a lower sensitivity to humidity. | |
| Versamid® G-490 | Gabriel Performance Products | Versamid® G-490 is a liquid amidoamine resin designed for reaction with liquid or solid epoxy resins. It can be used as all or part of the curing agent component in high solids, adhesive, sealant, electrical potting, coating and flooring applications. |
