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Die Bond GB-1

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Synasia, Inc.目前只在以下作出标识的区域展示其产品资料:

Die Bond GB-1 is a silver colored, smooth, creamy thixotropic paste. It is a single component, low viscosity, high adhesion, low temperature, and fast cure electrically conductive adhesive. Die Bond GB-1 is used in adhesives for Die Attach and LED bonding. This product is primarily used for pin transfer and stamping applications.

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Synasia, Inc.

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