Epokukdo KDCP-200 is a multi-functional epoxy resin derived from poly-addition compound of dicyclopentadiene and phenol, and is designed for application of high performance epoxy molding compound(EMC) in semi-conductor and laminates. The strongest advantage in semi-conductor packaging using this product is much lower moisture absorption than previous generation epoxy resins, such as o-cresol novolac epoxy resin(YDCN type) or biphenyl type epoxy resin. This product can be substituted for YDCN and biphenyl type epoxy resin for preparing EMC with excellent performance in SMD.
Kukdo Chemical Co. was established in 1972 and has since grown to become one of the world's largest producers of epoxy resin and curing agents as well as thermosetting resins, inorganic chemicals, polyols and polyureas. Their products are well suited for use in the production of primers and maintenance coatings, cured epoxies and floorings and in the production of coatings that are curable at low temperatures as well as other uses for the paint and coating industry.
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