| Die Bond GB-1 | Synasia, Inc. | Die Bond GB-1 is a silver colored, smooth, creamy thixotropic paste. It is a single component, low viscosity, high adhesion, low temperature, and fast cure electrically conductive adhesive. Die Bond GB-1 is used in adhesives for Die Attach and LED bonding...展开 Die Bond GB-1 is a silver colored, smooth, creamy thixotropic paste. It is a single component, low viscosity, high adhesion, low temperature, and fast cure electrically conductive adhesive. Die Bond GB-1 is used in adhesives for Die Attach and LED bonding. This product is primarily used for pin transfer and stamping applications. 收起 |
