| CV-2943 | NuSil Silicone Technology 1 | CV-2943 is a thermally conductive RTV silicone that has controlled volatility and is designed for enhanced performance in extreme high or low temperatures. It can be used for applications that require low outgassing and minimal volatile condensables under...展开 CV-2943 is a thermally conductive RTV silicone that has controlled volatility and is designed for enhanced performance in extreme high or low temperatures. It can be used for applications that require low outgassing and minimal volatile condensables under extreme operating conditions. This product is also utilized as an adhesive for openings in housings or modules where grooves and other configurations require a limited flow material. 收起 | |
| R-2634 | NuSil Silicone Technology 1 | R-2634 is a two-part, electrically conductive RTV silicone that is designed for enhanced performance in extreme high and low temperatures. It can be used as an adhesive to bond covers on housings or where grooves and other configurations require a non-flo...展开 R-2634 is a two-part, electrically conductive RTV silicone that is designed for enhanced performance in extreme high and low temperatures. It can be used as an adhesive to bond covers on housings or where grooves and other configurations require a non-flowable material. This product is especially useful for sealing formed-in-place conductive gaskets and grounding connections. It can also be used for EMI and RFI shielding for aerospace and electrical applications. 收起 | |
| R-2949 | NuSil Silicone Technology 1 | R-2949 is a two-part, white, thermally conductive silicone that can cure rapidly with the addition of heat. It is an ideal product to be used in applications that require protection against extreme low and high temperatures. It can be used as an adhesive ...展开 R-2949 is a two-part, white, thermally conductive silicone that can cure rapidly with the addition of heat. It is an ideal product to be used in applications that require protection against extreme low and high temperatures. It can be used as an adhesive to bond openings in housings and modules where grooves or other configurations require a limited flow material with moderate thermal conductivity. It can also provide the transfer of heat between electrical components and their heat sinks. 收起 |
