| Spectre™ 150 | Epolin | Spectre™ 150 is a black, solvent-based screen printing ink. This product is characterized by its ability to absorb UV and visible light while allowing transmittance of infrared light. It is designed for printing on graphic overlays for IR ports, remote co...展开 Spectre™ 150 is a black, solvent-based screen printing ink. This product is characterized by its ability to absorb UV and visible light while allowing transmittance of infrared light. It is designed for printing on graphic overlays for IR ports, remote controls, touch screens, and other digital electronic devices. 收起 | |
| Spectre™ 160 | Epolin | Spectre™ 160 is a black, solvent-based screen printing ink. This product is characterized by its ability to absorb UV and visible light while allowing transmittance of infrared light. It is designed for printing on graphic overlays for IR ports, remote co...展开 Spectre™ 160 is a black, solvent-based screen printing ink. This product is characterized by its ability to absorb UV and visible light while allowing transmittance of infrared light. It is designed for printing on graphic overlays for IR ports, remote controls, touch screens, and other digital electronic devices. 收起 | |
| Thomide 423 | Sanho Chemical Co., Ltd. | Thomide 423 is a polyamide-adduct type epoxy resin curing agent in a brown-colored viscous liquid form. This product has a total solids content of 58-62%. Thomide 423 is most commonly used in fast-curing paint formulation applications. | |
| Tohmide 1310 | Sanho Chemical Co., Ltd. | Tohmide 1310 is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 1500-4500 mPa.s and a softening point of 115-125°C. Tohmide 1310 is most commonly used in hot-melt adhesive formulation applications. | |
| Tohmide 1360 | Sanho Chemical Co., Ltd. | Tohmide 1360 is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 1500-4500 mPa.s and a softening point of 165-175°C. Tohmide 1360 is most commonly used in hot-melt adhesive formulation applications. | |
| Tohmide 213-A | Sanho Chemical Co., Ltd. | Tohmide 213-A is a reactive polyamide epoxy resin curing agent in a yellow-brown-colored viscous liquid form. This product has a total solids content of 48-52%. Tohmide 213-A is most commonly used in fast-curing paint formulation applications. | |
| Tohmide 215-70X | Sanho Chemical Co., Ltd. | Tohmide 215-70X is a reactive polyamide epoxy resin curing agent in a brown-colored viscous liquid form. This product has a total solids content of 68-72%. Tohmide 215-70X is most commonly used in fast-curing paint formulation applications. | |
| Tohmide 215-X | Sanho Chemical Co., Ltd. | Tohmide 215-X is a polyaminoamide-type epoxy curing agent in a brown-colored viscous liquid form. This product has a viscosity of 50,000-70,000 mPa.s and a specific gravity of 0.97. Tohmide 215-X is most commonly used in coating formulation applications. | |
| Tohmide 225-R | Sanho Chemical Co., Ltd. | Tohmide 225-R is a medium viscosity, reactive polyaminoamide in a brown-colored viscous liquid form. This product has a viscosity of 3500-10,000 mPa.s and a specific gravity of 0.97. Tohmide 225-R is most commonly used in adhesive, sealant, putty, and sur...展开 Tohmide 225-R is a medium viscosity, reactive polyaminoamide in a brown-colored viscous liquid form. This product has a viscosity of 3500-10,000 mPa.s and a specific gravity of 0.97. Tohmide 225-R is most commonly used in adhesive, sealant, putty, and surface coating formulation applications. 收起 | |
| Tohmide 225-X | Sanho Chemical Co., Ltd. | Tohmide 225-X is a polyaminoamide-type epoxy curing agent in a brown-colored viscous liquid form. This product has a viscosity of 8000-12,000 mPa.s and a specific gravity of 0.97. Tohmide 225-X is most commonly used in adhesive, sealant, and surface coati...展开 Tohmide 225-X is a polyaminoamide-type epoxy curing agent in a brown-colored viscous liquid form. This product has a viscosity of 8000-12,000 mPa.s and a specific gravity of 0.97. Tohmide 225-X is most commonly used in adhesive, sealant, and surface coating formulation applications. 收起 | |
| Tohmide 225-XX | Sanho Chemical Co., Ltd. | Tohmide 225-XX is a polyaminoamide-type epoxy curing agent with a longer pot life in a brown-colored viscous liquid form. This product has a viscosity of 8000-12,000 mPa.s and a specific gravity of 0.97. Tohmide 225-XX is most commonly used in adhesive, s...展开 Tohmide 225-XX is a polyaminoamide-type epoxy curing agent with a longer pot life in a brown-colored viscous liquid form. This product has a viscosity of 8000-12,000 mPa.s and a specific gravity of 0.97. Tohmide 225-XX is most commonly used in adhesive, sealant, and surface coating formulation applications. 收起 | |
| Tohmide 235-A | Sanho Chemical Co., Ltd. | Tohmide 235-A is a polyaminoamide-type epoxy curing agent in a brown-colored viscous liquid form. This product has a viscosity of 8000-18,000 mPa.s and a specific gravity of 0.97. TOHMIDE 235-A is most commonly used in structural adhesive and grout formul...展开 Tohmide 235-A is a polyaminoamide-type epoxy curing agent in a brown-colored viscous liquid form. This product has a viscosity of 8000-18,000 mPa.s and a specific gravity of 0.97. TOHMIDE 235-A is most commonly used in structural adhesive and grout formulation applications. 收起 | |
| Tohmide 235-S | Sanho Chemical Co., Ltd. | Tohmide 235-S is a medium viscosity, polyaminoamide-type epoxy curing agent in a brown-colored viscous liquid form. This product has a viscosity of 4500-9000 mPa.s and a specific gravity of 0.97. Tohmide 235-S is most commonly used in structural adhesive ...展开 Tohmide 235-S is a medium viscosity, polyaminoamide-type epoxy curing agent in a brown-colored viscous liquid form. This product has a viscosity of 4500-9000 mPa.s and a specific gravity of 0.97. Tohmide 235-S is most commonly used in structural adhesive and grout formulation applications. 收起 | |
| Tohmide 2400 | Sanho Chemical Co., Ltd. | Tohmide 2400 is a low viscosity, reactive polyamide hardener in a brown-colored viscous liquid form. This product has a viscosity of 2500-5000 mPa.s and a specific gravity of 0.97. Tohmide 2400 is most commonly used in medium heat adhesive formulation app...展开 Tohmide 2400 is a low viscosity, reactive polyamide hardener in a brown-colored viscous liquid form. This product has a viscosity of 2500-5000 mPa.s and a specific gravity of 0.97. Tohmide 2400 is most commonly used in medium heat adhesive formulation applications. 收起 | |
| Tohmide 245 | Sanho Chemical Co., Ltd. | Tohmide 245 is a polyaminoamide-type epoxy curing agent in a brown-colored liquid form. This product has a viscosity of 1500-3000 mPa.s and a specific gravity of 0.96. Tohmide 245 is most commonly used in bonding, sealing, and resin mortar formulation app...展开 Tohmide 245 is a polyaminoamide-type epoxy curing agent in a brown-colored liquid form. This product has a viscosity of 1500-3000 mPa.s and a specific gravity of 0.96. Tohmide 245 is most commonly used in bonding, sealing, and resin mortar formulation applications. 收起 | |
| Tohmide 245-HS | Sanho Chemical Co., Ltd. | Tohmide 245-HS is a very low viscosity, fatty polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 800-1100 cPs. Tohmide 245-HS is most commonly used in structural adhesive and protective coating formulation applications...展开 Tohmide 245-HS is a very low viscosity, fatty polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 800-1100 cPs. Tohmide 245-HS is most commonly used in structural adhesive and protective coating formulation applications. 收起 | |
| Tohmide 245-LP | Sanho Chemical Co., Ltd. | Tohmide 245-LP is a low viscosity, polyaminoamide epoxy curing agent in a brown-colored liquid form. This product has a viscosity of 200-500 mPa.s and a specific gravity of 0.90. Tohmide 245-LP is most commonly used in structural adhesive and protective c...展开 Tohmide 245-LP is a low viscosity, polyaminoamide epoxy curing agent in a brown-colored liquid form. This product has a viscosity of 200-500 mPa.s and a specific gravity of 0.90. Tohmide 245-LP is most commonly used in structural adhesive and protective coating formulation applications. 收起 | |
| Tohmide 245-S | Sanho Chemical Co., Ltd. | Tohmide 245-S is a polyaminoamide epoxy curing agent in a brown-colored liquid form. This product has a viscosity of 1000-2500 mPa.s and a specific gravity of 0.96. Tohmide 245-S is most commonly used in bonding, sealing, and resin mortar formulation appl...展开 Tohmide 245-S is a polyaminoamide epoxy curing agent in a brown-colored liquid form. This product has a viscosity of 1000-2500 mPa.s and a specific gravity of 0.96. Tohmide 245-S is most commonly used in bonding, sealing, and resin mortar formulation applications. 收起 | |
| Tohmide 2500 | Sanho Chemical Co., Ltd. | Tohmide 2500 is a low viscosity, reactive polyamide hardener in a brown-colored viscous liquid form. This product has a viscosity of 500-1000 mPa.s and a specific gravity of 0.95. Tohmide 2500 is most commonly used in heat curing adhesive formulation appl...展开 Tohmide 2500 is a low viscosity, reactive polyamide hardener in a brown-colored viscous liquid form. This product has a viscosity of 500-1000 mPa.s and a specific gravity of 0.95. Tohmide 2500 is most commonly used in heat curing adhesive formulation applications. 收起 | |
| Tohmide 252 | Sanho Chemical Co., Ltd. | Tohmide 252 is a polyaminoamide epoxy curing agent in a brown-colored liquid form. This product has a viscosity of 100-400 mPa.s and a specific gravity of 0.96. Tohmide 252 is most commonly used in adhesive formulation applications. | |
| Tohmide 255 | Sanho Chemical Co., Ltd. | Tohmide 255 is a low viscosity, fast setting, reactive polyamide hardener in a brown-colored viscous liquid form. This product has a viscosity of 300-600 mPa.s and a specific gravity of 0.97. Tohmide 255 is most commonly used in reactive epoxy lining and ...展开 Tohmide 255 is a low viscosity, fast setting, reactive polyamide hardener in a brown-colored viscous liquid form. This product has a viscosity of 300-600 mPa.s and a specific gravity of 0.97. Tohmide 255 is most commonly used in reactive epoxy lining and thin bonding mortar formulation applications. 收起 | |
| Tohmide 275 | Sanho Chemical Co., Ltd. | Tohmide 275 is a low viscosity, fast setting, reactive polyamide hardener in a brown-colored viscous liquid form. This product has a viscosity of 1200-3200 mPa.s and a specific gravity of 1.02. Tohmide 275 is most commonly used in coating and adhesive for...展开 Tohmide 275 is a low viscosity, fast setting, reactive polyamide hardener in a brown-colored viscous liquid form. This product has a viscosity of 1200-3200 mPa.s and a specific gravity of 1.02. Tohmide 275 is most commonly used in coating and adhesive formulation applications. 收起 | |
| Tohmide 280-B | Sanho Chemical Co., Ltd. | Tohmide 280-B is a low viscosity, fast setting, reactive polyamide hardener in a brown-colored viscous liquid form. This product has a viscosity of 500-1000 mPa.s and a specific gravity of 0.96. Tohmide 280-B is most commonly used in sealant and adhesive ...展开 Tohmide 280-B is a low viscosity, fast setting, reactive polyamide hardener in a brown-colored viscous liquid form. This product has a viscosity of 500-1000 mPa.s and a specific gravity of 0.96. Tohmide 280-B is most commonly used in sealant and adhesive formulation applications. 收起 | |
| Tohmide 390 | Sanho Chemical Co., Ltd. | Tohmide 390 is a solid-type polyamide resin in a brown pellet form. This product has a viscosity of 200-400 mPa.s and a softening point of 175-185°C. Tohmide 390 is most commonly used in hot-melt structural adhesive formulation applications. | |
| Tohmide 393 | Sanho Chemical Co., Ltd. | Tohmide 393 is a fatty polyamide resin in a brown-yellow pellet form. This product has a softening point of 110-120°C. Tohmide 393 is most commonly used in rotogravure printing ink and varnish formulation applications. | |
| Tohmide 394 | Sanho Chemical Co., Ltd. | Tohmide 394 is a solid-type fatty polyamide resin in a brown pellet form. This product has a viscosity of 500-1000 mPa.s and a softening point of 105-115°C. Tohmide 394 is most commonly used in hot-melt structural adhesive formulation applications. | |
| Tohmide 394-N | Sanho Chemical Co., Ltd. | Tohmide 394-N is a solid-type fatty polyamide resin in a brown-yellow pellet form. This product has a softening point of 105-115°C. Tohmide 394-N is most commonly used in rotogravure printing ink formulation applications. | |
| Tohmide 437 | Sanho Chemical Co., Ltd. | Tohmide 437 is a polyamide-adduct type epoxy resin curing agent in a brown-colored viscous liquid form. This product has a total solids content of 73-77%. Tohmide 437 is most commonly used in fast-curing paint formulation applications. | |
| Tohmide 441-A | Sanho Chemical Co., Ltd. | Tohmide 441-A is a reactive polyamide epoxy resin curing agent in a brown-colored viscous liquid form. This product has a total solids content of 82-86%. Tohmide 441-A is most commonly used in corrosion resistant paint formulation applications. | |
| Tohmide 558 | Sanho Chemical Co., Ltd. | Tohmide 558 is a solid-type fatty polyamide resin in a brown-colored pellet form. This product has a viscosity of 300-850 mPa.s and a softening point of 155-165°C. Tohmide 558 is most commonly used in structural hot-melt adhesive formulation applications. | |
| Tohmide 558-N | Sanho Chemical Co., Ltd. | Tohmide 558-N is a solid-type fatty polyamide resin in a brown-colored pellet form. This product has a viscosity of 300-800 mPa.s and a softening point of 155-165°C. Tohmide 558-N is most commonly used in structural hot-melt adhesive formulation applicati...展开 Tohmide 558-N is a solid-type fatty polyamide resin in a brown-colored pellet form. This product has a viscosity of 300-800 mPa.s and a softening point of 155-165°C. Tohmide 558-N is most commonly used in structural hot-melt adhesive formulation applications. 收起 | |
| Tohmide 560 | Sanho Chemical Co., Ltd. | Tohmide 560 is a low-melting viscosity polyamide resin in a brown-colored pellet form. This product has a viscosity of 200-400 mPa.s and a softening point of 155-165°C. Tohmide 560 is most commonly used in hot-melt adhesive formulation applications. | |
| Tohmide 90 | Sanho Chemical Co., Ltd. | Tohmide 90 is a fatty polyamide resin in a brown-yellow pellet form. This product has a softening point of 105-115°C. Tohmide 90 is most commonly used in rotogravure printing ink formulation applications. | |
| Tohmide 92 | Sanho Chemical Co., Ltd. | Tohmide 92 is a fatty polyamide resin in a brown-yellow pellet form. This product has a softening point of 115-125°C. Tohmide 92 is most commonly used in flexographic printing ink formulation applications. | |
| Tohmide HR-11 | Sanho Chemical Co., Ltd. | Tohmide HR-11 is a high viscosity, polyaminoamide epoxy curing agent in a brown-colored viscous liquid form. This product has a viscosity of 8000-15,000 mPa.s and a specific gravity of 0.98. Tohmide HR-11 is most commonly used in adhesive formulation appl...展开 Tohmide HR-11 is a high viscosity, polyaminoamide epoxy curing agent in a brown-colored viscous liquid form. This product has a viscosity of 8000-15,000 mPa.s and a specific gravity of 0.98. Tohmide HR-11 is most commonly used in adhesive formulation applications. 收起 | |
| Tohmide RS-640 | Sanho Chemical Co., Ltd. | Tohmide RS-640 is a high viscosity, reactive polyamide hardener in a brown-colored viscous liquid form. This product has a viscosity of 10,000-14,000 mPa.s and a specific gravity of 0.96. Tohmide RS-640 is most commonly used in wood adhesive formulation a...展开 Tohmide RS-640 is a high viscosity, reactive polyamide hardener in a brown-colored viscous liquid form. This product has a viscosity of 10,000-14,000 mPa.s and a specific gravity of 0.96. Tohmide RS-640 is most commonly used in wood adhesive formulation applications. 收起 | |
| Tohmide TXA-254B | Sanho Chemical Co., Ltd. | Tohmide TXA-254B is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 3500-5500 mPa.s and a softening point of 150-160°C. Tohmide TXA-254B is most commonly used in hot-melt adhesive formulation applica...展开 Tohmide TXA-254B is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 3500-5500 mPa.s and a softening point of 150-160°C. Tohmide TXA-254B is most commonly used in hot-melt adhesive formulation applications. 收起 | |
| Tohmide TXA-265 | Sanho Chemical Co., Ltd. | Tohmide TXA-265 is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 2000-4000 mPa.s and a softening point of 140-150°C. Tohmide TXA-265 is most commonly used in hot-melt adhesive formulation applicati...展开 Tohmide TXA-265 is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 2000-4000 mPa.s and a softening point of 140-150°C. Tohmide TXA-265 is most commonly used in hot-melt adhesive formulation applications. 收起 | |
| Tohmide TXC-241B | Sanho Chemical Co., Ltd. | Tohmide TXC-241B is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 11,000-20,000 mPa.s and a softening point of 95-105°C. Tohmide TXC-241B is most commonly used in hot-melt adhesive formulation appl...展开 Tohmide TXC-241B is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 11,000-20,000 mPa.s and a softening point of 95-105°C. Tohmide TXC-241B is most commonly used in hot-melt adhesive formulation applications. 收起 | |
| Tohmide TXC-241F | Sanho Chemical Co., Ltd. | Tohmide TXC-241F is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 11,000-20,000 mPa.s and a softening point of 105-110°C. Tohmide TXC-241F is most commonly used in hot-melt adhesive formulation app...展开 Tohmide TXC-241F is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 11,000-20,000 mPa.s and a softening point of 105-110°C. Tohmide TXC-241F is most commonly used in hot-melt adhesive formulation applications. 收起 | |
| Tohmide TXC-241H | Sanho Chemical Co., Ltd. | Tohmide TXC-241H is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 15,000-25,000 mPa.s and a softening point of 100-110°C. Tohmide TXC-241H is most commonly used in hot-melt adhesive formulation app...展开 Tohmide TXC-241H is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 15,000-25,000 mPa.s and a softening point of 100-110°C. Tohmide TXC-241H is most commonly used in hot-melt adhesive formulation applications. 收起 | |
| Tohmide TXC-243A | Sanho Chemical Co., Ltd. | Tohmide TXC-243A is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 5000-10,000 mPa.s and a softening point of 100-110°C. Tohmide TXC-243A is most commonly used in hot-melt adhesive formulation appli...展开 Tohmide TXC-243A is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 5000-10,000 mPa.s and a softening point of 100-110°C. Tohmide TXC-243A is most commonly used in hot-melt adhesive formulation applications. 收起 | |
| Tohmide TXC-244C | Sanho Chemical Co., Ltd. | Tohmide TXC-244C is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 2000-5000 mPa.s and a softening point of 155-165°C. Tohmide TXC-244C is most commonly used in hot-melt adhesive formulation applica...展开 Tohmide TXC-244C is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 2000-5000 mPa.s and a softening point of 155-165°C. Tohmide TXC-244C is most commonly used in hot-melt adhesive formulation applications. 收起 | |
| Tohmide TXC-245A | Sanho Chemical Co., Ltd. | Tohmide TXC-245A is a solid-type polyamide resin in a brown-colored pellet form. This product has a viscosity of 1000-2000 mPa.s and a softening point of 85-95°C. Tohmide TXC-245A is most commonly used in heat transfer ink formulation applications. | |
| Tohmide TXC-269 | Sanho Chemical Co., Ltd. | Tohmide TXC-269 is a polyamide resin in a brown-colored pellet form. This product has a viscosity of 3000-4000 mPa.s and a softening point of 170-180°C. Tohmide TXC-269 is most commonly used in hot-melt low-pressure molding adhesive formulation applicatio...展开 Tohmide TXC-269 is a polyamide resin in a brown-colored pellet form. This product has a viscosity of 3000-4000 mPa.s and a softening point of 170-180°C. Tohmide TXC-269 is most commonly used in hot-melt low-pressure molding adhesive formulation applications. 收起 | |
| Tohmide TXC-271 | Sanho Chemical Co., Ltd. | Tohmide TXC-271 is a polyamide resin in a brown-colored pellet form. This product has a viscosity of 500-1200 mPa.s and a softening point of 141-153°C. Tohmide TXC-271 is most commonly used in hot-melt low-pressure molding adhesive formulation application...展开 Tohmide TXC-271 is a polyamide resin in a brown-colored pellet form. This product has a viscosity of 500-1200 mPa.s and a softening point of 141-153°C. Tohmide TXC-271 is most commonly used in hot-melt low-pressure molding adhesive formulation applications. 收起 | |
| Tohmide TXH-674B | Sanho Chemical Co., Ltd. | Tohmide TXH-674B is a modified polyaminoamide hardener in an amber liquid form. This product has a viscosity of 10,000-20,000 mPa.s and a specific gravity of 1.11. Tohmide TXH-674B is most commonly used in concrete coating formulation applications. | |
| Tohmide TXS-53C | Sanho Chemical Co., Ltd. | Tohmide TXS-53C is a self-emulsifiable epoxy curing agent in a yellow-brown liquid form. This product has a viscosity of 3000-12,500 mPa.s. Tohmide TXS-53C is most commonly used in concrete primer formulation applications. |
