Epoxy Phenol B.G.E. | Synpol Products PVT. Ltd | Epoxy Phenol B.G.E. is a reactive diluent. This product has a density of 0.92-0.94 g/cm3. Epoxy Phenol B.G.E. is most commonly used in casting, encapsulation, and bonding applications. | |
Epoxy Phenol CNSL | Synpol Products PVT. Ltd | Epoxy Phenol CNSL is a reactive diluent. This product has a density of 0.96-0.97 g/cm3. Epoxy Phenol CNSL is most commonly used in casting, encapsulation, and bonding applications. | |
Epoxy Phenol P.G.E. | Synpol Products PVT. Ltd | Epoxy Phenol P.G.E. is a reactive diluent. This product has a density of 1.11-1.22 g/cm3. Epoxy Phenol P.G.E. is most commonly used in casting, encapsulation, and bonding applications. | |
Synpol 210 | Synpol Products PVT. Ltd | Synpol 210 is a bisphenol A-based, unmodified reactive diluent. This product has a viscosity at 25°C of 180-210 Poises. Synpol 210 is most commonly used in coating, lamination, and adhesive applications. | |
Synpol 220 | Synpol Products PVT. Ltd | Synpol 220 is a bisphenol A-based, unmodified reactive diluent. This product has a viscosity at 25°C of 180-200 Poises. Synpol 220 is most commonly used in coating, lamination, and adhesive applications. |