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RF 1366 Resin Formulators (E.V. Roberts) RF 1366 is a medium viscosity standard epoxy resin designed for potting, encapsulating and filament winding. It can be used with a wide variety of curing agents to generate products with a broad range of work lives, cure conditions and mechanical properti...展开 RF 1366 is a medium viscosity standard epoxy resin designed for potting, encapsulating and filament winding. It can be used with a wide variety of curing agents to generate products with a broad range of work lives, cure conditions and mechanical properties. This system can be cured in high humidity and low temperatures and produces a hard glossy surface. RF 1366 offers very good wet out and can produce a high strength laminate. In addition, this resin can be used for coating, potting and encapsulating small electronic components and exhibits good electrical properties. 收起
RF 713 A/B Kit Resin Formulators (E.V. Roberts) RF 713 A/B Kit is a thixotropic epoxy adhesive system with good physical strength and high electrical conductivity. This material is designed to be used where hot solder applications are impractical or on parts which cannot be subjected to heat. RF 713 is...展开 RF 713 A/B Kit is a thixotropic epoxy adhesive system with good physical strength and high electrical conductivity. This material is designed to be used where hot solder applications are impractical or on parts which cannot be subjected to heat. RF 713 is also effective as a shielding material. 收起