| Resiflow® L-210 | Estron Chemical, Inc. | Resiflow® L-210 is a low viscosity, non-reactive acrylic polymer used as a leveling agent in high solids, UV curing, coil, and other coating systems. Resiflow® L-210 can also facilitate air release and minimize surface imperfections such as pinholes and c...展开 Resiflow® L-210 is a low viscosity, non-reactive acrylic polymer used as a leveling agent in high solids, UV curing, coil, and other coating systems. Resiflow® L-210 can also facilitate air release and minimize surface imperfections such as pinholes and craters. Resiflow® L-210 has compatibility with all coating systems including acrylic, alkyd, phenolic, epoxy, polyester, polyurethane, nitrocellulose lacquer, and other systems. 收起 | |
| Resiflow® LG-99 | Estron Chemical, Inc. | Resiflow® LG-99 is a non-silicone, flow, leveling and wetting additive for UV and solvent-based inks and coatings. Typical dosage is 0.1-3.0% based on total formula. Resiflow® LG-99 can also be used in UV free radical, cationic cure systems, solvent-based...展开 Resiflow® LG-99 is a non-silicone, flow, leveling and wetting additive for UV and solvent-based inks and coatings. Typical dosage is 0.1-3.0% based on total formula. Resiflow® LG-99 can also be used in UV free radical, cationic cure systems, solvent-based acrylics, phenolics, epoxies, polyesters, polyurethanes, nitrocellulose lacquers, and other systems. 收起 | |
| Resiflow® PL-200B | Estron Chemical, Inc. | Resiflow® PL-200B is a standard type flow control agent which can impart excellent re-coatability and intercoat adhesion properties in addition to good flow and leveling. Resiflow® PL-200B is widely used and known for its suitability and reliable performa...展开 Resiflow® PL-200B is a standard type flow control agent which can impart excellent re-coatability and intercoat adhesion properties in addition to good flow and leveling. Resiflow® PL-200B is widely used and known for its suitability and reliable performance across the spectrum of typical binder chemistries including Polyester-TGIC, Polyester-HAA, Hybrids and Epoxies. 收起 | |
| Sunmide® 307D-60 Curing Agent | Evonik Operations GmbH, BL Crosslinkers | Sunmide® 307D-60 Curing Agent is a polyamide amine in xylene and n-butanol. It displays very good thixotropic properties. It is most commonly used for fast cure and fast dry applications for industrial epoxy coatings. | Request Sample |
