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E.V. Roberts

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E.V. Roberts is a full-service supplier of advanced engineered materials. We are fully AS- and ISO-certified and authorized to distribute 3M, Henkel, and Momentive adhesives and films, sealants, surface treatments, resins, curing agents and more. Resin Formulators- our custom formulation division, manufactures custom epoxy resin solutions, while our dispensing and packaging business ensures precision and efficiency.
RF 1120 A/B Resin Formulators (E.V. Roberts) RF 1120 A/B is a two-part epoxy adhesive system for bonding a wide variety of substrates. This product is thixotropic, and so can be used on vertical surfaces without excessive run out from the bond line. RF 1120 is also supplied in a one part premixed an...展開 RF 1120 A/B is a two-part epoxy adhesive system for bonding a wide variety of substrates. This product is thixotropic, and so can be used on vertical surfaces without excessive run out from the bond line. RF 1120 is also supplied in a one part premixed and frozen form. RF 1120 Blue is manufactured to MT-5-20. 收起
RF 1141 A/B Resin Formulators (E.V. Roberts) RF 1141 A/B is a two-part low-density epoxy syntactic system. It is qualified to SCGMS 58001, Type 2, Class 1 or Class 2. This product is slightly thixotropic, and so can be used on vertical surfaces without excessive run out. RF 1141 can be supplied in S...展開 RF 1141 A/B is a two-part low-density epoxy syntactic system. It is qualified to SCGMS 58001, Type 2, Class 1 or Class 2. This product is slightly thixotropic, and so can be used on vertical surfaces without excessive run out. RF 1141 can be supplied in Semkits. 收起
RF 1144 A/B Kit Resin Formulators (E.V. Roberts) RF 1144 A/B Kit is a two-part heat cured, low density, high strength, syntactic system that is formulated for continuous service at high temperatures. RF 1144 has excellent mechanical properties up to 350°F.
RF 1366 Resin Formulators (E.V. Roberts) RF 1366 is a medium viscosity standard epoxy resin designed for potting, encapsulating and filament winding. It can be used with a wide variety of curing agents to generate products with a broad range of work lives, cure conditions and mechanical properti...展開 RF 1366 is a medium viscosity standard epoxy resin designed for potting, encapsulating and filament winding. It can be used with a wide variety of curing agents to generate products with a broad range of work lives, cure conditions and mechanical properties. This system can be cured in high humidity and low temperatures and produces a hard glossy surface. RF 1366 offers very good wet out and can produce a high strength laminate. In addition, this resin can be used for coating, potting and encapsulating small electronic components and exhibits good electrical properties. 收起
RF 1386 A/B Kit Resin Formulators (E.V. Roberts) RF 1386 A/B Kit is a two-part, thixotropic, high strength epoxy adhesive system designed for use in food packaging and water filtration applications and meets the requirements of provision 21 CFR 175.105. The raw materials used in RF 1386 are listed for u...展開 RF 1386 A/B Kit is a two-part, thixotropic, high strength epoxy adhesive system designed for use in food packaging and water filtration applications and meets the requirements of provision 21 CFR 175.105. The raw materials used in RF 1386 are listed for use in “Food Packaging Adhesive” applications and are classified as FDA Approved under the same provision. It has excellent wet out and can easily penetrate fibrous substrates. RF 1386 has exceptional adhesive strength to a wide variety of substrates, including membranes, separators and other material used in reverse osmosis. 收起
RF 1392 A/B Resin Formulators (E.V. Roberts) RF 1392 A/B is a medium fast curing toughened epoxy adhesive system for bonding a wide variety of substrates. This product is slightly thixotropic, and so can be used on vertical surfaces without excessive run out from the bond line. RF 1392 A/B has excel...展開 RF 1392 A/B is a medium fast curing toughened epoxy adhesive system for bonding a wide variety of substrates. This product is slightly thixotropic, and so can be used on vertical surfaces without excessive run out from the bond line. RF 1392 A/B has excellent adhesion to metal and plastic substrates as well as excellent water soak and environmental resistance. 收起
RF 1393 A/B Resin Formulators (E.V. Roberts) RF 1393 A/B is a medium fast curing toughened epoxy adhesive system for bonding a wide variety of substrates. This product is slightly thixotropic, and so can be used on vertical surfaces without excessive run out from the bond line. RF 1393 A/B has excel...展開 RF 1393 A/B is a medium fast curing toughened epoxy adhesive system for bonding a wide variety of substrates. This product is slightly thixotropic, and so can be used on vertical surfaces without excessive run out from the bond line. RF 1393 A/B has excellent adhesion to metal and plastic substrates as well as excellent water soak and environmental resistance. RF 1393 A/B has been used to bond Fluorocarbon sheeting to steel structures. 收起
RF 14 Resin Formulators (E.V. Roberts) RF 14 is a standard polyamine (TETA) curing agent for use with liquid epoxy resins. It provides rapid cures at ambient temperature, excellent chemical resistance and intermediate temperature resistance. Compared with DETA, it has a lower vapor pressure, i...展開 RF 14 is a standard polyamine (TETA) curing agent for use with liquid epoxy resins. It provides rapid cures at ambient temperature, excellent chemical resistance and intermediate temperature resistance. Compared with DETA, it has a lower vapor pressure, is somewhat less hygroscopic and does not carbamate as readily. 收起
RF 1591BK A/B Resin Formulators (E.V. Roberts) RF 1591BK A/B is a low viscosity potting system. This system will meet the UL 94V-0 burn test as a self-extinguishing system. RF 1591BK A/B has good thermal conductivity, chemical and thermal shock resistance. It has very good adhesion to a variety of sub...展開 RF 1591BK A/B is a low viscosity potting system. This system will meet the UL 94V-0 burn test as a self-extinguishing system. RF 1591BK A/B has good thermal conductivity, chemical and thermal shock resistance. It has very good adhesion to a variety of substrates. 收起
RF 1710 A/B Resin Formulators (E.V. Roberts) RF 1710 A/B is a two-component polyurethane rigid foam system. It was formulated to resist high temperatures. It is also CFC free. This resin system is used whenever rigid closed cell foam is needed. Applications include thermal insulation of pipes, tanks...展開 RF 1710 A/B is a two-component polyurethane rigid foam system. It was formulated to resist high temperatures. It is also CFC free. This resin system is used whenever rigid closed cell foam is needed. Applications include thermal insulation of pipes, tanks, and panels. 收起
RF 1902 (AS) A/B Kit Resin Formulators (E.V. Roberts) RF 1902 (AS) A/B Kit is a low viscosity, low density, epoxy system designed for potting and encapsulating. This product is pourable when mixed and will cure at room temperature. This system will bond to a wide variety of substrates. Castings can be machin...展開 RF 1902 (AS) A/B Kit is a low viscosity, low density, epoxy system designed for potting and encapsulating. This product is pourable when mixed and will cure at room temperature. This system will bond to a wide variety of substrates. Castings can be machined or sanded within 16 to 24 hours. 收起
RF 2388 1-Component Resin Formulators (E.V. Roberts) RF 2388 is a 1-Component anti-corrosion paste adhesive system for aluminum substrates with excellent high temperature properties.
RF 24 Resin Formulators (E.V. Roberts) RF 24 is a cycloaliphatic amine curing agent used to cure various epoxy resins at elevated temperatures. This particular curing agent offers light color, low viscosity, long pot life and high glass transition temperature (Tg). Because of its light color, ...展開 RF 24 is a cycloaliphatic amine curing agent used to cure various epoxy resins at elevated temperatures. This particular curing agent offers light color, low viscosity, long pot life and high glass transition temperature (Tg). Because of its light color, absence of staining and excellent physical properties, it is recommended has a replacement for aromatic amines. 收起
RF 2869 Mod 2 Resin Formulators (E.V. Roberts) RF 2869 Mod 2 is a one-part, silver filled, electrically conductive epoxy adhesive. This system does not require mixing or vacuum degassing. Cure is achieved at temperatures as low as 82°C (180°F) for one hour or a short dwell at 121°C (250°F) for three m...展開 RF 2869 Mod 2 is a one-part, silver filled, electrically conductive epoxy adhesive. This system does not require mixing or vacuum degassing. Cure is achieved at temperatures as low as 82°C (180°F) for one hour or a short dwell at 121°C (250°F) for three minutes. Because RF 2869 Mod 2 is already vacuum degassed during manufacturing and no mixing is required, a void free casting or bond line is easily achieved. When cured, this adhesive will have very high thermal and electrical conductive properties. 收起
RF 2969 (Mod 4) A/B Kit Resin Formulators (E.V. Roberts) RF 2969 (Mod 4) A/B Kit is a thixotropic, high strength epoxy adhesive system with good physical strength and high electrical conductivity. This material is designed where hot solder applications are impractical or on parts which cannot be subjected to h...展開 RF 2969 (Mod 4) A/B Kit is a thixotropic, high strength epoxy adhesive system with good physical strength and high electrical conductivity. This material is designed where hot solder applications are impractical or on parts which cannot be subjected to heat. RF 2969 (Mod 4) is also effective as a shielding material. Open working time is 45 minutes and full cure is achieved in 24 hours at room temperature. 收起
RF 2970 A/B Resin Formulators (E.V. Roberts) RF 2970 A/B is a thixotropic, fast setting, high strength epoxy adhesive with good physical strength and high electrical conductivity. This material is designed for applications where hot solder applications are impractical or on parts which cannot be sub...展開 RF 2970 A/B is a thixotropic, fast setting, high strength epoxy adhesive with good physical strength and high electrical conductivity. This material is designed for applications where hot solder applications are impractical or on parts which cannot be subjected to heat. 收起
RF 30 Resin Formulators (E.V. Roberts) RF 35 is a di-functional polyglycol amine curing agent used to cure various epoxy resins at elevated temperatures. This particular curing agent offers light color, low viscosity, long pot life, high elongation and excellent thermal shock resistance.
RF 3000 Resin Formulators (E.V. Roberts) RF 3000 is a modified low viscosity Bisphenol A epoxy resin. It has viscosity of 500-700 cps at 77°F.
RF 32 Resin Formulators (E.V. Roberts) RF 35 is a modified aromatic amine. It offers long pot life coupled with rapid cure response. RF 32 is non-staining and has physical properties and chemical resistances equivalent to MDA cured resins.
RF 4010 Resin Formulators (E.V. Roberts) RF 4010 is medium viscosity modified bisphenol A epoxy. It is suitable for laminating, potting and RTM applications. The diluent in RF 4010 was chosen to minimize the effect on Tg, chemical resistance and reduce skin irritation. It does not contain butyl ...展開 RF 4010 is medium viscosity modified bisphenol A epoxy. It is suitable for laminating, potting and RTM applications. The diluent in RF 4010 was chosen to minimize the effect on Tg, chemical resistance and reduce skin irritation. It does not contain butyl glycidyl ether (BGE) or cresyl glycidyl ether (CGE). The cured properties of RF 4010 will depend on the choice of hardener. 收起
RF 4407 Resin Formulators (E.V. Roberts) RF 4407 is a filled epoxy resin designed for potting or casting applications. Various curing agents can be used to achieve particular end properties. Regardless of which curing agent is used, the end product will be a thermally conductive plastic. RF 4407...展開 RF 4407 is a filled epoxy resin designed for potting or casting applications. Various curing agents can be used to achieve particular end properties. Regardless of which curing agent is used, the end product will be a thermally conductive plastic. RF 4407 can be colored with any of the RF color concentrates. RF 4407-130 is colored black, RF 4407-139 is the white version. RF 4408 is the thixotropic version of RF 4407 when a soft paste is required prior to cure. 收起
RF 46 Resin Formulators (E.V. Roberts) RF 46 is a standard, medium viscosity, polyamide resin for ambient curing of epoxy resins. It is intended as an equivalent “drop-in” for Versamid 125 and can be used without formulation changes. When mixed at stoichiometric ratios it cures to hard, durabl...展開 RF 46 is a standard, medium viscosity, polyamide resin for ambient curing of epoxy resins. It is intended as an equivalent “drop-in” for Versamid 125 and can be used without formulation changes. When mixed at stoichiometric ratios it cures to hard, durable, moisture and chemical resistant plastics. The ratios can be extended to 1:1 by weight to improve flexibility. 收起
RF 47 Resin Formulators (E.V. Roberts) RF 47 is a standard, medium viscosity, polyamide resins for ambient curing of epoxy resins. They are intended as equivalent “drop-ins” for Versamid 125 and can be used without formulation changes. When mixed at stoichiometric ratios they cure to hard, dur...展開 RF 47 is a standard, medium viscosity, polyamide resins for ambient curing of epoxy resins. They are intended as equivalent “drop-ins” for Versamid 125 and can be used without formulation changes. When mixed at stoichiometric ratios they cure to hard, durable, moisture and chemical resistant plastics. The ratios can be extended to 1:1 by weight to improve flexibility. RF 47 complies with FDA 21 CFR 175.300, 21 CFR 176.170 and 21 CFR 175.105. RF 46 is a TETA free version of RF 47. 收起
RF 5000 Resin Formulators (E.V. Roberts) RF 5000 is a standard viscosity Bisphenol A epoxy resin. It has a viscosity of 11,000-15,000 cps at 77°F.
RF 5061 A/B Kit Resin Formulators (E.V. Roberts) RF 5061 A/B Kit is a two-part, semi-thixotropic epoxy paste designed for bonding soft, semi-porous materials such as wood, ceramic or composites. RF 5061 (Mod 1) and (Mod 2) are accelerated versions of RF 5061 that reduce fixturing time. When heated to 15...展開 RF 5061 A/B Kit is a two-part, semi-thixotropic epoxy paste designed for bonding soft, semi-porous materials such as wood, ceramic or composites. RF 5061 (Mod 1) and (Mod 2) are accelerated versions of RF 5061 that reduce fixturing time. When heated to 150°F, RF 5061 (Mod 1) can be handled and machined after 15-20 minutes. 收起
RF 53 Resin Formulators (E.V. Roberts) RF 53 is a bi-cyclic anhydride that offers exceptionally long pot life and very high Tg. It cures into a highly temperature resistant plastic and it used for high temperature filament winding and RTM/VARTM applications. RF 53 requires a suitable accelerat...展開 RF 53 is a bi-cyclic anhydride that offers exceptionally long pot life and very high Tg. It cures into a highly temperature resistant plastic and it used for high temperature filament winding and RTM/VARTM applications. RF 53 requires a suitable accelerator such as RF 22 or RF 80. 收起
RF 5407 Resin Formulators (E.V. Roberts) RF 5407 is an easy-to-use, aluminum oxide, liquid epoxy resin with excellent electrical insulation properties and high thermal conductivity. RF 5407 can be cured with nearly any hardener to produce a wide range of properties and cure cycles. Several poten...展開 RF 5407 is an easy-to-use, aluminum oxide, liquid epoxy resin with excellent electrical insulation properties and high thermal conductivity. RF 5407 can be cured with nearly any hardener to produce a wide range of properties and cure cycles. Several potential curing agents are listed below. Regardless of which curing agent is selected, the resultant plastic will have low shrinkage during cure, excellent thermal stability and conductivity, and be a strong and durable casting. 收起
RF 6002 Resin Formulators (E.V. Roberts) RF 6002 is a modified Novolac epoxy resin. It offers improved Tg and chemical resistance versus standard bisphenol A epoxies. RF 6002 has a medium-low viscosity and is suitable for laminating, RTM and filament winding applications. The handling and final ...展開 RF 6002 is a modified Novolac epoxy resin. It offers improved Tg and chemical resistance versus standard bisphenol A epoxies. RF 6002 has a medium-low viscosity and is suitable for laminating, RTM and filament winding applications. The handling and final cure properties can be adjusted by the choice of curing agent. 收起
RF 61 Resin Formulators (E.V. Roberts) RF 61 is a polyamide curing agent for use with various epoxy resins. This specific curing agent is designed to add toughness and flexibility to cured epoxy resins. It has very good adhesive strength characteristics and will bond with most substrates. Diff...展開 RF 61 is a polyamide curing agent for use with various epoxy resins. This specific curing agent is designed to add toughness and flexibility to cured epoxy resins. It has very good adhesive strength characteristics and will bond with most substrates. Different mix ratios will impart varying degrees of increasing flexibility to the cured systems. A mix with RF 61 will have at least a one hour pot life under normal conditions. Cure will take place at room temperature or, in small castings or adhesives, can be accelerated with heat. 收起
RF 6100 A/B Kit Resin Formulators (E.V. Roberts) RF 6100 A/B Kit is a medium viscosity, high temperature epoxy adhesive system for bonding metal and composite structures. RF 6100 has an open pot life of four hours and cures in one hour at 200°F.
RF 62 Resin Formulators (E.V. Roberts) RF 62 is a standard, high viscosity, polyamide resin for ambient curing of epoxy resins. It is intended as an equivalent “drop-in” for Versamid 115 and can be used without formulation changes. When mixed at stoichiometric ratio it cures to a tough, durabl...展開 RF 62 is a standard, high viscosity, polyamide resin for ambient curing of epoxy resins. It is intended as an equivalent “drop-in” for Versamid 115 and can be used without formulation changes. When mixed at stoichiometric ratio it cures to a tough, durable, moisture and chemical resistant plastic. RF 62 complies with FDA 21 CFR 175.300 and 21 CFR 175.105. 收起
RF 67 Resin Formulators (E.V. Roberts) RF 67 curing agent is a polyfunctional, fatty amidoamine for use in curing liquid epoxy resins. It is intended as an equivalent “drop-in” for Genamid 2000 and can be used without formulation changes. Special features of this room temperature curing agent ...展開 RF 67 curing agent is a polyfunctional, fatty amidoamine for use in curing liquid epoxy resins. It is intended as an equivalent “drop-in” for Genamid 2000 and can be used without formulation changes. Special features of this room temperature curing agent include relatively rapid cure rate, and the ability to cure in the presence of moisture. The mix ratio can be varied over a wide range to generate cured products that range from hard and rigid to soft and flexible. Appropriate applications include marine coatings, high-solids and solvent-free coatings, flooring, adhesives and laminates. It is approved for use in U.S. Navy Specification MILP-24441/Ships Coatings. 收起
RF 68 Resin Formulators (E.V. Roberts) RF 68 is a standard, low viscosity, fatty acid amidoamine resin for ambient curing of epoxy resins. It is intended as an equivalent “drop-in” for Genamid 250 and can be used without formulation changes. When mixed at stoichiometric ratio it cures to a har...展開 RF 68 is a standard, low viscosity, fatty acid amidoamine resin for ambient curing of epoxy resins. It is intended as an equivalent “drop-in” for Genamid 250 and can be used without formulation changes. When mixed at stoichiometric ratio it cures to a hard, durable, moisture and chemical resistant plastic. RF 68 is ideally suited for high solids formulations with low viscosity resins. It can be used in compliance with 21 CFR 175.300 and 21 CFR 176.170 as a component of FDA-compliant epoxy coatings, can cements and adhesives. 收起
RF 713 A/B Kit Resin Formulators (E.V. Roberts) RF 713 A/B Kit is a thixotropic epoxy adhesive system with good physical strength and high electrical conductivity. This material is designed to be used where hot solder applications are impractical or on parts which cannot be subjected to heat. RF 713 is...展開 RF 713 A/B Kit is a thixotropic epoxy adhesive system with good physical strength and high electrical conductivity. This material is designed to be used where hot solder applications are impractical or on parts which cannot be subjected to heat. RF 713 is also effective as a shielding material. 收起
RF 77 Resin Formulators (E.V. Roberts) RF 77 is a low-viscosity amine curing agent for use with liquid epoxy resins that provides rapid cure at ambient and temperatures as low as 32°F (0°C). It can also be used to accelerate other amine hardeners.
RF 81 Resin Formulators (E.V. Roberts) RF 81 is a unique low viscosity polyamide hardener. It is compatible with most epoxy resins without induction and offers a shorter gel time than standard polyamide hardeners.
RF 825 A/B Resin Formulators (E.V. Roberts) RF 825 A/B is a two component Epoxy compound used for potting electronic packages, generally with vacuum impregnation techniques. It is a high temperature resistant, low out gassing material which has been used in high voltage devices in space.
RF 9 Resin Formulators (E.V. Roberts) RF 9 is an accelerated polyamide hardener. It offers better chemical resistance and a higher service temperature than standard polyamides.
RF 912 A/B Kit Resin Formulators (E.V. Roberts) RF 912 A/B Kit is a high strength epoxy adhesive system for bonding a wide variety of substrates, including plastics. This product is thixotropic and can be used on vertical surfaces without excessive run out from the bond line. RF 912 has an open working...展開 RF 912 A/B Kit is a high strength epoxy adhesive system for bonding a wide variety of substrates, including plastics. This product is thixotropic and can be used on vertical surfaces without excessive run out from the bond line. RF 912 has an open working time of 30 to 45 minutes and will cure at room temperature. 收起
RF 913 A/B Resin Formulators (E.V. Roberts) RF 913 A/B is a toughened epoxy adhesive system for bonding a wide variety of substrates. This product is semi-thixotropic, and so can be used on vertical surfaces without excessive bleed from the bond line. RF 913 A/B has excellent adhesion to metal and ...展開 RF 913 A/B is a toughened epoxy adhesive system for bonding a wide variety of substrates. This product is semi-thixotropic, and so can be used on vertical surfaces without excessive bleed from the bond line. RF 913 A/B has excellent adhesion to metal and plastic substrates as well as excellent water soak and environmental resistance. RF 913 is available in green (blue/yellow) and black. An electrical grade is also available. 收起
RF 955 A/B Resin Formulators (E.V. Roberts) RF 955 A/B is an easy to mix, stiff paste, two-part, high strength, epoxy fairing compound. It is designed to hold up to a 1 inch peak before cure and is easily smoothed to a paintable surface. This high strength material bonds well to a wide variety of s...展開 RF 955 A/B is an easy to mix, stiff paste, two-part, high strength, epoxy fairing compound. It is designed to hold up to a 1 inch peak before cure and is easily smoothed to a paintable surface. This high strength material bonds well to a wide variety of substrates, including most metals and most rigid plastics. 收起
RF 96 Resin Formulators (E.V. Roberts) RF 96 curing agent is a modified cycloaliphatic amine designed for use with liquid epoxy resins. It also can be used to cure solid resins in solvent-based systems. RF 96 curing agent allows for cures at high humidity, low temperatures to 40 °F and underwa...展開 RF 96 curing agent is a modified cycloaliphatic amine designed for use with liquid epoxy resins. It also can be used to cure solid resins in solvent-based systems. RF 96 curing agent allows for cures at high humidity, low temperatures to 40 °F and underwater. 收起
RX 5004 A/B Kit Resin Formulators (E.V. Roberts) RX 5004 A/B Kit is a fast setting, non-slump, general purpose epoxy adhesive system for bonding a wide variety of substrates. RX 5004 sets in as little as 10 minutes with full cure in 24 hours at room temperature.