| Kingmide 310 | Sanho Chemical Co., Ltd. | Kingmide 310 is a high molecular weight, high viscosity, reactive polyamide resin in a brown-colored, viscous liquid form. This product has a viscosity of 30,000-50,000 mPa.s and a specific gravity of 0.97. Kingmide 310 is most commonly used in adhesive a...view more Kingmide 310 is a high molecular weight, high viscosity, reactive polyamide resin in a brown-colored, viscous liquid form. This product has a viscosity of 30,000-50,000 mPa.s and a specific gravity of 0.97. Kingmide 310 is most commonly used in adhesive and coating formulation applications. view less | |
| Kingmide 374-L | Sanho Chemical Co., Ltd. | Kingmide 374-L is a low-viscosity, reactive polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 200-400 mPa.s and a specific gravity of 0.95. Kingmide 374-L is most commonly used in mortar, adhesive, and putty formulati...view more Kingmide 374-L is a low-viscosity, reactive polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 200-400 mPa.s and a specific gravity of 0.95. Kingmide 374-L is most commonly used in mortar, adhesive, and putty formulation applications. view less | |
| Kingmide X-220B | Sanho Chemical Co., Ltd. | Kingmide X-220B is a low viscosity, modified reactive polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 450-650 mPa.s. Kingmide X-220B is most commonly used in adhesive, coating, and patch repair mortar formulation ap...view more Kingmide X-220B is a low viscosity, modified reactive polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 450-650 mPa.s. Kingmide X-220B is most commonly used in adhesive, coating, and patch repair mortar formulation applications. view less | |
| Kingcure 2040-MS | Sanho Chemical Co., Ltd. | Kingcure 2040-MS is a mannish-type epoxy resin hardener in a light honey-colored liquid form. This product has a viscosity of 2000-6000 mPa.s and a specific gravity of 1.08. Kingcure 2040-MS is most commonly used in fast-setting adhesive formulation appli...view more Kingcure 2040-MS is a mannish-type epoxy resin hardener in a light honey-colored liquid form. This product has a viscosity of 2000-6000 mPa.s and a specific gravity of 1.08. Kingcure 2040-MS is most commonly used in fast-setting adhesive formulation applications. view less | |
| Kingcure K-863A | Sanho Chemical Co., Ltd. | Kingcure K-863A is a mannish-type epoxy resin hardener in a light honey-colored liquid form. This product has a viscosity of 1000-2000 mPa.s and a specific gravity of 1.06. Kingcure K-863A is most commonly used in fast-setting adhesive formulation applica...view more Kingcure K-863A is a mannish-type epoxy resin hardener in a light honey-colored liquid form. This product has a viscosity of 1000-2000 mPa.s and a specific gravity of 1.06. Kingcure K-863A is most commonly used in fast-setting adhesive formulation applications. view less | |
| Kingcure 613-B | Sanho Chemical Co., Ltd. | Kingcure 613-B is a rapid room temperature modified polyamine curing agent in a light yellow-colored liquid form. This product has a viscosity of 30-100 mPa.s. Kingcure 613-B is most commonly used in solvent-free coating and adhesive formulation applicati...view more Kingcure 613-B is a rapid room temperature modified polyamine curing agent in a light yellow-colored liquid form. This product has a viscosity of 30-100 mPa.s. Kingcure 613-B is most commonly used in solvent-free coating and adhesive formulation applications. view less | |
| COPONYL™ 5560 | Nippon Gohsei | COPONYL™ 5560 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and isopropyl alcohol solvents. It is a one-component cross-linkage product. Applications include films and labels. This product is well ...view more COPONYL™ 5560 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and isopropyl alcohol solvents. It is a one-component cross-linkage product. Applications include films and labels. This product is well suited for use in adhesives. view less | |
| COPONYL™ N-7483 | Nippon Gohsei | COPONYL™ N-7483 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It provides good removability. Applications include double-sided tapes and foam tapes. This product is well suited for use in electronic...view more COPONYL™ N-7483 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It provides good removability. Applications include double-sided tapes and foam tapes. This product is well suited for use in electronics and adhesives. view less | |
| COPONYL™ N-7245 | Nippon Gohsei | COPONYL™ N-7245 is a pressure-sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and methyl ethyl ketone solvents. This product is well suited for use in electronic and adhesive applications, especially thick-layer o...view more COPONYL™ N-7245 is a pressure-sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and methyl ethyl ketone solvents. This product is well suited for use in electronic and adhesive applications, especially thick-layer optical films. view less | |
| SUPRASEC® 2015 | Huntsman Polyurethanes EMEAI | SUPRASEC 2015 - reactivity and viscosity modified MDI raw material / isocyanate from Huntsman Polyurethanes with high functionality including improved compatibility and enhanced adhesion for the formulation of modified MDI, MDI prepolymer, reactivity modi...view more SUPRASEC 2015 - reactivity and viscosity modified MDI raw material / isocyanate from Huntsman Polyurethanes with high functionality including improved compatibility and enhanced adhesion for the formulation of modified MDI, MDI prepolymer, reactivity modified high functionality mdi, and viscosity modified high functional MDI. view less | |
| Desmodur® BL 5375 | Covestro | Desmodur® BL 5375 is a blocked aliphatic polyisocyanate based on H 12 MDI. Ideal for use in combination with hydroxyl-bearing polyols, especially Desmophen grades, to formulate lightfast one-component polyurethane stoving coatings; as an additive in conve...view more Desmodur® BL 5375 is a blocked aliphatic polyisocyanate based on H 12 MDI. Ideal for use in combination with hydroxyl-bearing polyols, especially Desmophen grades, to formulate lightfast one-component polyurethane stoving coatings; as an additive in conventional stoving systems to improve adhesion and flexibility. view less | |
| DESMOPHEN® VP LS 2388 | Covestro | A flexibilising hydroxyl-bearing polyester used as a co-reactant, primarily with Desmodur N, in the formulation of two-component polyurethane coatings for plastics, characterised by their resistance to accelerated and outdoor weathering, high film elastic...view more A flexibilising hydroxyl-bearing polyester used as a co-reactant, primarily with Desmodur N, in the formulation of two-component polyurethane coatings for plastics, characterised by their resistance to accelerated and outdoor weathering, high film elasticity and good tar resistance; also in the flexibilisation of hard coatings, e.g. in industrial applications. view less | |
| KISAMID® 1105 | Paksoy Kimyevi Maddeler San. ve Tic. A.S. | KISAMID® 1105 is a formulated polyamine hardener. This hardener has an amine value of 430 to 470 mg KOH/g. It is applicable on wet surfaces and is used in fast curing solvent free coatings and self-leveling epoxy mortars requiring chemical resistance and ...view more KISAMID® 1105 is a formulated polyamine hardener. This hardener has an amine value of 430 to 470 mg KOH/g. It is applicable on wet surfaces and is used in fast curing solvent free coatings and self-leveling epoxy mortars requiring chemical resistance and good surface properties. view less | |
| KISAMID® 1107 | Paksoy Kimyevi Maddeler San. ve Tic. A.S. | KISAMID® 1107 is a formulated polyamine hardener. This hardener has an amine value of 410 to 450 mg KOH/g. It is applicable on wet surfaces and is used in fast curing, solvent free coatings and self-leveling epoxy mortars requiring chemical resistance and...view more KISAMID® 1107 is a formulated polyamine hardener. This hardener has an amine value of 410 to 450 mg KOH/g. It is applicable on wet surfaces and is used in fast curing, solvent free coatings and self-leveling epoxy mortars requiring chemical resistance and good surface properties. view less | |
| KISAMID® 1108 | Paksoy Kimyevi Maddeler San. ve Tic. A.S. | KISAMID® 1108 is a formulated polyamine hardener. This hardener has an amine value of 400 to 450 mg KOH/g. It is applicable on wet surfaces and is used in fast curing, solvent free coatings and self-leveling epoxy mortars requiring chemical resistance and...view more KISAMID® 1108 is a formulated polyamine hardener. This hardener has an amine value of 400 to 450 mg KOH/g. It is applicable on wet surfaces and is used in fast curing, solvent free coatings and self-leveling epoxy mortars requiring chemical resistance and good surface properties. view less | |
| Docure KH-814 | Kukdo Chemical Co., Ltd. | Docure KH-814 is a cycloaliphatic amine modified curing agent for use with epoxy resins. KH-814 has low viscosity and solvent free. It can be used for mortar, floor repair and commercial and industrial floorings. It is well suited for the use in formulati...view more Docure KH-814 is a cycloaliphatic amine modified curing agent for use with epoxy resins. KH-814 has low viscosity and solvent free. It can be used for mortar, floor repair and commercial and industrial floorings. It is well suited for the use in formulating products such as solvent free coatings. view less | |
| Fujicure 5300 | Sanho Chemical Co., Ltd. | Fujicure 5300 is a modified cycloaliphatic polyamine epoxy curing agent in a light yellow-colored viscous liquid form. This product has a viscosity of 800-1700 mPa.s and a specific gravity of 1.02. Fujicure 5300 is most commonly used in adhesive and self-...view more Fujicure 5300 is a modified cycloaliphatic polyamine epoxy curing agent in a light yellow-colored viscous liquid form. This product has a viscosity of 800-1700 mPa.s and a specific gravity of 1.02. Fujicure 5300 is most commonly used in adhesive and self-leveling coating formulation applications. view less | |
| Fujicure FX-220 | Sanho Chemical Co., Ltd. | Fujicure FX-220 is a modified cycloaliphatic polyamine epoxy curing agent in a light yellow-colored viscous liquid form. This product has a viscosity of 200-500 mPa.s and a specific gravity of 1.07. Fujicure FX-220 is most commonly used in coating and adh...view more Fujicure FX-220 is a modified cycloaliphatic polyamine epoxy curing agent in a light yellow-colored viscous liquid form. This product has a viscosity of 200-500 mPa.s and a specific gravity of 1.07. Fujicure FX-220 is most commonly used in coating and adhesive formulation applications. view less | |
| Fujicure FXD-821 | Sanho Chemical Co., Ltd. | Fujicure FXD-821 is a modified aliphatic amine hardener in a light yellow-colored liquid form. This product has a viscosity of 40-70 mPa.s and a specific gravity of 0.95. Fujicure FXD-821 is most commonly used in surface coating, resin mortar, and adhesiv...view more Fujicure FXD-821 is a modified aliphatic amine hardener in a light yellow-colored liquid form. This product has a viscosity of 40-70 mPa.s and a specific gravity of 0.95. Fujicure FXD-821 is most commonly used in surface coating, resin mortar, and adhesive formulation applications. view less | |
| Epotec® YD 522 | Aditya Birla | Epotec® YD 522 is a low viscosity bisphenol-A liquid epoxy resin, modified with a reactive diluent. The lower viscosity of this product allows for increased filler loading of a formulation. This product is ideal for use in self-leveling flooring applicati...view more Epotec® YD 522 is a low viscosity bisphenol-A liquid epoxy resin, modified with a reactive diluent. The lower viscosity of this product allows for increased filler loading of a formulation. This product is ideal for use in self-leveling flooring applications, high solids & solvent-free coatings, and adhesives. view less | |
| SP1-204 | NuSil Silicone Technology 1 | SP1-204 is a specially formulated translucent primer that is designed for use with one and two-part RTV systemts. This primer requires no mixing and air dries. It is an ideal product to help improve the adhesion of one and two-part systems to various subs...view more SP1-204 is a specially formulated translucent primer that is designed for use with one and two-part RTV systemts. This primer requires no mixing and air dries. It is an ideal product to help improve the adhesion of one and two-part systems to various substrates such as glass, metals, plastics, ceramics and wood. view less | |
| Kingmide H-110 | Sanho Chemical Co., Ltd. | Kingmide H-110 is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 500-1000 mPa.s and a softening point of 105-115°C. Kingmide H-110 is most commonly used in hot-melt adhesive formulation application...view more Kingmide H-110 is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 500-1000 mPa.s and a softening point of 105-115°C. Kingmide H-110 is most commonly used in hot-melt adhesive formulation applications. view less | |
| Kingmide H-120 | Sanho Chemical Co., Ltd. | Kingmide H-120 is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 2200-2800 mPa.s and a softening point of 115-125°C. Kingmide H-120 is most commonly used in hot-melt adhesive formulation applicatio...view more Kingmide H-120 is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 2200-2800 mPa.s and a softening point of 115-125°C. Kingmide H-120 is most commonly used in hot-melt adhesive formulation applications. view less | |
| Kingmide H-130 | Sanho Chemical Co., Ltd. | Kingmide H-130 is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 2000-4000 mPa.s and a softening point of 125-135°C. Kingmide H-130 is most commonly used in hot-melt adhesive formulation applicatio...view more Kingmide H-130 is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 2000-4000 mPa.s and a softening point of 125-135°C. Kingmide H-130 is most commonly used in hot-melt adhesive formulation applications. view less | |
| Kingmide H-130W | Sanho Chemical Co., Ltd. | Kingmide H-130W is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 2500-5000 mPa.s and a softening point of 125-135°C. Kingmide H-130W is most commonly used in hot-melt adhesive formulation applicat...view more Kingmide H-130W is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 2500-5000 mPa.s and a softening point of 125-135°C. Kingmide H-130W is most commonly used in hot-melt adhesive formulation applications. view less | |
| Kingmide H-140HP | Sanho Chemical Co., Ltd. | Kingmide H-140HP is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 5000-10,000 mPa.s and a softening point of 140-150°C. Kingmide H-140HP is most commonly used in hot-melt adhesive formulation appl...view more Kingmide H-140HP is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 5000-10,000 mPa.s and a softening point of 140-150°C. Kingmide H-140HP is most commonly used in hot-melt adhesive formulation applications. view less | |
| Kingmide H-170HV | Sanho Chemical Co., Ltd. | Kingmide H-170HV is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 3000-7000 mPa.s and a softening point of 165-175°C. Kingmide H-170HV is most commonly used in hot-melt adhesive formulation applic...view more Kingmide H-170HV is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 3000-7000 mPa.s and a softening point of 165-175°C. Kingmide H-170HV is most commonly used in hot-melt adhesive formulation applications. view less | |
| Tohmide TXC-241B | Sanho Chemical Co., Ltd. | Tohmide TXC-241B is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 11,000-20,000 mPa.s and a softening point of 95-105°C. Tohmide TXC-241B is most commonly used in hot-melt adhesive formulation appl...view more Tohmide TXC-241B is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 11,000-20,000 mPa.s and a softening point of 95-105°C. Tohmide TXC-241B is most commonly used in hot-melt adhesive formulation applications. view less | |
| Tohmide TXC-241F | Sanho Chemical Co., Ltd. | Tohmide TXC-241F is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 11,000-20,000 mPa.s and a softening point of 105-110°C. Tohmide TXC-241F is most commonly used in hot-melt adhesive formulation app...view more Tohmide TXC-241F is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 11,000-20,000 mPa.s and a softening point of 105-110°C. Tohmide TXC-241F is most commonly used in hot-melt adhesive formulation applications. view less | |
| Tohmide TXC-241H | Sanho Chemical Co., Ltd. | Tohmide TXC-241H is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 15,000-25,000 mPa.s and a softening point of 100-110°C. Tohmide TXC-241H is most commonly used in hot-melt adhesive formulation app...view more Tohmide TXC-241H is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 15,000-25,000 mPa.s and a softening point of 100-110°C. Tohmide TXC-241H is most commonly used in hot-melt adhesive formulation applications. view less | |
| Tohmide TXC-243A | Sanho Chemical Co., Ltd. | Tohmide TXC-243A is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 5000-10,000 mPa.s and a softening point of 100-110°C. Tohmide TXC-243A is most commonly used in hot-melt adhesive formulation appli...view more Tohmide TXC-243A is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 5000-10,000 mPa.s and a softening point of 100-110°C. Tohmide TXC-243A is most commonly used in hot-melt adhesive formulation applications. view less | |
| Tohmide TXA-265 | Sanho Chemical Co., Ltd. | Tohmide TXA-265 is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 2000-4000 mPa.s and a softening point of 140-150°C. Tohmide TXA-265 is most commonly used in hot-melt adhesive formulation applicati...view more Tohmide TXA-265 is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 2000-4000 mPa.s and a softening point of 140-150°C. Tohmide TXA-265 is most commonly used in hot-melt adhesive formulation applications. view less | |
| Tohmide TXC-269 | Sanho Chemical Co., Ltd. | Tohmide TXC-269 is a polyamide resin in a brown-colored pellet form. This product has a viscosity of 3000-4000 mPa.s and a softening point of 170-180°C. Tohmide TXC-269 is most commonly used in hot-melt low-pressure molding adhesive formulation applicatio...view more Tohmide TXC-269 is a polyamide resin in a brown-colored pellet form. This product has a viscosity of 3000-4000 mPa.s and a softening point of 170-180°C. Tohmide TXC-269 is most commonly used in hot-melt low-pressure molding adhesive formulation applications. view less | |
| Tohmide TXC-271 | Sanho Chemical Co., Ltd. | Tohmide TXC-271 is a polyamide resin in a brown-colored pellet form. This product has a viscosity of 500-1200 mPa.s and a softening point of 141-153°C. Tohmide TXC-271 is most commonly used in hot-melt low-pressure molding adhesive formulation application...view more Tohmide TXC-271 is a polyamide resin in a brown-colored pellet form. This product has a viscosity of 500-1200 mPa.s and a softening point of 141-153°C. Tohmide TXC-271 is most commonly used in hot-melt low-pressure molding adhesive formulation applications. view less | |
| Tohmide TXA-254B | Sanho Chemical Co., Ltd. | Tohmide TXA-254B is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 3500-5500 mPa.s and a softening point of 150-160°C. Tohmide TXA-254B is most commonly used in hot-melt adhesive formulation applica...view more Tohmide TXA-254B is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 3500-5500 mPa.s and a softening point of 150-160°C. Tohmide TXA-254B is most commonly used in hot-melt adhesive formulation applications. view less | |
| Tohmide TXC-244C | Sanho Chemical Co., Ltd. | Tohmide TXC-244C is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 2000-5000 mPa.s and a softening point of 155-165°C. Tohmide TXC-244C is most commonly used in hot-melt adhesive formulation applica...view more Tohmide TXC-244C is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 2000-5000 mPa.s and a softening point of 155-165°C. Tohmide TXC-244C is most commonly used in hot-melt adhesive formulation applications. view less | |
| Kingmide 74-KB | Sanho Chemical Co., Ltd. | Kingmide 74-KB is a low-viscosity, reactive polyamide resin curing agent in a brown-colored, viscous liquid form. This product has a viscosity of 500-1000 mPa.s and a specific gravity of 0.96. Kingmide 74-KB is most commonly used in putty and adhesive for...view more Kingmide 74-KB is a low-viscosity, reactive polyamide resin curing agent in a brown-colored, viscous liquid form. This product has a viscosity of 500-1000 mPa.s and a specific gravity of 0.96. Kingmide 74-KB is most commonly used in putty and adhesive formulation applications. view less | |
| Kingmide 74-NP | Sanho Chemical Co., Ltd. | Kingmide 74-NP is a low-viscosity, reactive polyamide resin curing agent in a brown-colored, viscous liquid form. This product has a viscosity of 200-400 mPa.s and a specific gravity of 0.96. Kingmide 74-NP is most commonly used in putty and adhesive form...view more Kingmide 74-NP is a low-viscosity, reactive polyamide resin curing agent in a brown-colored, viscous liquid form. This product has a viscosity of 200-400 mPa.s and a specific gravity of 0.96. Kingmide 74-NP is most commonly used in putty and adhesive formulation applications. view less | |
| Kingmide 315-L | Sanho Chemical Co., Ltd. | Kingmide 315-L is a polyaminoamide-type curing agent in a brown-colored viscous liquid form. This product has a viscosity of 1500-3000 mPa.s and a specific gravity of 0.97. Kingmide 315-L is most commonly used in adhesive, sealant, surface coating, and pu...view more Kingmide 315-L is a polyaminoamide-type curing agent in a brown-colored viscous liquid form. This product has a viscosity of 1500-3000 mPa.s and a specific gravity of 0.97. Kingmide 315-L is most commonly used in adhesive, sealant, surface coating, and putty formulation applications. view less | |
| Kingmide X-2100 | Sanho Chemical Co., Ltd. | Kingmide X-2100 is a medium viscosity, modified reactive polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 6000-12,000 mPa.s and a specific gravity of 1.04. Kingmide X-2100 is most commonly used in adhesive, coating, ...view more Kingmide X-2100 is a medium viscosity, modified reactive polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 6000-12,000 mPa.s and a specific gravity of 1.04. Kingmide X-2100 is most commonly used in adhesive, coating, and putty formulation applications. view less | |
| Tohmide 225-R | Sanho Chemical Co., Ltd. | Tohmide 225-R is a medium viscosity, reactive polyaminoamide in a brown-colored viscous liquid form. This product has a viscosity of 3500-10,000 mPa.s and a specific gravity of 0.97. Tohmide 225-R is most commonly used in adhesive, sealant, putty, and sur...view more Tohmide 225-R is a medium viscosity, reactive polyaminoamide in a brown-colored viscous liquid form. This product has a viscosity of 3500-10,000 mPa.s and a specific gravity of 0.97. Tohmide 225-R is most commonly used in adhesive, sealant, putty, and surface coating formulation applications. view less | |
| Tohmide 225-X | Sanho Chemical Co., Ltd. | Tohmide 225-X is a polyaminoamide-type epoxy curing agent in a brown-colored viscous liquid form. This product has a viscosity of 8000-12,000 mPa.s and a specific gravity of 0.97. Tohmide 225-X is most commonly used in adhesive, sealant, and surface coati...view more Tohmide 225-X is a polyaminoamide-type epoxy curing agent in a brown-colored viscous liquid form. This product has a viscosity of 8000-12,000 mPa.s and a specific gravity of 0.97. Tohmide 225-X is most commonly used in adhesive, sealant, and surface coating formulation applications. view less | |
| Tohmide 245-LP | Sanho Chemical Co., Ltd. | Tohmide 245-LP is a low viscosity, polyaminoamide epoxy curing agent in a brown-colored liquid form. This product has a viscosity of 200-500 mPa.s and a specific gravity of 0.90. Tohmide 245-LP is most commonly used in structural adhesive and protective c...view more Tohmide 245-LP is a low viscosity, polyaminoamide epoxy curing agent in a brown-colored liquid form. This product has a viscosity of 200-500 mPa.s and a specific gravity of 0.90. Tohmide 245-LP is most commonly used in structural adhesive and protective coating formulation applications. view less | |
| Tohmide 280-B | Sanho Chemical Co., Ltd. | Tohmide 280-B is a low viscosity, fast setting, reactive polyamide hardener in a brown-colored viscous liquid form. This product has a viscosity of 500-1000 mPa.s and a specific gravity of 0.96. Tohmide 280-B is most commonly used in sealant and adhesive ...view more Tohmide 280-B is a low viscosity, fast setting, reactive polyamide hardener in a brown-colored viscous liquid form. This product has a viscosity of 500-1000 mPa.s and a specific gravity of 0.96. Tohmide 280-B is most commonly used in sealant and adhesive formulation applications. view less | |
| Kingcure 515-KD | Sanho Chemical Co., Ltd. | Kingcure 515-KD is a modified cycloaliphatic polyamine adduct curing agent in an amber-colored liquid form. This product has a viscosity of 300-700 mPa.s and a specific gravity of 1.01. Kingcure 515-KD is most commonly used in solvent-free coating and adh...view more Kingcure 515-KD is a modified cycloaliphatic polyamine adduct curing agent in an amber-colored liquid form. This product has a viscosity of 300-700 mPa.s and a specific gravity of 1.01. Kingcure 515-KD is most commonly used in solvent-free coating and adhesive formulation applications. view less | |
| COPONYL™ N-7486 | Nippon Gohsei | COPONYL™ N-7486 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and acetone solvents. It provides general type adhesive properties and punching processability. Applications include films and labels. This produ...view more COPONYL™ N-7486 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and acetone solvents. It provides general type adhesive properties and punching processability. Applications include films and labels. This product is well suited for use in adhesives. view less | |
| COPONYL™ N-7520 | Nippon Gohsei | COPONYL™ N-7520 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It provides good corrosion resistance, good whitening resistance, and is ideal for thin layer application. This product is well suited f...view more COPONYL™ N-7520 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It provides good corrosion resistance, good whitening resistance, and is ideal for thin layer application. This product is well suited for use in electronics and adhesives. view less | |
| COPONYL™ N-6941 | Nippon Gohsei | COPONYL™ N-6941 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It provides good bubble resistance, has good durability, and is ideal for thin layer application. This product is well suited for use in...view more COPONYL™ N-6941 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It provides good bubble resistance, has good durability, and is ideal for thin layer application. This product is well suited for use in electronics and adhesives. view less | |
| Desmodur® BL 3370 MPA | Covestro | Desmodur® BL 3370 MPA is a blocked aliphatic polyisocyanate based on HDI. Is ideal for use in combination with Desmophen grades to formulate lightfast, one-component stoving polyurethane coatings with high resistance to thermal yellowing; as an additive i...view more Desmodur® BL 3370 MPA is a blocked aliphatic polyisocyanate based on HDI. Is ideal for use in combination with Desmophen grades to formulate lightfast, one-component stoving polyurethane coatings with high resistance to thermal yellowing; as an additive in conventional stoving coating systems to improve the reactivity, flexibility and adhesion. view less | |
| Desmodur® BL 3475 BA/SN | Covestro | Desmodur® BL 3475 BA/SN is an aliphatic crosslinking stoving urethane resin based on HDI / IPDI. Ideal for use in combination with Desmophen grades to formulate lightfast, one-component stoving polyurethane coatings; as an additive in conventional stoving...view more Desmodur® BL 3475 BA/SN is an aliphatic crosslinking stoving urethane resin based on HDI / IPDI. Ideal for use in combination with Desmophen grades to formulate lightfast, one-component stoving polyurethane coatings; as an additive in conventional stoving coating systems to improve the reactivity, flexibility and adhesion. view less | |
| Fujicure 5000 | Sanho Chemical Co., Ltd. | Fujicure 5000 is a low viscosity, modified cycloaliphatic polyamine curing agent in a light yellow-colored viscous liquid form. This product has a viscosity of 800-2500 mPa.s and a specific gravity of 1.02. Fujicure 5000 is most commonly used in adhesive ...view more Fujicure 5000 is a low viscosity, modified cycloaliphatic polyamine curing agent in a light yellow-colored viscous liquid form. This product has a viscosity of 800-2500 mPa.s and a specific gravity of 1.02. Fujicure 5000 is most commonly used in adhesive and solvent-based coating formulation applications. view less | |
| Fujicure FXD-822 | Sanho Chemical Co., Ltd. | Fujicure FXD-822 is a modified cycloaliphatic amine epoxy curing agent in a light honey-colored liquid form. This product has a viscosity of 300-700 mPa.s and a specific gravity of 1.03. Fujicure FXD-822 is most commonly used in solvent-free coating and m...view more Fujicure FXD-822 is a modified cycloaliphatic amine epoxy curing agent in a light honey-colored liquid form. This product has a viscosity of 300-700 mPa.s and a specific gravity of 1.03. Fujicure FXD-822 is most commonly used in solvent-free coating and mortar formulation applications. view less | |
| 2-Methyl-1,3-Propanediol | DCC (Dairen Chemical Corp.) | 2-Methyl-1,3-Propanediol is a by-product, which is produced by hydro-formulation and hydro-generation of Allyl Alcohol, carbon monoxide, and hydrogen. It is a colorless, low viscosity and toxic liquid with a unique molecular structure. 2-Methyl-1,3-Propan...view more 2-Methyl-1,3-Propanediol is a by-product, which is produced by hydro-formulation and hydro-generation of Allyl Alcohol, carbon monoxide, and hydrogen. It is a colorless, low viscosity and toxic liquid with a unique molecular structure. 2-Methyl-1,3-Propanediol is used as a raw material in monomers for the preparation of coatings and binders. view less | |
| UV Cure 60-7114 | Epoxies, Etc. | UV Cure 60-7114 is a low viscosity urethane adhesive, potting compound, and coating with very good adhesion to metal and plastic substrates. This UV curable resin is formulated to provide excellent water and chemical resistance, making it a good choice fo...view more UV Cure 60-7114 is a low viscosity urethane adhesive, potting compound, and coating with very good adhesion to metal and plastic substrates. This UV curable resin is formulated to provide excellent water and chemical resistance, making it a good choice for potting electronic assemblies exposed to excessive moisture. view less | |
| Organosilane S1 | Dalian Onichem Co., Ltd. | Organosilane S1 is a thiocarboxylate functional silane. It is designed to reduce the number of non-productive mixing steps, while improving processing and performance of the tread compound. It requires only a single non-productive mixing step. With this s...view more Organosilane S1 is a thiocarboxylate functional silane. It is designed to reduce the number of non-productive mixing steps, while improving processing and performance of the tread compound. It requires only a single non-productive mixing step. With this silane, mixing temperature as high as 180°C can be employed, dependent on the formulation. view less | Request Sample |
| Tohmide 558-N | Sanho Chemical Co., Ltd. | Tohmide 558-N is a solid-type fatty polyamide resin in a brown-colored pellet form. This product has a viscosity of 300-800 mPa.s and a softening point of 155-165°C. Tohmide 558-N is most commonly used in structural hot-melt adhesive formulation applicati...view more Tohmide 558-N is a solid-type fatty polyamide resin in a brown-colored pellet form. This product has a viscosity of 300-800 mPa.s and a softening point of 155-165°C. Tohmide 558-N is most commonly used in structural hot-melt adhesive formulation applications. view less | |
| Tohmide 235-S | Sanho Chemical Co., Ltd. | Tohmide 235-S is a medium viscosity, polyaminoamide-type epoxy curing agent in a brown-colored viscous liquid form. This product has a viscosity of 4500-9000 mPa.s and a specific gravity of 0.97. Tohmide 235-S is most commonly used in structural adhesive ...view more Tohmide 235-S is a medium viscosity, polyaminoamide-type epoxy curing agent in a brown-colored viscous liquid form. This product has a viscosity of 4500-9000 mPa.s and a specific gravity of 0.97. Tohmide 235-S is most commonly used in structural adhesive and grout formulation applications. view less | |
| Kingcure 925 | Sanho Chemical Co., Ltd. | Kingcure 925 is a low viscosity, modified aliphatic polyamine epoxy curing agent in a light-colored liquid form. This product has a viscosity of less than 80 mPa.s and a specific gravity of 0.95. Kingcure 925 is most commonly used in laminate, mortar, adh...view more Kingcure 925 is a low viscosity, modified aliphatic polyamine epoxy curing agent in a light-colored liquid form. This product has a viscosity of less than 80 mPa.s and a specific gravity of 0.95. Kingcure 925 is most commonly used in laminate, mortar, adhesive, and coating formulation applications. view less | |
| Kingcure I-934 | Sanho Chemical Co., Ltd. | Kingcure I-934 is a modified aliphatic amine hardener in a light yellow-colored liquid form. This product has a viscosity of 80-200 mPa.s and a specific gravity of 1.02. Kingcure I-934 is most commonly used in surface coating, laminate, resin mortar, and ...view more Kingcure I-934 is a modified aliphatic amine hardener in a light yellow-colored liquid form. This product has a viscosity of 80-200 mPa.s and a specific gravity of 1.02. Kingcure I-934 is most commonly used in surface coating, laminate, resin mortar, and adhesive formulation applications. view less | |
| Kingcure N-768 | Sanho Chemical Co., Ltd. | Kingcure N-768 is a rapid room temperature epoxy resin curing agent in a light honey-colored liquid form. This product has a viscosity of 150-250 mPa.s. Kingcure N-768 is most commonly used in solvent-free coating and fast-setting adhesive formulation app...view more Kingcure N-768 is a rapid room temperature epoxy resin curing agent in a light honey-colored liquid form. This product has a viscosity of 150-250 mPa.s. Kingcure N-768 is most commonly used in solvent-free coating and fast-setting adhesive formulation applications. view less | |
| Kingcure X-165A | Sanho Chemical Co., Ltd. | Kingcure X-165A is a rapid room temperature epoxy resin curing agent in a light yellow-colored liquid form. This product has a viscosity of 50-150 mPa.s and a specific gravity of 1.11. Kingcure X-165A is most commonly used in solvent-free coating formulat...view more Kingcure X-165A is a rapid room temperature epoxy resin curing agent in a light yellow-colored liquid form. This product has a viscosity of 50-150 mPa.s and a specific gravity of 1.11. Kingcure X-165A is most commonly used in solvent-free coating formulation applications. view less | |
| VESTANAT® EP-M 222 X | Evonik Operations GmbH, BL Crosslinkers | VESTANAT® EP-M 222 X is a methoxysilane functional urethane crosslinker that can be used as a crosslinker to increase the flexibility of highly scratch resistant coatings, e.g. highly scratch resistant NISO*2 coatings. It is dissolved at 85 % ...view more VESTANAT® EP-M 222 X is a methoxysilane functional urethane crosslinker that can be used as a crosslinker to increase the flexibility of highly scratch resistant coatings, e.g. highly scratch resistant NISO*2 coatings. It is dissolved at 85 % in xylene, allowing it to be used in low-VOC coatings formulation. view less | Request Sample |
| COPONYL™ N-3449L | Nippon Gohsei | COPONYL™ N-3449L is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and acetone solvents. It provides good adhesion to olefin. Applications include masking tapes and protective masking films. This produ...view more COPONYL™ N-3449L is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and acetone solvents. It provides good adhesion to olefin. Applications include masking tapes and protective masking films. This product is well suited for use in adhesives. view less | |
| COPONYL™ 5705L | Nippon Gohsei | COPONYL™ 5705L is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides strong adhesion and low tack. Applications include masking tapes and protective masking films. This product is w...view more COPONYL™ 5705L is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides strong adhesion and low tack. Applications include masking tapes and protective masking films. This product is well suited for use in electronics and adhesives. view less | |
| COPONYL™ N-3933E | Nippon Gohsei | COPONYL™ N-3933E is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides good adhesion for rounded surfaces and labels for refrigerated food. Applications include films and labels. Th...view more COPONYL™ N-3933E is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides good adhesion for rounded surfaces and labels for refrigerated food. Applications include films and labels. This product is well suited for use in adhesives. view less | |
| COPONYL™ 8711 | Nippon Gohsei | COPONYL™ 8711 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It has good processability and heat resistance. Applications include double-sided tapes and foam tapes. This product is well ...view more COPONYL™ 8711 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It has good processability and heat resistance. Applications include double-sided tapes and foam tapes. This product is well suited for use in electronics and adhesives. view less | |
| COPONYL™ N-4510 | Nippon Gohsei | COPONYL™ N-4510 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It has good repulsion resistance. Applications include double-sided tapes and foam tapes. This product is well suited for u...view more COPONYL™ N-4510 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It has good repulsion resistance. Applications include double-sided tapes and foam tapes. This product is well suited for use in electronics and adhesives. view less | |
| COPONYL™ 8708 | Nippon Gohsei | COPONYL™ 8708 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides good adhesion at low temperature. Applications include double-sided tapes and foam tapes. This product is well su...view more COPONYL™ 8708 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides good adhesion at low temperature. Applications include double-sided tapes and foam tapes. This product is well suited for use in electronics and adhesives. view less | |
| COPONYL™ N-7482 | Nippon Gohsei | COPONYL™ N-7482 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It provides good adhesion at low temperature. Applications include double-sided tapes and foam tapes. This product is well suited for us...view more COPONYL™ N-7482 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It provides good adhesion at low temperature. Applications include double-sided tapes and foam tapes. This product is well suited for use in electronics and adhesives. view less | |
| COPONYL™ N-7166 | Nippon Gohsei | COPONYL™ N-7166 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, methyl ethyl ketone solvents. It provides good corrosion resistance, and is ideal for thin layer application. This product is well suit...view more COPONYL™ N-7166 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, methyl ethyl ketone solvents. It provides good corrosion resistance, and is ideal for thin layer application. This product is well suited for use in electronics and adhesives. view less | |
| NexSil™ 20A | Nyacol Nano Technology | NexSil™ 20A is an acidic dispersion of 20 nm colloidal silica at 30% concentration. The product is used as a low sodium colloidal silica binder in investment casting and fibrous refractory applications, to formulate catalyst support structures, and for us...view more NexSil™ 20A is an acidic dispersion of 20 nm colloidal silica at 30% concentration. The product is used as a low sodium colloidal silica binder in investment casting and fibrous refractory applications, to formulate catalyst support structures, and for use with trivalent chromium conversion coatings, among other applications. view less | |
| BRS-14320S | Bomar, formerly Dymax Oligomers & Coatings | BRS-14320S is a difunctional oligomer that combines a robust silicone backbone into a urethane acrylate oligomer. The resulting product provides an unusual combination of desirable properties: softness, flexibility, and temperature resistance. BRS-14320S ...view more BRS-14320S is a difunctional oligomer that combines a robust silicone backbone into a urethane acrylate oligomer. The resulting product provides an unusual combination of desirable properties: softness, flexibility, and temperature resistance. BRS-14320S is a candidate for consideration in formulating 100% UV soft-touch coatings and also for electronics applications. view less | |
| Desmodur® HL BA | Covestro | Desmodur® HL BA is an aromatic/aliphatic polyisocyanate based on toluylene diisocyanate/ hexamethylene diisocyanate ideal for use in combination with various Desmophen grades or other suitable substances containing hydroxyl groups to formulate clear or pi...view more Desmodur® HL BA is an aromatic/aliphatic polyisocyanate based on toluylene diisocyanate/ hexamethylene diisocyanate ideal for use in combination with various Desmophen grades or other suitable substances containing hydroxyl groups to formulate clear or pigmented, two-component polyurethane coatings characterized by rapid drying and good lightfastness. view less | |
| TIB KAT® K15 | TIB Chemicals | TIB KAT® K15 is a special formulation based on potassium octoate used for the manufacturing of polyisocyanurates, crosslinking of maleic anhydride-containing polymers with polyols and used as a cocatalyst for the curing of unsaturated polyester resins. It...view more TIB KAT® K15 is a special formulation based on potassium octoate used for the manufacturing of polyisocyanurates, crosslinking of maleic anhydride-containing polymers with polyols and used as a cocatalyst for the curing of unsaturated polyester resins. It shows high compatibility and miscibility with low polar reaction partners due to its special composition. view less | Request Sample |
| Araldite® GY 6010 CSR | Jubail Chemical Industries Co. | Araldite® GY 6010 CSR is a general purpose, unmodified, low to medium viscosity epoxy resin based on Bisphenol A. This product is characterized by its reactivity, compatibility, and low hydrolysable chlorine content. Araldite® GY 6010 CSR is used in the f...view more Araldite® GY 6010 CSR is a general purpose, unmodified, low to medium viscosity epoxy resin based on Bisphenol A. This product is characterized by its reactivity, compatibility, and low hydrolysable chlorine content. Araldite® GY 6010 CSR is used in the formulation of chemical resistant coatings and matrix adhesives. view less | |
| Kingcure 800-S | Sanho Chemical Co., Ltd. | Kingcure 800-S is a mercaptan terminated polymer in a light yellow-colored viscous liquid form. This product has a slower gel time and a viscosity of 10,000-20,000 mPa.s and a specific gravity of 1.13. Kingcure 800-S is most commonly used in mortar and fa...view more Kingcure 800-S is a mercaptan terminated polymer in a light yellow-colored viscous liquid form. This product has a slower gel time and a viscosity of 10,000-20,000 mPa.s and a specific gravity of 1.13. Kingcure 800-S is most commonly used in mortar and fast-setting adhesive formulation applications. view less | |
| SP-120 | NuSil Silicone Technology 1 | SP-120 is a silicone primer that is formulated for use with one and two-part RTV systems, and does not need mixing.The translucent color of SP-120 helps to preserve visibility with other translucent products. This primer will also improve the adhesion of ...view more SP-120 is a silicone primer that is formulated for use with one and two-part RTV systems, and does not need mixing.The translucent color of SP-120 helps to preserve visibility with other translucent products. This primer will also improve the adhesion of the RTV systems to other substrates such as metals, ceramics, glass, and wood. view less | |
| SP-121 | NuSil Silicone Technology 1 | SP-121 is a specially formulated silicone primer that is designed to be used with one and two-part RTV systems. This primer is red in color and provides an easy visual determination of surface coverage when using it. It will also improve the adhesion of t...view more SP-121 is a specially formulated silicone primer that is designed to be used with one and two-part RTV systems. This primer is red in color and provides an easy visual determination of surface coverage when using it. It will also improve the adhesion of the RTV systems to various substrates such as glass, metals, rigid plastics, and ceramics. view less | |
| Unithane IC-100 | Union Specialties, Inc. | Unithane IC-100 is a NMP containing, medium hard, high gloss, APEO free, water-based polyurethane dispersion. This product has a gloss at 60° of 85 and a viscosity at 25°C of 100 cps. It is often used in a formulated topcoat for wood, metal, flooring, ink...view more Unithane IC-100 is a NMP containing, medium hard, high gloss, APEO free, water-based polyurethane dispersion. This product has a gloss at 60° of 85 and a viscosity at 25°C of 100 cps. It is often used in a formulated topcoat for wood, metal, flooring, inks, adhesives, and graphic arts. view less | |
| Kingmide 315-S | Sanho Chemical Co., Ltd. | Kingmide 315-S is a high viscosity, reactive polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 8000-12,000 mPa.s and a specific gravity of 0.97. Kingmide 315-S is most commonly used in adhesive and high-solids anti-co...view more Kingmide 315-S is a high viscosity, reactive polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 8000-12,000 mPa.s and a specific gravity of 0.97. Kingmide 315-S is most commonly used in adhesive and high-solids anti-corrosive coating formulation applications. view less | |
| Tohmide 255 | Sanho Chemical Co., Ltd. | Tohmide 255 is a low viscosity, fast setting, reactive polyamide hardener in a brown-colored viscous liquid form. This product has a viscosity of 300-600 mPa.s and a specific gravity of 0.97. Tohmide 255 is most commonly used in reactive epoxy lining and ...view more Tohmide 255 is a low viscosity, fast setting, reactive polyamide hardener in a brown-colored viscous liquid form. This product has a viscosity of 300-600 mPa.s and a specific gravity of 0.97. Tohmide 255 is most commonly used in reactive epoxy lining and thin bonding mortar formulation applications. view less | |
| COPONYL™ 8694 | Nippon Gohsei | COPONYL™ 8694 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides strong adhesion and good removability. Applications include films and labels, masking tapes, and protective maski...view more COPONYL™ 8694 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides strong adhesion and good removability. Applications include films and labels, masking tapes, and protective masking films. This product is well suited for use in adhesives. view less | |
| Nyacol® APE3040 | Nyacol Nano Technology | Nyacol® APE3040 is a nonaqueous dispersion of colloidal antimony pentoxide formulated for use as a flame retardant synergist in halogen-containing vinyl ester and unsaturated polyester resins. It can replace antimony trioxide in formulas containing bromin...view more Nyacol® APE3040 is a nonaqueous dispersion of colloidal antimony pentoxide formulated for use as a flame retardant synergist in halogen-containing vinyl ester and unsaturated polyester resins. It can replace antimony trioxide in formulas containing bromine or chlorine and can be used in textiles, adhesives, coatings, and water-based systems. view less | |
| XR-741MS | Bomar, formerly Dymax Oligomers & Coatings | XR-741MS, a low molecular weight, difunctional, aliphatic polyester urethane methacrylate, can be effectively formulated for adhesion to steel, aluminum, and various plastics. The resulting hard, tough film makes an effective, non-yellowing protective coa...view more XR-741MS, a low molecular weight, difunctional, aliphatic polyester urethane methacrylate, can be effectively formulated for adhesion to steel, aluminum, and various plastics. The resulting hard, tough film makes an effective, non-yellowing protective coating. This material has low skin sensitivity for dental and cosmetic applications. view less | |
| 5016-EP-70 Water Reducible Acrylic Modified Alkyd Resin | Gabriel Performance Products | 5016-EP-70 Water Reducible Acrylic Modified Alkyd Resin at 70% non-volatile by weight in a mixed co-solvent system. It features a fast dry time and quick film hardness development and is formulated to give good exterior weathering, good initial gloss, and...view more 5016-EP-70 Water Reducible Acrylic Modified Alkyd Resin at 70% non-volatile by weight in a mixed co-solvent system. It features a fast dry time and quick film hardness development and is formulated to give good exterior weathering, good initial gloss, and good gloss retention. view less | |
| 5063-BS-70 Water Reducible Alkyd Resin | Gabriel Performance Products | 5063-BS-70 Water Reducible Alkyd Resin is a fast drying chain-stopped water reducible alkyd resin intended for industrial and OEM finishes. Can be used in air dry and force dry finishes. This resin was formulated to be economical but offers very good film...view more 5063-BS-70 Water Reducible Alkyd Resin is a fast drying chain-stopped water reducible alkyd resin intended for industrial and OEM finishes. Can be used in air dry and force dry finishes. This resin was formulated to be economical but offers very good film properties at the same time. view less | |
| VINNAPAS® 400 H | Wacker Chemie AG | VINNAPAS® 400 H is a poly(vinyl alcohol) stabilized vinyl acetate-ethylene copolymer dispersion with a glass transition temperature (Tg) of 0 °C. It was developed as a higher viscosity, high-performance dispersion offering a superior balance of adhesive/c...view more VINNAPAS® 400 H is a poly(vinyl alcohol) stabilized vinyl acetate-ethylene copolymer dispersion with a glass transition temperature (Tg) of 0 °C. It was developed as a higher viscosity, high-performance dispersion offering a superior balance of adhesive/cohesive properties useful in achieving much higher formulation viscosities. view less | |
| Polydo GY-420 | Kukdo Chemical Co., Ltd. | Polydo GY-420 polyether polyol is a glycerine initiated, nominal 420-molecular -weight triol based on propylene oxide. GY-420 is generally used for high density rigid polyurethane foams. The foams over 400kg/ density are used for construction and housing ...view more Polydo GY-420 polyether polyol is a glycerine initiated, nominal 420-molecular -weight triol based on propylene oxide. GY-420 is generally used for high density rigid polyurethane foams. The foams over 400kg/ density are used for construction and housing materials. Foam density can be varied with formulation. view less | |
| 1,4-Butanediol (1,4-BDO) | DCC (Dairen Chemical Corp.) | 1,4-Butanediol (1,4-BDO) is produced by hydro-formulation and hydrogenation of Allyl Alcohol, carbon monoxide and hydrogen. 1,4-Butanediol is a colorless, high-boiling liquid with a low order of toxicity. 1,4-Butanediol is used as a raw material for manuf...view more 1,4-Butanediol (1,4-BDO) is produced by hydro-formulation and hydrogenation of Allyl Alcohol, carbon monoxide and hydrogen. 1,4-Butanediol is a colorless, high-boiling liquid with a low order of toxicity. 1,4-Butanediol is used as a raw material for manufacturing carrier solvent in printing ink, and is a key component of hot melt adhesive. view less | |
| Tohmide 225-XX | Sanho Chemical Co., Ltd. | Tohmide 225-XX is a polyaminoamide-type epoxy curing agent with a longer pot life in a brown-colored viscous liquid form. This product has a viscosity of 8000-12,000 mPa.s and a specific gravity of 0.97. Tohmide 225-XX is most commonly used in adhesive, s...view more Tohmide 225-XX is a polyaminoamide-type epoxy curing agent with a longer pot life in a brown-colored viscous liquid form. This product has a viscosity of 8000-12,000 mPa.s and a specific gravity of 0.97. Tohmide 225-XX is most commonly used in adhesive, sealant, and surface coating formulation applications. view less | |
| COPONYL™ N-4519L | Nippon Gohsei | COPONYL™ N-4519L is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and acetone solvents. It provides strong adhesion and high tack. Applications include masking tapes and protective masking films. This...view more COPONYL™ N-4519L is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and acetone solvents. It provides strong adhesion and high tack. Applications include masking tapes and protective masking films. This product is well suited for use in electronics and adhesives. view less | |
| COPONYL™ 5672 | Nippon Gohsei | COPONYL™ 5672 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides strong adhesion and good removability. Applications include films and labels, masking tapes, and protective maski...view more COPONYL™ 5672 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides strong adhesion and good removability. Applications include films and labels, masking tapes, and protective masking films. This product is well suited for use in electronics and adhesives. view less | |
| COPONYL™ 5065 | Nippon Gohsei | COPONYL™ 5065 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides high-speed peeling characteristics and is residue free. Applications include masking tapes and protective masking...view more COPONYL™ 5065 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides high-speed peeling characteristics and is residue free. Applications include masking tapes and protective masking films. This product is well suited for use in electronics and adhesives. view less | |
| COPONYL™ N-4495 | Nippon Gohsei | COPONYL™ N-4495 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides high-speed peeling characteristics. Applications include masking tapes, protective masking films, and processin...view more COPONYL™ N-4495 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides high-speed peeling characteristics. Applications include masking tapes, protective masking films, and processing. This product is well suited for use in electronics and adhesives. view less | |
| COPONYL™ 5411 | Nippon Gohsei | COPONYL™ 5411 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides permanent adhesion, and is suitable for thick-layer application. Applications include double-sided tapes and foam...view more COPONYL™ 5411 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides permanent adhesion, and is suitable for thick-layer application. Applications include double-sided tapes and foam tapes. This product is well suited for use in electronics and adhesives. view less | |
| COPONYL™ 8700 | Nippon Gohsei | COPONYL™ 8700 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It has good adhesion to olefin and is suitable for short-aging time. Applications include double-sided tapes and foam tapes. ...view more COPONYL™ 8700 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It has good adhesion to olefin and is suitable for short-aging time. Applications include double-sided tapes and foam tapes. This product is well suited for use in adhesives. view less | |
| BR-5413MB | Bomar, formerly Dymax Oligomers & Coatings | BR-5413MB is a difunctional aliphatic polyether urethane methacrylate with a good balance of high tensile strength and impact resistance. Formulating with linear monofunctional monomers can yield improved flexibility. This oligomer is an excellent candida...view more BR-5413MB is a difunctional aliphatic polyether urethane methacrylate with a good balance of high tensile strength and impact resistance. Formulating with linear monofunctional monomers can yield improved flexibility. This oligomer is an excellent candidate to consider for use in impact-resistant coatings and provides low color and excellent non-yellowing performance. view less | |
| SURFADOL 532 | DKSH | SURFADOL 532 is a molecular defoamer specifically designed for water-based systems. Its features include excellent substrate wetting, synergy with conventional defoamers, effective long-lasting foam control against microfoam, and silicone-free, non-toxic ...view more SURFADOL 532 is a molecular defoamer specifically designed for water-based systems. Its features include excellent substrate wetting, synergy with conventional defoamers, effective long-lasting foam control against microfoam, and silicone-free, non-toxic formulation. It also does not contain added alkylphenol ethoxylates (APEs). view less | Request Sample |
| SUPRASEC® 2244 | Huntsman Polyurethanes EMEAI | SUPRASEC 2244 - multi-purpose MDI raw material / isocyanate from Huntsman Polyurethanes for use in the formulation of one component (1k) fast cure structural wood adhesives offering a strong bond, extremely high ageing properties and a medium open time - ...view more SUPRASEC 2244 - multi-purpose MDI raw material / isocyanate from Huntsman Polyurethanes for use in the formulation of one component (1k) fast cure structural wood adhesives offering a strong bond, extremely high ageing properties and a medium open time - all in line with D4, EN204 and WATT 91 standards. view less | |
| SUPRASEC® 2944 | Huntsman Polyurethanes EMEAI | SUPRASEC 2944 - multi-purpose MDI raw material / isocyanate from Huntsman Polyurethanes for use in the formulation of one component (1k) fast cure structural wood adhesives offering a strong bond, extremely high ageing properties, a medium open time - all...view more SUPRASEC 2944 - multi-purpose MDI raw material / isocyanate from Huntsman Polyurethanes for use in the formulation of one component (1k) fast cure structural wood adhesives offering a strong bond, extremely high ageing properties, a medium open time - all in line with D4, EN204 and WATT 91 standards. view less |
