| Domide G-A0432 | Kukdo Chemical Co., Ltd. | Domide G-A0432 is a low viscosity Polyamidoamine Resin for reaction with liquid or solid Epoxy Resins. GA0432 is lower in viscosity than G-A0533. This product is well suited for use in sealants, electrical potting and casting. | |
| Domide G-A0533 | Kukdo Chemical Co., Ltd. | Domide G-A0533 is a low-viscosity Polyamidoamine Resin designed for reaction with liquid or solid Epoxy Resins. It can be used as all or part for use in making sealants, electrical potting, casting, coatings and flooring applications. | |
| Epokukdo KDCP-200 | Kukdo Chemical Co., Ltd. | Epokukdo KDCP-200 is a multi-functional epoxy resin derived from poly-addition compound of dicyclopentadiene and phenol, and is designed for application of high performance epoxy molding compound(EMC) in semi-conductor and laminates. The strongest advanta...view more Epokukdo KDCP-200 is a multi-functional epoxy resin derived from poly-addition compound of dicyclopentadiene and phenol, and is designed for application of high performance epoxy molding compound(EMC) in semi-conductor and laminates. The strongest advantage in semi-conductor packaging using this product is much lower moisture absorption than previous generation epoxy resins, such as o-cresol novolac epoxy resin(YDCN type) or biphenyl type epoxy resin. This product can be substituted for YDCN and biphenyl type epoxy resin for preparing EMC with excellent performance in SMD. view less | |
| Epokukdo KDCP-150 | Kukdo Chemical Co., Ltd. | Epokukdo KDCP-150 is a multi-functional epoxy resin derived from poly-addition compound of dicyclopentadiene and phenol, and is designed for application of high performance epoxy molding compound(EMC) in semi-conductor and laminates. The strongest advanta...view more Epokukdo KDCP-150 is a multi-functional epoxy resin derived from poly-addition compound of dicyclopentadiene and phenol, and is designed for application of high performance epoxy molding compound(EMC) in semi-conductor and laminates. The strongest advantage in semi-conductor packaging using this product is much lower moisture absorption than previous generation epoxy resins, such as o-cresol novolac epoxy resin(YDCN type) or biphenyl type epoxy resin. This product can be substituted for YDCN and biphenyl type epoxy resin for preparing EMC with excellent performance in SMD. view less | |
| Epokukdo KDCP-100 | Kukdo Chemical Co., Ltd. | Epokukdo KDCP-100 is a multi-functional epoxy resin derived from poly-addition compound of dicyclopentadiene and phenol, and is designed for application of high performance epoxy molding compound(EMC) in semi-conductor and laminates. The strongest advanta...view more Epokukdo KDCP-100 is a multi-functional epoxy resin derived from poly-addition compound of dicyclopentadiene and phenol, and is designed for application of high performance epoxy molding compound(EMC) in semi-conductor and laminates. The strongest advantage in semi-conductor packaging using this product is much lower moisture absorption than previous generation epoxy resins, such as o-cresol novolac epoxy resin(YDCN type) or biphenyl type epoxy resin. This product can be substituted for YDCN and biphenyl type epoxy resin for preparing EMC with excellent performance in SMD. view less | |
| Epokukdo YDF-170 | Kukdo Chemical Co., Ltd. | Epokukdo YDF-170 is a liquid type epoxy resins derived from BPF and ECH. Especially, it has low viscosity without diluents or modifiers. YDF-170 has excellent mechanical, adhesion, electrical, and chemical resistance properties after being cured with appr...view more Epokukdo YDF-170 is a liquid type epoxy resins derived from BPF and ECH. Especially, it has low viscosity without diluents or modifiers. YDF-170 has excellent mechanical, adhesion, electrical, and chemical resistance properties after being cured with appropriate curing agents. Due to its special properties, YDF-170 is generally used in coatings, moldings, adhesive, construction and civil works, and composite applications for the low VOC or non-solvent system. view less | |
| Epokukdo YD-128S | Kukdo Chemical Co., Ltd. | Epokukdo YD-128S is a liquid type standard epoxy resin derived from Bisphenol-A. Especially, it has excellent adhesion, chemical resistance, heat resistance, etc. is cured together with the various hardeners(polyamide resin, aromatic polyamine, aliphatic...view more Epokukdo YD-128S is a liquid type standard epoxy resin derived from Bisphenol-A. Especially, it has excellent adhesion, chemical resistance, heat resistance, etc. is cured together with the various hardeners(polyamide resin, aromatic polyamine, aliphatic polyamine and anhydride compound). Depending on diluents and other additives, different physical properties after curing can be obtained. Generally, YD-128S, clear liquid form of the standard epoxy resins is widely used in many fields such as paints, electrode paint, ambient curing paint, clear coating agent, anti-corrosion coatings, casting, dipping, encapsulation, laminates, condenser, resistor coating etc.. view less | |
| Epokukdo YD-128 | Kukdo Chemical Co., Ltd. | Epokukdo YD-128 is a liquid type standard epoxy resin derived from Bisphenol-A. It has excellent adhesion, chemical resistance, heat resistance, etc. Epokukdo YD-128 is cured together with the various hardeners (polyamide resin, aromatic polyamine, alipha...view more Epokukdo YD-128 is a liquid type standard epoxy resin derived from Bisphenol-A. It has excellent adhesion, chemical resistance, heat resistance, etc. Epokukdo YD-128 is cured together with the various hardeners (polyamide resin, aromatic polyamine, aliphatic polyamine and anhydride compound). Depending on diluents and other additives, different physical properties after curing can be obtained. Generally, YD-128, clear liquid form of the standard epoxy resins is widely used in many fields such as paints, electrode paint, ambient curing paint, clear coating agent, anti-corrosion coatings, casting, dipping, encapsulation, laminates, condenser, resistor coating etc.. view less | |
| Epokukdo YDF-175 | Kukdo Chemical Co., Ltd. | Epokukdo YDF-175 is a liquid type epoxy resins derived from BPF and ECH. Especially, it has low viscosity without diluents or modifiers. YDF-175 has excellent mechanical, adhesion, electrical, and chemical resistance properties after being cured with appr...view more Epokukdo YDF-175 is a liquid type epoxy resins derived from BPF and ECH. Especially, it has low viscosity without diluents or modifiers. YDF-175 has excellent mechanical, adhesion, electrical, and chemical resistance properties after being cured with appropriate curing agents. Due to its special properties, YDF-175 is generally used in coatings, moldings, adhesive, construction and civil works, and composite applications for the low VOC or non-solvent system. YDF-175 is specially designed for non-crystalline type in cold weather. view less | |
| Epokukdo YD-128SH | Kukdo Chemical Co., Ltd. | Epokukdo YD-128SH is a liquid type standard epoxy resin derived from Bisphenol-A. Especially, it has excellent adhesion, chemical resistance, heat resistance etc. Epokukdo YD-128SH is cured together with the various hardeners(polyamide resin, aromatic pol...view more Epokukdo YD-128SH is a liquid type standard epoxy resin derived from Bisphenol-A. Especially, it has excellent adhesion, chemical resistance, heat resistance etc. Epokukdo YD-128SH is cured together with the various hardeners(polyamide resin, aromatic polyamine, aliphatic polyamine and anhydride compound). Depending on diluents and other additives, different physical properties after curing can be obtained. Generally, YD-128SH, clear liquid form of the standard epoxy resins is widely used in many fields such as paints, electrode paint, ambient curing paint, clear coating agent, anti-corrosion coatings, casting, dipping, encapsulation, laminates, condenser, resistor coating etc.. view less | |
| Epokukdo YD-128SM | Kukdo Chemical Co., Ltd. | Epokukdo YD-128SM is a liquid type standard epoxy resin derived from Bisphenol-A. Especially, it has excellent adhesion, chemical resistance, heat resistance, etc. Epokukdo YD-128SM is cured together with the various hardeners(polyamide resin, aromatic po...view more Epokukdo YD-128SM is a liquid type standard epoxy resin derived from Bisphenol-A. Especially, it has excellent adhesion, chemical resistance, heat resistance, etc. Epokukdo YD-128SM is cured together with the various hardeners(polyamide resin, aromatic polyamine, aliphatic polyamine and anhydride compound). Depending on diluents and other additives, different physical properties after curing can be obtained. Generally, YD-128SM, clear liquid form of the standard epoxy resins is widely used in many fields such as paints, electrode paint, ambient curing paint, clear coating agent, anti-corrosion coatings, casting, dipping, encapsulation, laminates, condenser, resistor coating etc.. view less | |
| Epokukdo YD-128H | Kukdo Chemical Co., Ltd. | Epokukdo YD-128H is a liquid type standard epoxy resin derived from Bisphenol-A. Especially, it has excellent adhesion, chemical resistance, heat resistance, etc. Epokukdo YD-128H is cured together with the various hardeners(polyamide resin, aromatic poly...view more Epokukdo YD-128H is a liquid type standard epoxy resin derived from Bisphenol-A. Especially, it has excellent adhesion, chemical resistance, heat resistance, etc. Epokukdo YD-128H is cured together with the various hardeners(polyamide resin, aromatic polyamine, aliphatic polyamine and anhydride compound). Depending on diluents and other additives, different physical properties after curing can be obtained. Generally, YD-128H, clear liquid form of the standard epoxy resins is widely used in many fields such as paints, electrode paint, ambient curing paint, clear coating agent, anti-corrosion coatings, casting, dipping, encapsulation, laminates, condenser, resistor coating etc.. view less | |
| Epokukdo YD-128M | Kukdo Chemical Co., Ltd. | Epokukdo YD-128M is a liquid type standard epoxy resin derived from Bisphenol-A. Especially, it has excellent adhesion, chemical resistance, heat resistance, etc. Epokukdo YD-128M is cured together with the various hardeners(polyamide resin, aromatic poly...view more Epokukdo YD-128M is a liquid type standard epoxy resin derived from Bisphenol-A. Especially, it has excellent adhesion, chemical resistance, heat resistance, etc. Epokukdo YD-128M is cured together with the various hardeners(polyamide resin, aromatic polyamine, aliphatic polyamine and anhydride compound). Depending on diluents and other additives, different physical properties after curing can be obtained. Generally, YD-128M, clear liquid form of the standard epoxy resins is widely used in many fields such as paints, electrode paint, ambient curing paint, clear coating agent, anti-corrosion coatings, casting, dipping, encapsulation, laminates, condenser, resistor coating etc.. view less | |
| Epokukdo YD-128A | Kukdo Chemical Co., Ltd. | Epokukdo YD-128A is a liquid type standard epoxy resin derived from Bisphenol-A. Especially, it has excellent adhesion, chemical resistance, heat resistance, etc. Epokukdo YD-128A is cured together with the various hardeners(polyamide resin, aromatic poly...view more Epokukdo YD-128A is a liquid type standard epoxy resin derived from Bisphenol-A. Especially, it has excellent adhesion, chemical resistance, heat resistance, etc. Epokukdo YD-128A is cured together with the various hardeners(polyamide resin, aromatic polyamine, aliphatic polyamine and anhydride compound). Depending on diluents and other additives, different physical properties after curing can be obtained. Generally, YD-128A, clear liquid form of the standard epoxy resins is widely used in many fields such as paints, electrode paint, ambient curing paint, clear coating agent, anti-corrosion coatings, casting, dipping, encapsulation, laminates, condenser, resistor coating etc.. view less | |
| CHS-Epoxy 520 | Spolchemie | CHS-Epoxy 520 is a universal low molecular weight epoxy resin based on BPA. This product is a resin that has no modifiers and can cure at two different levels at either an elevated or ambient temperature. CHS-Epoxy 520 is primarily used for modifying, sat...view more CHS-Epoxy 520 is a universal low molecular weight epoxy resin based on BPA. This product is a resin that has no modifiers and can cure at two different levels at either an elevated or ambient temperature. CHS-Epoxy 520 is primarily used for modifying, saturating, condensing and preserving operations in different areas of industry. view less | |
| CHS-Epoxy 530 | Spolchemie | CHS-Epoxy 530 is a universal low molecular weight epoxy resin based on BPA. This product is a resin that has no modifiers and can cure at two different levels at either an elevated or ambient temperature. CHS-Epoxy 530 is primarily used for modifying, sat...view more CHS-Epoxy 530 is a universal low molecular weight epoxy resin based on BPA. This product is a resin that has no modifiers and can cure at two different levels at either an elevated or ambient temperature. CHS-Epoxy 530 is primarily used for modifying, saturating, condensing and preserving operations in different areas of industry. view less | |
| CHS-Epoxy 525 | Spolchemie | CHS-Epoxy 525 is a universal low molecular weight epoxy resin based on BPA. This product contains no modifications and is able to dry at two different levels at either an elevated or ambient temperature. CHS-Epoxy 525 is primarily used for modifying, satu...view more CHS-Epoxy 525 is a universal low molecular weight epoxy resin based on BPA. This product contains no modifications and is able to dry at two different levels at either an elevated or ambient temperature. CHS-Epoxy 525 is primarily used for modifying, saturating, condensing and preserving operations in different areas of industry. view less | |
| CHS-Epoxy 510 | Spolchemie | CHS-Epoxy 510 is a universal low molecular weight epoxy resin based on BPA. This product is a non-modified liquid with a very low crystallization tendency. CHS-Epoxy 510 can be cured at two different levels of ambient or elevated. The primary use for this...view more CHS-Epoxy 510 is a universal low molecular weight epoxy resin based on BPA. This product is a non-modified liquid with a very low crystallization tendency. CHS-Epoxy 510 can be cured at two different levels of ambient or elevated. The primary use for this product is to modify, impregnate, encapsulate and potting operations. view less | |
| CHS-Epoxy 301 | Spolchemie | CHS-Epoxy 301 is a medium molecular weighted, semi-solid epoxy resin based on BPA. This product is primarily used for hot casting applications in several different areas of industry; this is including the electrical industry. It is also used in solvent bo...view more CHS-Epoxy 301 is a medium molecular weighted, semi-solid epoxy resin based on BPA. This product is primarily used for hot casting applications in several different areas of industry; this is including the electrical industry. It is also used in solvent borne coatings. view less | |
| CHS-Epoxy 525 LA | Spolchemie | CHS-Epoxy 525 LA is a universal low molecular weight epoxy resin based on BPA with lower alpha glycol content. This product contains no modifications and is able to dry at two different levels at either an elevated or ambient temperature. CHS-Epoxy 525 LA...view more CHS-Epoxy 525 LA is a universal low molecular weight epoxy resin based on BPA with lower alpha glycol content. This product contains no modifications and is able to dry at two different levels at either an elevated or ambient temperature. CHS-Epoxy 525 LA is primarily used for modifying, saturating, condensing and preserving operations in different areas of industry. view less | |
| CHS-Epoxy 531 | Spolchemie | CHS-Epoxy 531 is a modified liquid epoxy resin with a low molecular weight. This epoxy resin product modified through a bi-functional reactive diluent. It also has the ability to cure at ambient or elevated temperature levels with the proper curing agent...view more CHS-Epoxy 531 is a modified liquid epoxy resin with a low molecular weight. This epoxy resin product modified through a bi-functional reactive diluent. It also has the ability to cure at ambient or elevated temperature levels with the proper curing agent. CHS-Epoxy 531 is primarily used for laminating, potting, solvent free coatings, and several different uses in electrical industry. view less | |
| CHS-Epoxy 200 M 75 | Spolchemie | CHS-Epoxy 200 M 75 is a Gardner colored solution of an epoxy resin. This product is a low weighted epoxy resin in methyl ethyl ketone (MEK) and its epoxide equivalent weight (EEW) range is 435-525 g/mol. This product is primarily used for production of la...view more CHS-Epoxy 200 M 75 is a Gardner colored solution of an epoxy resin. This product is a low weighted epoxy resin in methyl ethyl ketone (MEK) and its epoxide equivalent weight (EEW) range is 435-525 g/mol. This product is primarily used for production of laminates and mica insulators in electrical engineering industry. view less | |
| CHS-Epoxy 411 | Spolchemie | CHS-Epoxy 411 is a semi-solid epoxy resin based on BPA. This product is primarily used for hot casting applications, in several different areas of industry; this is including the electrical industry. This product is also used for producing solvent borne c...view more CHS-Epoxy 411 is a semi-solid epoxy resin based on BPA. This product is primarily used for hot casting applications, in several different areas of industry; this is including the electrical industry. This product is also used for producing solvent borne coatings and pre impregnations. view less | |
| CHS-Epoxy 455 | Spolchemie | CHS-Epoxy 455 is a low molecular weight solvent-free epoxy bonding agent with non-phthalate modifier. This product viscosity is modified by non-reactive, non-phthalate plasticizer. It is able to dry at two different levels at either an elevated or ambient...view more CHS-Epoxy 455 is a low molecular weight solvent-free epoxy bonding agent with non-phthalate modifier. This product viscosity is modified by non-reactive, non-phthalate plasticizer. It is able to dry at two different levels at either an elevated or ambient temperature. CHS-Epoxy 455 is primarily used for modifying, saturating, condensing and preserving and in particular, electrical, electronic, building and civil engineering. view less | |
| Epokukdo YH-300 | Kukdo Chemical Co., Ltd. | Epokukdo YH-300, tri-functional epoxy resin which is a reactive diluent, provides very low viscosity, low temperature curable, non-crystalline, non-yellowing and low volatile content in combination with standard liquid epoxy resin such as Epokukdo YD-128....view more Epokukdo YH-300, tri-functional epoxy resin which is a reactive diluent, provides very low viscosity, low temperature curable, non-crystalline, non-yellowing and low volatile content in combination with standard liquid epoxy resin such as Epokukdo YD-128. YH-300 is well suited for use in electrical insulation, tar epoxy coating, FRP, molding, etc. view less | |
| Epokukdo KDT-4400 | Kukdo Chemical Co., Ltd. | Epokukdo KDT-4400 is a tetra functional epoxy resin that shows excellent cured properties such as UV-blocking effect and thermal stability, etc. In case of being used with low brominated epoxy resin, it can be applied in electronic and electrical field fo...view more Epokukdo KDT-4400 is a tetra functional epoxy resin that shows excellent cured properties such as UV-blocking effect and thermal stability, etc. In case of being used with low brominated epoxy resin, it can be applied in electronic and electrical field for AOI system. view less | |
| Epokukdo YC-230 | Kukdo Chemical Co., Ltd. | Epokukdo YC-230 of casting resin system is a liquid type medium viscosity Bisphenol-A epoxy resin and medium-viscosity Hardener, respectively. This cured resin gives outstanding resistance to mechanical and electrical stresses and thermal shocks. Also, it...view more Epokukdo YC-230 of casting resin system is a liquid type medium viscosity Bisphenol-A epoxy resin and medium-viscosity Hardener, respectively. This cured resin gives outstanding resistance to mechanical and electrical stresses and thermal shocks. Also, it shows excellent long-term behavior in terms with breakdown strength and discharge resistance. view less | |
| CHS-Epoxy 571 | Spolchemie | CHS-Epoxy 571 is a clear colored low molecular weighted modified solid epoxy resin based on BPA and BPF. CHS-Epoxy 571 is primarily used for laminating, saturating, forming applications in civil and electrical engineering, construction of insulating mater...view more CHS-Epoxy 571 is a clear colored low molecular weighted modified solid epoxy resin based on BPA and BPF. CHS-Epoxy 571 is primarily used for laminating, saturating, forming applications in civil and electrical engineering, construction of insulating materials, anticorrosion paints. view less | |
| CHS-Epoxy 572 | Spolchemie | CHS-Epoxy 572 is a clear colored low molecular weighted modified solid epoxy resin based on BPA and BPF. CHS-Epoxy 572 is primarily used for laminating, penetrants, forming applications in civil and electrical engineering, construction of insulating mater...view more CHS-Epoxy 572 is a clear colored low molecular weighted modified solid epoxy resin based on BPA and BPF. CHS-Epoxy 572 is primarily used for laminating, penetrants, forming applications in civil and electrical engineering, construction of insulating materials, anticorrosion paints. view less | |
| CHS-Epoxy 573 | Spolchemie | CHS-Epoxy 573 is a clear colored low molecular weighted modified solid epoxy resin based on BPA and BPF. CHS-Epoxy 573 is primarily used for coatings, laminating, penetrants, forming applications in civil and electrical engineering, construction of insula...view more CHS-Epoxy 573 is a clear colored low molecular weighted modified solid epoxy resin based on BPA and BPF. CHS-Epoxy 573 is primarily used for coatings, laminating, penetrants, forming applications in civil and electrical engineering, construction of insulating materials, anticorrosion paints. view less | |
| CHS-Epoxy 574 | Spolchemie | CHS-Epoxy 574 is a clear colored low molecular weighted modified solid epoxy resin based on BPA and BPF. This product is modified by a bi-functional reactive diluent. CHS-Epoxy 574 is primarily used for coatings, lamination, penetrates, forming applicatio...view more CHS-Epoxy 574 is a clear colored low molecular weighted modified solid epoxy resin based on BPA and BPF. This product is modified by a bi-functional reactive diluent. CHS-Epoxy 574 is primarily used for coatings, lamination, penetrates, forming applications in civil and electrical engineering, construction of insulating materials, anticorrosion paints. view less | |
| CHS-Epoxy 575 | Spolchemie | CHS-Epoxy 575 is a clear colored low molecular weighted modified solid epoxy resin based on BPA and BPF. This product is modified by a bi-functional reactive diluent. CHS-Epoxy 575 is primarily used for coatings, lamination, penetrants, forming applicatio...view more CHS-Epoxy 575 is a clear colored low molecular weighted modified solid epoxy resin based on BPA and BPF. This product is modified by a bi-functional reactive diluent. CHS-Epoxy 575 is primarily used for coatings, lamination, penetrants, forming applications in civil and electrical engineering, construction of insulating materials, anticorrosion paints. view less | |
| CHS-Epoxy 512 | Spolchemie | CHS-Epoxy 512 is a modified liquid epoxy resin that has a low molecular weight. This epoxy resin product is modified through a non-reactive modifier. It has the ability to cure at either an ambient or elevated temperature level with the proper curing agen...view more CHS-Epoxy 512 is a modified liquid epoxy resin that has a low molecular weight. This epoxy resin product is modified through a non-reactive modifier. It has the ability to cure at either an ambient or elevated temperature level with the proper curing agent. The primary use for CHS-Epoxy 512 is for flooring, polymer mortars, polymer concrete, and certain applications for the electrical industry. view less | |
| Epokukdo YC-195 | Kukdo Chemical Co., Ltd. | Epokukdo YC-195 is molding epoxy resin with a low softening point. It is used for making mold products, which require excellent mechanical and electrical properties, by combination with acid anhydride curing agents. This product is especially suitable for...view more Epokukdo YC-195 is molding epoxy resin with a low softening point. It is used for making mold products, which require excellent mechanical and electrical properties, by combination with acid anhydride curing agents. This product is especially suitable for large size electric mold that needs high reliability due to its dimensional stability. YC-195 can be mainly used as dielectric material for high voltage transformer, high voltage converter, resin insulator, bushing and high voltage switch, etc. view less | |
| Epokukdo KC-335 | Kukdo Chemical Co., Ltd. | Epokukdo KC-335 of casting resin system is a liquid type medium viscosity bisphenol-A epoxy resin and medium-viscosity hardener, respectively. This cured resin gives outstanding resistance to mechanical and electrical stresses and thermal shocks. Also, it...view more Epokukdo KC-335 of casting resin system is a liquid type medium viscosity bisphenol-A epoxy resin and medium-viscosity hardener, respectively. This cured resin gives outstanding resistance to mechanical and electrical stresses and thermal shocks. Also, it shows excellent long-term behavior in terms with breakdown strength and discharge resistance. view less | |
| Epokukdo KC-305 | Kukdo Chemical Co., Ltd. | Epokukdo KC-305 of casting resin system is a liquid type medium viscosity bisphenol-A epoxy resin and medium-viscosity hardener, respectively. This cured resin gives outstanding resistance to mechanical and electrical stresses and thermal shocks. Also, it...view more Epokukdo KC-305 of casting resin system is a liquid type medium viscosity bisphenol-A epoxy resin and medium-viscosity hardener, respectively. This cured resin gives outstanding resistance to mechanical and electrical stresses and thermal shocks. Also, it shows excellent long-term behavior in terms with breakdown strength and discharge resistance. view less | |
| Epotec® YD 127 FP | Aditya Birla | Epotec® YD 127 FP is an unmodified, low viscosity liquid epoxy resin reaction product of bisphenol-A and epichlorohydrin. This product is ideal for use in high solids solvent-free coatings, laminates, and electrical & electronics applications. | |
| Epokukdo YC-195B | Kukdo Chemical Co., Ltd. | Epokukdo YC-195B has low softening point and low bromine content. It is used for making mold products, which require excellent mechanical and electrical properties, by combination with acid anhydride curing agents. This product is especially suitable for ...view more Epokukdo YC-195B has low softening point and low bromine content. It is used for making mold products, which require excellent mechanical and electrical properties, by combination with acid anhydride curing agents. This product is especially suitable for large size electric mold that needs high reliability due to its dimensional stability. YC-195B can be mainly used as dielectric material for high voltage transformer, high voltage converter, resin insulator, bushing and high voltage switch, etc. view less | |
| Epotec® YD 134 | Aditya Birla | Epotec® YD 134 is an unmodified, high viscosity, bisphenol-A-based semi-solid epoxy resin used to impart or improve toughness, flexibility, and adhesion. This product is ideal for use in adhesives, marine & industrial protective coatings, solvent-based co...view more Epotec® YD 134 is an unmodified, high viscosity, bisphenol-A-based semi-solid epoxy resin used to impart or improve toughness, flexibility, and adhesion. This product is ideal for use in adhesives, marine & industrial protective coatings, solvent-based coatings, construction coatings & systems, and electrical & electronic applications. view less | |
| Epotec® YD 128 X | Aditya Birla | Epotec® YD 128 X is a modified, medium viscosity, bisphenol-A-based epoxy resin which displays good chemical resistance, resistance to crystallization on storage, and pigment and filler wetting properties. This product is ideal for use in electrical, elec...view more Epotec® YD 128 X is a modified, medium viscosity, bisphenol-A-based epoxy resin which displays good chemical resistance, resistance to crystallization on storage, and pigment and filler wetting properties. This product is ideal for use in electrical, electronic, and flooring applications. view less | |
| Epotec® YD 128 XX | Aditya Birla | Epotec® YD 128 XX is a medium viscosity, bisphenol-A-based modified epoxy resin which displays good chemical resistance, resistance to crystallization on storage, and pigment and filler wetting properties. This product is ideal for use in electrical, elec...view more Epotec® YD 128 XX is a medium viscosity, bisphenol-A-based modified epoxy resin which displays good chemical resistance, resistance to crystallization on storage, and pigment and filler wetting properties. This product is ideal for use in electrical, electronic, and flooring applications. view less | |
| Epokukdo YDB-500A80 | Kukdo Chemical Co., Ltd. | Epokukdo YDB-500A80 is a low brominated epoxy resin that contains 19-20% of bromine content to give self-extinguishing property, and its solution type involves in 20% acetone of solvent content. It is suitable for making moldings, laminates, electrical an...view more Epokukdo YDB-500A80 is a low brominated epoxy resin that contains 19-20% of bromine content to give self-extinguishing property, and its solution type involves in 20% acetone of solvent content. It is suitable for making moldings, laminates, electrical and electronic parts and printed circuit boards (PCB, because this product has flame retardant characteristics and dimensional stability like general epoxy resin. view less | |
| Epotec® YD 535 | Aditya Birla | Epotec® YD 535 is a low viscosity, modified, bisphenol-A-based epoxy resin which displays very good wet out and degassing, as well as excellent adhesion and mechanical, physical, and thermal properties. This product is ideal for use in coatings and adhesi...view more Epotec® YD 535 is a low viscosity, modified, bisphenol-A-based epoxy resin which displays very good wet out and degassing, as well as excellent adhesion and mechanical, physical, and thermal properties. This product is ideal for use in coatings and adhesives for fiber-reinforced structural components - such as those used in automotive, sporting equipment, navy, aeronautic, marine, and electrical insulation applications. view less | |
| Epokukdo KB-563P | Kukdo Chemical Co., Ltd. | Epokukdo KB-563P is a high-brominated flameretardant epoxy oligomer resin using TBBA and TBP as major raw materials. It is a different type from conventional flame retardant used in the past. This epoxy oligomer resin shows excellent mechanical, electrica...view more Epokukdo KB-563P is a high-brominated flameretardant epoxy oligomer resin using TBBA and TBP as major raw materials. It is a different type from conventional flame retardant used in the past. This epoxy oligomer resin shows excellent mechanical, electrical properties, chemical resistance, molding property, heat resistance and melt flow-rate. In order to improve the flame retardancy, it can be used in engineering plastics such as ABS, HIPS, PP, PET, PC, PBT and so forth. view less | |
| Epokukdo KB-562P | Kukdo Chemical Co., Ltd. | Epokukdo KB-562P is a high-brominated flame-retardant epoxy oligomer Resin using TBBA and TBP asmajor raw materials. It is a different type from conventional flame retardant used in the past. This Epoxy oligomer Resin shows excellent mechanical, electrica...view more Epokukdo KB-562P is a high-brominated flame-retardant epoxy oligomer Resin using TBBA and TBP asmajor raw materials. It is a different type from conventional flame retardant used in the past. This Epoxy oligomer Resin shows excellent mechanical, electrical properties, chemical resistance, molding property, heat resistance and melt flow-rate. In order to improve the flame retardancy, it can be used in engineering plastics such as ABS, HIPS, PP, PET, PC, PBT and so forth. view less | |
| Epokukdo KB-560 | Kukdo Chemical Co., Ltd. | Epokukdo KB-560 is a high-brominated flame-retardant Epoxy oligomer Resin using TBBA and TBP as major raw materials. It is a different type from conventional flame retardant used in the past. This Epoxy oligomer Resin shows excellent mechanical, electrica...view more Epokukdo KB-560 is a high-brominated flame-retardant Epoxy oligomer Resin using TBBA and TBP as major raw materials. It is a different type from conventional flame retardant used in the past. This Epoxy oligomer Resin shows excellent mechanical, electrical properties, chemical resistance, molding property, heat resistance and melt flow-rate. In order to improve the flame retardancy, it can be used in engineering plastics such as ABS, HIPS, PP, PET, PC, PBT and so forth. view less | |
| Epotec® YD 128 J | Aditya Birla | Epotec® YD 128 J is an unmodified epoxy resin reaction product of bisphenol-A and epichlorohydrin. When cured with an appropriate hardener, it delivers excellent mechanical strength and chemical resistance. This product is ideal for use in solvent-free co...view more Epotec® YD 128 J is an unmodified epoxy resin reaction product of bisphenol-A and epichlorohydrin. When cured with an appropriate hardener, it delivers excellent mechanical strength and chemical resistance. This product is ideal for use in solvent-free coatings, adhesives, and construction, electrical, & electronics applications. view less | |
| Docure YC-230H | Kukdo Chemical Co., Ltd. | Docure YC-230H of casting resin system is a liquid type medium viscosity Bisphenol-A epoxy resin and medium-viscosity Hardener, respectively. This cured resin gives outstanding resistance to mechanical and electrical stresses and thermal shocks. Also, it ...view more Docure YC-230H of casting resin system is a liquid type medium viscosity Bisphenol-A epoxy resin and medium-viscosity Hardener, respectively. This cured resin gives outstanding resistance to mechanical and electrical stresses and thermal shocks. Also, it shows excellent long-term behavior in terms with breakdown strength and discharge resistance. view less | |
| Epotec® YD 128 EL | Aditya Birla | Epotec® YD 128 EL is an unmodified liquid epoxy resin reaction product of bisphenol-A and epichlorohydrin. When cured with an appropriate hardener, it delivers excellent mechanical, chemical, electrical, and adhesion properties. This product is ideal for ...view more Epotec® YD 128 EL is an unmodified liquid epoxy resin reaction product of bisphenol-A and epichlorohydrin. When cured with an appropriate hardener, it delivers excellent mechanical, chemical, electrical, and adhesion properties. This product is ideal for use in high solids solvent-free coatings, adhesives, and construction, electrical, & electronics applications. view less | |
| Epotec® YD 128 R | Aditya Birla | Epotec® YD 128 R is an unmodified liquid epoxy resin reaction product of bisphenol-A and epichlorohydrin. When cured with an appropriate hardener, it delivers excellent mechanical, chemical, electrical, and adhesion properties. This product is ideal for u...view more Epotec® YD 128 R is an unmodified liquid epoxy resin reaction product of bisphenol-A and epichlorohydrin. When cured with an appropriate hardener, it delivers excellent mechanical, chemical, electrical, and adhesion properties. This product is ideal for use in high solids solvent-free coatings, adhesives, and construction, electrical, & electronics applications. view less | |
| Epokukdo YDF-165 | Kukdo Chemical Co., Ltd. | Epokukdo YDF-165 is a Bisphenol-F type liquid epoxy resin diluted with BGE , which is very low viscosity. YDF-165 has the excellent mechanical, adhesive, electrical, and chemical resistance properties after being cured with appropriate curing agents. Due ...view more Epokukdo YDF-165 is a Bisphenol-F type liquid epoxy resin diluted with BGE , which is very low viscosity. YDF-165 has the excellent mechanical, adhesive, electrical, and chemical resistance properties after being cured with appropriate curing agents. Due to its special properties, YDF-165 is generally used in coatings, moldings, adhesives, construction and civil works, and composite applications for the low VOC or non-solvent system. view less | |
| Epokukdo YDF-162 | Kukdo Chemical Co., Ltd. | Epokukdo YDF-162 is a non-diluted Bisphenol-A/F type liquid Epoxy Resin. YDF-162 is recommended for high solid system or low VOC coating system with excellent mechanical properties and chemical resistance without toxic odor. YDF-162 is generally used in a...view more Epokukdo YDF-162 is a non-diluted Bisphenol-A/F type liquid Epoxy Resin. YDF-162 is recommended for high solid system or low VOC coating system with excellent mechanical properties and chemical resistance without toxic odor. YDF-162 is generally used in anti-corrosive coating, floor coating, crack injection systems, grouts, adhesives, casting, composite application and many high solids or low VOC industrial coatings. view less | |
| Epokukdo YDF-175S | Kukdo Chemical Co., Ltd. | Epokukdo YDF-175S is a liquid type epoxy resin derived from Bisphenol-F and ECH. Especially, it has low viscosity without diluents or modifiers. YDF-175S has excellent mechanical, adhesion, electrical, and chemical resistance properties after being cured ...view more Epokukdo YDF-175S is a liquid type epoxy resin derived from Bisphenol-F and ECH. Especially, it has low viscosity without diluents or modifiers. YDF-175S has excellent mechanical, adhesion, electrical, and chemical resistance properties after being cured with appropriate curing agents. Due to its special properties, YDF-175S is generally used in coatings, moldings, adhesive, construction and civil works, and composite applications for the low VOC or non-solvent system. YDF-170 is a standard Bisphenol-F type liquid resin and YDF-175S is specially designed for non-crystalline type in cold weather. view less | |
| Epokukdo KBPN-110 | Kukdo Chemical Co., Ltd. | Epokukdo KBPN-110 (BPA - Novolac Epoxy) has advantageous characteristics of excellent heat, and chemical resistance, due to its multi-functional groups in a molecule. It also provides higher cross-linked property than general difunctional epoxy resin. KBP...view more Epokukdo KBPN-110 (BPA - Novolac Epoxy) has advantageous characteristics of excellent heat, and chemical resistance, due to its multi-functional groups in a molecule. It also provides higher cross-linked property than general difunctional epoxy resin. KBPN-110 is a small molecular type of KBPN series and is used for the product which requires the characteristics of heat resistance, chemical resistance and low temp erature curability, high Tg for powder coating or laminates. It also has high reactivity so that it is curable at ambient temperature. view less | |
| Epokukdo KBPN-120 | Kukdo Chemical Co., Ltd. | Epokukdo KBPN-120 has advantageous characteristics of excellent heat, and chemical resistance, due to its multi-functional groups in a molecule. It also provides higher cross-linked property than general difunctional Epoxy Resin. KBPN-120 is a small molec...view more Epokukdo KBPN-120 has advantageous characteristics of excellent heat, and chemical resistance, due to its multi-functional groups in a molecule. It also provides higher cross-linked property than general difunctional Epoxy Resin. KBPN-120 is a small molecular type of KBPN series and is used for the product which requires the characteristics of heat resistance, chemical resistance and low temp erature curability, high Tg for Powder Coating or Laminates. It also has high reactivity so that it is curable at ambient temperature. view less | |
| Epokukdo KBPN-115 | Kukdo Chemical Co., Ltd. | Epokukdo KBPN-115 has advantageous characteristics of excellent heat, and chemical resistance, due to its multi-functional groups in a molecule. It also provides higher cross-linked property than general difunctional Epoxy Resin. KBPN-110 is a small molec...view more Epokukdo KBPN-115 has advantageous characteristics of excellent heat, and chemical resistance, due to its multi-functional groups in a molecule. It also provides higher cross-linked property than general difunctional Epoxy Resin. KBPN-110 is a small molecular type of KBPN series and is used for the product which requires the characteristics of heat resistance, chemical resistance and low temp erature curability, high Tg for Powder Coating or Laminates. It also has high reactivity so that it is curable at ambient temperature. view less | |
| Epokukdo YDCN-500-80PCA60 | Kukdo Chemical Co., Ltd. | Epokukdo YDCN-500-80PCA60 is derived from ocresol novolac and has characteristics of high heat and chemical resistance. This is a high molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat res...view more Epokukdo YDCN-500-80PCA60 is derived from ocresol novolac and has characteristics of high heat and chemical resistance. This is a high molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resistant F.R.P. and laminates, coatings for chemical resistance, and so on. YDCN-500-80PCA60 has multi-functional groups in one molecule which are fully cross-linked excellent cured property. It means that high cross-linking density gives the characteristics of excellent adhesion, high heat resistance and excellent chemical resistance. view less | |
| Epokukdo YDCN-500-80PBC60 | Kukdo Chemical Co., Ltd. | Epokukdo YDCN-500-80PBC60 is derived from ocresol novolac and has characteristics of high heat and chemical resistance. This is a high molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat res...view more Epokukdo YDCN-500-80PBC60 is derived from ocresol novolac and has characteristics of high heat and chemical resistance. This is a high molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resistant F.R.P. and laminates, coatings for chemical resistance, and so on. YDCN-500-80PBC60 has multi-functional groups in one molecule which are fully cross-linked and offer excellent physical properties after curing. It means that high cross-linking density gives the characteristics of excellent adhesion, high heat resistance and excellent chemical resistance. view less | |
| Epokukdo YDCN-500-90PA75 | Kukdo Chemical Co., Ltd. | Epokukdo YDCN-500-90PA75 is derived from ocresol novolac and has characteristics of high heat and chemical resistance. This is a high molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resi...view more Epokukdo YDCN-500-90PA75 is derived from ocresol novolac and has characteristics of high heat and chemical resistance. This is a high molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resistant F.R.P. and laminates, coatings for chemical resistance, and so on. YDCN-500-90PA75 has multi-functional groups in one molecule which are fully cross-linked and offer excellent physical properties after curing. It means that high cross-linking density gives the characteristics of excellent adhesion, high heat resistance and excellent chemical resistance. view less | |
| Epokukdo YDCN-500-90P | Kukdo Chemical Co., Ltd. | Epokukdo YDCN-500-90P is derived from o-cresol novolac and has characteristics of high heat and chemical resistance. This is a high molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resist...view more Epokukdo YDCN-500-90P is derived from o-cresol novolac and has characteristics of high heat and chemical resistance. This is a high molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resistant F.R.P. and laminates, coatings for chemical resistance, and so on. YDCN-500-90P has multi-functional groups in one molecule which are fully cross-linked and offer excellent physical properties after curing. It means that high crosslinking density gives the characteristics of excellent adhesion, high heat resistance and excellent chemical resistance. view less | |
| Epokukdo YDCN-500-80P | Kukdo Chemical Co., Ltd. | Epokukdo YDCN-500-80P is derived from o-cresol novolac and has characteristics of high heat and chemical resistance. This is a high molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resist...view more Epokukdo YDCN-500-80P is derived from o-cresol novolac and has characteristics of high heat and chemical resistance. This is a high molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resistant F.R.P. and laminates, coatings for chemical resistance, and so on. YDCN-500-80P has multi-functional groups in one molecule which are fully cross-linked and offer excellent physical properties after curing. It means that high crosslinking density gives the characteristics of excellent adhesion, high heat resistance and excellent chemical resistance. view less | |
| Epokukdo YDCN-500-10P | Kukdo Chemical Co., Ltd. | Epokukdo YDCN-500-10P is derived from o-cresol novolac and has characteristics of high heat and chemical resistance. This is a medium molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resi...view more Epokukdo YDCN-500-10P is derived from o-cresol novolac and has characteristics of high heat and chemical resistance. This is a medium molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resistant F.R.P. and laminates, coatings for chemical resistance, and so on. YDCN-500-10P has multi-functional groups in one molecule which are fully cross-linked and offer excellent physical properties after curing. It means that high crosslinking density gives the characteristics of excellent adhesion, high heat resistance and excellent chemical resistance. view less | |
| Epokukdo YDCN-500-8P | Kukdo Chemical Co., Ltd. | Epokukdo YDCN-500-8P is derived from o-cresol novolac and has characteristics of high heat and chemical resistance. This is a medium molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resis...view more Epokukdo YDCN-500-8P is derived from o-cresol novolac and has characteristics of high heat and chemical resistance. This is a medium molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resistant F.R.P. and laminates, coatings for chemical resistance, and so on. YDCN-500-8P has multi-functional groups in one molecule which are fully cross-linked and offer excellent physical properties after curing. It means that high crosslinking density gives the characteristics of excellent adhesion, high heat resistance and excellent chemical resistance. view less | |
| Epokukdo YDCN-500-7P | Kukdo Chemical Co., Ltd. | Epokukdo YDCN-500-7P is derived from o-cresol novolac and has characteristics of high heat and chemical resistance. This is a medium molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resis...view more Epokukdo YDCN-500-7P is derived from o-cresol novolac and has characteristics of high heat and chemical resistance. This is a medium molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resistant F.R.P. and laminates, coatings for chemical resistance, and so on. YDCN-500-7P has multi-functional groups in one molecule which are fully cross-linked and offer excellent physical properties. It means that high cross-linking density gives the characteristics of excellent adhesion, high heat resistance and excellent chemical resistance view less | |
| Epokukdo YDCN-500-5P | Kukdo Chemical Co., Ltd. | Epokukdo YDCN-500-5P is derived from o-cresol novolac and has characteristics of high heat and chemical resistance. This is a low molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resistan...view more Epokukdo YDCN-500-5P is derived from o-cresol novolac and has characteristics of high heat and chemical resistance. This is a low molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resistant F.R.P. and laminates, coatings for chemical resistance, and so on. YDCN-500-5P has multi-functional groups in one molecule which are fully cross-linked and offer excellent physical properties after curing. It means that high crosslinking density gives the characteristics of excellent adhesion, high heat resistance and excellent chemical resistance. view less | |
| Epokukdo YDCN-500-4P | Kukdo Chemical Co., Ltd. | Epokukdo YDCN-500-4P is derived from o-cresol novolac and has characteristics of high heat and chemical resistance. This is a low molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resistan...view more Epokukdo YDCN-500-4P is derived from o-cresol novolac and has characteristics of high heat and chemical resistance. This is a low molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resistant F.R.P. and laminates, coatings for chemical resistance, and so on. YDCN-500-4P has multi-functional groups in one molecule which are fully cross-linked and offer excellent physical properties after curing. It means that high crosslinking density gives the characteristics of excellent adhesion, high heat resistance and excellent chemical resistance. view less | |
| Epokukdo YDCN-500-1P | Kukdo Chemical Co., Ltd. | Epokukdo YDCN-500-1P is derived from o-cresol novolac and has characteristics of high heat and chemical resistance. This is a low molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resistan...view more Epokukdo YDCN-500-1P is derived from o-cresol novolac and has characteristics of high heat and chemical resistance. This is a low molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resistant F.R.P. and laminates, coatings for chemical resistance, and so on. YDCN-500-1P has multi-functional groups in one molecule which are fully cross-linked and offer excellent physical properties after curing. It means that high crosslinking density gives the characteristics of excellent adhesion, high heat resistance and excellent chemical resistance. view less | |
| Epotec® YDF 173 | Aditya Birla | Epotec® YDF 173 is a higher functional novolac resin featuring improved thermal stability, hardness, mechanical strength, and resistance to various chemicals. This product is ideal for use in adhesives for electronic applications, chemical resistant coati...view more Epotec® YDF 173 is a higher functional novolac resin featuring improved thermal stability, hardness, mechanical strength, and resistance to various chemicals. This product is ideal for use in adhesives for electronic applications, chemical resistant coatings, industrial flooring applications, and laminates. view less | |
| Epotec® YDF 170 | Aditya Birla | Epotec® YDF 170 is a general-purpose, unmodified, low viscosity diglycidyl ether of bisphenol-F which displays good chemical resistance. This product is ideal for use in adhesives for electronic applications, chemical resistance coatings, industrial floor...view more Epotec® YDF 170 is a general-purpose, unmodified, low viscosity diglycidyl ether of bisphenol-F which displays good chemical resistance. This product is ideal for use in adhesives for electronic applications, chemical resistance coatings, industrial flooring applications, and laminates. view less | |
| Epoxies® 20-3236 | Epoxies, Etc. | Epoxies® 20-3236 is a low viscosity, copolymer elastomer made of a modified epoxy resin that is specifically designed for bonding vinyls and neoprenes. It can be used in many difficult bonding applications and has an extended working time with a convenien...view more Epoxies® 20-3236 is a low viscosity, copolymer elastomer made of a modified epoxy resin that is specifically designed for bonding vinyls and neoprenes. It can be used in many difficult bonding applications and has an extended working time with a convenient 2:1 mix ratio. 20-3236 Resin can also be used for the encapsulation of vinyl insulated electrical components or sealing vinyl lead wires. view less | |
| Epoxies® 50-3122 | Epoxies, Etc. | Epoxies® 50-3122 is a one part epoxy adhesive with both high sheer and high peel strength properties. It is also able to maintain exceptionally strong bonds over a wide temperature range of -60 to +205°C. 50-3122 is both a thermally conductive and electri...view more Epoxies® 50-3122 is a one part epoxy adhesive with both high sheer and high peel strength properties. It is also able to maintain exceptionally strong bonds over a wide temperature range of -60 to +205°C. 50-3122 is both a thermally conductive and electrically insulating epoxy adhesive. It is suitable for electronic, electrical, aerospace, appliance, automotive and industrial applications. view less | |
| Epoxies® 50-3150 FR | Epoxies, Etc. | Epoxies® 50-3150 is a flame retardant, thermally conductive epoxy resin that has been formulated to meet the stringent non-burning requirements of UL94 V-0. It is a black epoxy mixed with catalyst 190 and catalyst 30 and offers great heat transfer, low sh...view more Epoxies® 50-3150 is a flame retardant, thermally conductive epoxy resin that has been formulated to meet the stringent non-burning requirements of UL94 V-0. It is a black epoxy mixed with catalyst 190 and catalyst 30 and offers great heat transfer, low shrinkage, and outstanding insulation properties. Primarily used for encapsulating power supplies, transformers, coils, insulators, sensors, etc... Epoxies® 50-3150 FR is an excellent choice for applications requiring high thermal conductivity and flame retardancy. view less | |
| Epoxies® 20-3001 NC | Epoxies, Etc. | Epoxies® 20-3001 NC is a low viscosity, unfilled epoxy potting and encapsulating resin which forms a bubble free glass like finish upon curing. It is either black or clear and dose not contain any solvents. with a 1 to 1 mix ratio and lack of fillers, it ...view more Epoxies® 20-3001 NC is a low viscosity, unfilled epoxy potting and encapsulating resin which forms a bubble free glass like finish upon curing. It is either black or clear and dose not contain any solvents. with a 1 to 1 mix ratio and lack of fillers, it is an ideal material for meter mixes and dispense equipment. view less | |
| Epoxies® 20-3302 | Epoxies, Etc. | Epoxies® 20-3302 is a two part, water clear, optically transparent epoxy potting compound and adhesive. This high purity grade polymer system is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. It provides excel...view more Epoxies® 20-3302 is a two part, water clear, optically transparent epoxy potting compound and adhesive. This high purity grade polymer system is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. It provides excellent optical transmission along with outstanding adhesion and electrical properties. 20-3302 is a low viscosity system designed for L.E.D. encapsulating, fiber optics, and any potting or adhesive application requiring a bubble free and glass smooth finish with optimum clarity. view less | |
| Epoxies® 20-3302NCLV | Epoxies, Etc. | Epoxies® 20-3302NCLV is a two part, water clear, optically transparent epoxy potting compound and adhesive. This high purity grade polymer system is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. It provides e...view more Epoxies® 20-3302NCLV is a two part, water clear, optically transparent epoxy potting compound and adhesive. This high purity grade polymer system is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. It provides excellent optical transmission along with outstanding adhesion and electrical properties. 20-3302NCLV is a very low viscosity system designed for L.E.D. encapsulating, fiber optics, and any potting or adhesive application requiring a bubble free and glass smooth finish with optimum clarity. view less | |
| Epoxies® 40-3905 | Epoxies, Etc. | Epoxies® 40-3905 is an electrically epoxy adhesive and coating system designed for applications requiring low temperature cures. It will cure at room temperature in 18-24 hours and can be accelerated with mild heat. Epoxies® 40-3905 is a solvent free epo...view more Epoxies® 40-3905 is an electrically epoxy adhesive and coating system designed for applications requiring low temperature cures. It will cure at room temperature in 18-24 hours and can be accelerated with mild heat. Epoxies® 40-3905 is a solvent free epoxy filled with pure silver for improved electrical conduction and heat transfer. It has outstanding adhesion to plastics, aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic, and printed circuit boards. 40-3905 can also be thinned with up to 10% Toluol for many coating applications. view less | |
| Epoxies® 20-3068 | Epoxies, Etc. | Epoxies® 20-3068 is a two part epoxy adhesive and potting compound that can cure in room temperatures and has excellent chemical and corrosion resistance. This product provides good water resistance, adhesion, and toughness and is well suited for use with...view more Epoxies® 20-3068 is a two part epoxy adhesive and potting compound that can cure in room temperatures and has excellent chemical and corrosion resistance. This product provides good water resistance, adhesion, and toughness and is well suited for use with most electronics. 20-3068 Epoxy System meets the Food and Drug Administration (FDA) regulations permitting use in “indirect” food contact applications. The raw materials used in the products comply with the FDA regulations of Title 21 Code of Federal Regulations under Sections 175.105 and 175.300. view less | |
| Epoxies® 20-3060 | Epoxies, Etc. | Epoxies® 20-3060 is a low viscosity, general purpose, epoxy potting and encapsulating resin made from 100% solids and dose not contain any solvents. It has exceptional resistance to impact, vibration, and thermal shock. In addition, this versatile resin s...view more Epoxies® 20-3060 is a low viscosity, general purpose, epoxy potting and encapsulating resin made from 100% solids and dose not contain any solvents. It has exceptional resistance to impact, vibration, and thermal shock. In addition, this versatile resin system is machinable and ideal for use with meter mix dispensing equipment. 20-3060 is recommended for applications requiring the optimum in over-all properties and where rigid or flexible wire leads protrude directly from the encapsulation. It also adheres extremely well to lead materials, such as vinyl, neoprene, natural rubber, etc. view less | |
| Epoxies® 40-3909 | Epoxies, Etc. | Epoxies® 40-3909 is a two part epoxy resin adhesive and coating compound, filled with a highly conductive, silver coated nickel. It is designed to provide low volume resistivity of less than 5x10-3 ohm-cm. Silver coated nickel offers a lower cost alternat...view more Epoxies® 40-3909 is a two part epoxy resin adhesive and coating compound, filled with a highly conductive, silver coated nickel. It is designed to provide low volume resistivity of less than 5x10-3 ohm-cm. Silver coated nickel offers a lower cost alternative to many silver filled epoxy systems. 40-3909 has a convenient 1:1 mix ratio by weight and can cure at room temperature overnight but can also be accelerated with mild heat. It is well suited for use in the assembly or repairs of printed circuit boards, connectors, wave guides, high frequency shields, and as a cold solder. view less | |
| Epoxies® 50-3100 | Epoxies, Etc. | Epoxies® 50-3100 is a high thermal K heat transfer epoxy resin designed for fast and continuous heat transfer. Primarily used for the encapsulation of power supplies, transformers, coils, insulators, protective covering for chips, temperature probes, etc....view more Epoxies® 50-3100 is a high thermal K heat transfer epoxy resin designed for fast and continuous heat transfer. Primarily used for the encapsulation of power supplies, transformers, coils, insulators, protective covering for chips, temperature probes, etc. 50-3100 measures several times faster heat dissipation than other commercially available types and can be easily mixed and poured to form a dimensionally stable heat transfer package. view less | |
| Epoxies® 50-3186 NC | Epoxies, Etc. | Epoxies® 50-3186 NC is a two part thermally conductive epoxy adhesive. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50-3186 NC is a perfect choice for applications requiring high thermal conductivity, low thermal e...view more Epoxies® 50-3186 NC is a two part thermally conductive epoxy adhesive. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50-3186 NC is a perfect choice for applications requiring high thermal conductivity, low thermal expansion, and high operating temperature performance. view less | |
| Epoxies® 20-3004 HV | Epoxies, Etc. | Epoxies® 20-3004 HV is a high viscosity, two part, chemical resistant epoxy system that has been developed for potting, coating and adhesive applications requiring superior chemical resistance. It exhibits outstanding bonds to a variety of substrates incl...view more Epoxies® 20-3004 HV is a high viscosity, two part, chemical resistant epoxy system that has been developed for potting, coating and adhesive applications requiring superior chemical resistance. It exhibits outstanding bonds to a variety of substrates including most metals and plastics. 20-3004's high viscosity prevents sagging and is noncorrosive. view less | |
| Epoxies® 50-3151 NC FR | Epoxies, Etc. | Epoxies® 50-3151 NC FR is a low viscosity flame retardant made of a thermally conductive epoxy resin that has been developed to meet the stringent non-burning requirements of UL 94 V-0. This system offers excellent heat transfer, low shrinkage, and outsta...view more Epoxies® 50-3151 NC FR is a low viscosity flame retardant made of a thermally conductive epoxy resin that has been developed to meet the stringent non-burning requirements of UL 94 V-0. This system offers excellent heat transfer, low shrinkage, and outstanding insulation properties. Primarily used in encapsulating power supplies, transformers, coils, insulators, sensors, etc... Epoxies® 50-3151 NC FR is an excellent choice for applications requiring high thermal conductivity, flame retardancy, and low viscosity. view less | |
| Epoxies® 20-3006 | Epoxies, Etc. | Epoxies® 20-3006 is a two part, flexible epoxy potting and encapsulating compound specially formulated to provide electrical insulation, chemical protection and thermal shock resistance. Its flexibility provides low stress on surface mounts and other deli...view more Epoxies® 20-3006 is a two part, flexible epoxy potting and encapsulating compound specially formulated to provide electrical insulation, chemical protection and thermal shock resistance. Its flexibility provides low stress on surface mounts and other delicate electronic components. 20-3006 has an easy one to one mix ratio, and is D.O.T. non-hazardous. view less | |
| Epoxies® 20-3064 NC | Epoxies, Etc. | Epoxies® 20-3064 NC is a filled, flexible epoxy potting compound and adhesive, developed to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio the hardness can be varied from 60 Shore A to 85 Shore D. 20-3...view more Epoxies® 20-3064 NC is a filled, flexible epoxy potting compound and adhesive, developed to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio the hardness can be varied from 60 Shore A to 85 Shore D. 20-3064 NC provides excellent thermal shock resistance and outstanding adhesion. view less | |
| Epoxies® 20-3035 | Epoxies, Etc. | Epoxies® 20-3035 is a low density, to part epoxy potting and encapsulating compound with half the weight of most commercially available potting compounds on the market. it exhibits low shrinkage during the cure process with a low coefficient of thermal ex...view more Epoxies® 20-3035 is a low density, to part epoxy potting and encapsulating compound with half the weight of most commercially available potting compounds on the market. it exhibits low shrinkage during the cure process with a low coefficient of thermal expansion. 20-3035 is an ideal materail for the potting of electron assemblies where a low dielectric constant and low weight are required. view less | |
| Epoxies® 50-3182 NC | Epoxies, Etc. | Epoxies® 50-3182 NC is a highly filled, thermally conductive epoxy resin with excellent physical, electrical and thermal properties. It is formulated for applications where electrical insulation and mechanical protection must be maintained while transferr...view more Epoxies® 50-3182 NC is a highly filled, thermally conductive epoxy resin with excellent physical, electrical and thermal properties. It is formulated for applications where electrical insulation and mechanical protection must be maintained while transferring heat. 50-3182 NC is designed to work with a variety of catalysts to adjust additional properties including toughness, viscosity, thermal and mechanical shock values and cure times. This product is well suited for high voltage applications such as power supplies, transformers, high voltage insulators, bushings, etc... view less | |
| Epoxies® 20-3004 LV | Epoxies, Etc. | Epoxies® 20-3004 LV is a low viscosity, two part, chemical resistant epoxy system that has been developed for potting, coating and adhesive applications requiring superior chemical resistance. It exhibits outstanding bonds to a variety of substrates inclu...view more Epoxies® 20-3004 LV is a low viscosity, two part, chemical resistant epoxy system that has been developed for potting, coating and adhesive applications requiring superior chemical resistance. It exhibits outstanding bonds to a variety of substrates including most metals and plastics. 20-3004's low viscosity lends itself to being a self leveling system and is noncorrosive. view less | |
| Epoxies® 20-3064 NC LV | Epoxies, Etc. | Epoxies® 20-3064 NC LV is a low viscosity, flexible epoxy potting compound and adhesive, developed to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio the hardness can be varied from 60 Shore A to 85 Sho...view more Epoxies® 20-3064 NC LV is a low viscosity, flexible epoxy potting compound and adhesive, developed to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio the hardness can be varied from 60 Shore A to 85 Shore D. 20-3064 NC provides excellent thermal shock resistance and outstanding adhesion. view less | |
| Epoxies® 50-3112 | Epoxies, Etc. | Epoxies® 50-3112 is a two part, fast curing thermally conductive epoxy adhesive. Dark grey in color when mixed, this product a simple 1:1 mix ratio and develops a 1,400 psi Lap Shear strength bond (aluminum to aluminum) in four hours at room temperature ...view more Epoxies® 50-3112 is a two part, fast curing thermally conductive epoxy adhesive. Dark grey in color when mixed, this product a simple 1:1 mix ratio and develops a 1,400 psi Lap Shear strength bond (aluminum to aluminum) in four hours at room temperature and 2,200 psi. just after 20 hours. 50-3112 offers fast heat dissipation for a wide range of electronic applications. The black resin and white hardener provide an excellent visual indication of a complete mix. view less | |
| UV Cure 60-7155 | Epoxies, Etc. | UV Cure 60-7155 is a one part epoxy adhesive and potting compound that cures with low intensity black light or high intensity UV lamps. Displaying good moisture and chemical resistance, along with a deep section cure, this product is ideal for potting and...view more UV Cure 60-7155 is a one part epoxy adhesive and potting compound that cures with low intensity black light or high intensity UV lamps. Displaying good moisture and chemical resistance, along with a deep section cure, this product is ideal for potting and encapsulating applications. view less | |
| Epoxies® 50-3170 | Epoxies, Etc. | Epoxies® 50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure. The resin has a rubber consistency and retains its properties and f...view more Epoxies® 50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure. The resin has a rubber consistency and retains its properties and flexibility on long term aging. This allows pottings and castings to be probed for detection of electrical failure. 50-3170 can be used for bonding sensitive components or for potting of power supplies, coils, glass diodes, and other delicate assemblies. This new formulation can be used successfully for transformers, regulators, PCB's, etc... view less | |
| Epoxies® 20-3300 | Epoxies, Etc. | Epoxies® 20-3300 is a two part, high temperature and thermal shock epoxy formulated to meet the most critical electronic encapsulating requirements. It has low shrinkage, high tensile and compressive strength. 20-3300 has a convenient 1:1 mix ratio with ...view more Epoxies® 20-3300 is a two part, high temperature and thermal shock epoxy formulated to meet the most critical electronic encapsulating requirements. It has low shrinkage, high tensile and compressive strength. 20-3300 has a convenient 1:1 mix ratio with an extended pot life and has excellent adhesion to most substrates and forms a hermetic like seal to protect encapsulated parts. Well suited for high voltage applications. view less | |
| Epoxies® 40-3900 | Epoxies, Etc. | Epoxies® 40-3900 is a two part, silver filled, epoxy resin adhesive that is electrically conductive and has a very low resistance value of less than 1x10-4 ohm-cm. 40-3900 is specifically designed for adhesive bonding in microelectronic and optoelectronic...view more Epoxies® 40-3900 is a two part, silver filled, epoxy resin adhesive that is electrically conductive and has a very low resistance value of less than 1x10-4 ohm-cm. 40-3900 is specifically designed for adhesive bonding in microelectronic and optoelectronic applications. Due to its excellent continuity, it has also been used extensively in applications such as micro-wave EMI and RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connectors, circuitry, and as a cold solder. view less | |
| Epoxies® 50-3152 FR | Epoxies, Etc. | Epoxies® 50-3152 FR is a flame retardant, thermally conductive potting and encapsulating compound that has been formulated to meet the strict non-burning requirements of UL 94-0. It is a two part epoxy that turns black when cured and has excellent shock a...view more Epoxies® 50-3152 FR is a flame retardant, thermally conductive potting and encapsulating compound that has been formulated to meet the strict non-burning requirements of UL 94-0. It is a two part epoxy that turns black when cured and has excellent shock and vibration resistance along with good thermal conductivity. Epoxies® 50-3152 FR is low in viscosity and is designed for ease of use with a convenient 1:1 mix ratio. view less | |
| Epoxies® 40-3911 | Epoxies, Etc. | Epoxies® 40-3911 is an electrically conductive, silver filled, epoxy adhesive that is formulated without solvents and is 100% solids. Because of it is highly filled with silver, it has a very low volume resistance rating of 5 X 10-4 ohm-cm. This one part ...view more Epoxies® 40-3911 is an electrically conductive, silver filled, epoxy adhesive that is formulated without solvents and is 100% solids. Because of it is highly filled with silver, it has a very low volume resistance rating of 5 X 10-4 ohm-cm. This one part system cures quickly at elevated temperatures making it a suitable adhesive for many electronic assembly operations. And it is a good choice for lid sealing and die bonding applications. view less | |
| UV Cure 60-7108 | Epoxies, Etc. | UV Cure 60-7108 is a low viscosity and optically clear UV curable epoxy system designed for fiber optic and other clear adhesive and potting applications. With good electrical insulation properties and moisture resistance, this product is ideal for use in...view more UV Cure 60-7108 is a low viscosity and optically clear UV curable epoxy system designed for fiber optic and other clear adhesive and potting applications. With good electrical insulation properties and moisture resistance, this product is ideal for use in the manufacture of electronic assemblies. Low viscosity makes it suitable for a variety of other coating applications. view less | |
| UV Cure 60-7156 | Epoxies, Etc. | UV Cure 60-7156 is a one part flexible epoxy adhesive and potting compound that can cure in low intensity black light or high intensity UV lamps. Its low durometer (flexibility) provides less stress on sensitive electronic components. This product is wate...view more UV Cure 60-7156 is a one part flexible epoxy adhesive and potting compound that can cure in low intensity black light or high intensity UV lamps. Its low durometer (flexibility) provides less stress on sensitive electronic components. This product is water clear, moisture and chemical resistant, and designed to be used as an adhesive, coating, or encapsulant. view less | |
| Epoxies® 20-2521 | Epoxies, Etc. | Epoxies® 20-2521 is a black, two part, polyurethane potting and encapsulating compound that has very a very low viscosity and is ideal for use with delicate electronic components. It exhibits very low shrinkage, stress, and exotherm throughout the cure cy...view more Epoxies® 20-2521 is a black, two part, polyurethane potting and encapsulating compound that has very a very low viscosity and is ideal for use with delicate electronic components. It exhibits very low shrinkage, stress, and exotherm throughout the cure cycle. Epoxies® 20-2521 is also well known for its outstanding thermal shock and excellent dielectric properties. It is also a good choice when exposure to salt water, mild acids and bases, and aliphatic hydrocarbons is expected. view less | |
| Epoxies® 20-2523 | Epoxies, Etc. | Epoxies® 20-2523 is a black, two part, high performance polyurethane potting and encapsulating compound that has very a very low viscosity and is ideal for use with delicate electronic components. It exhibits very low shrinkage, stress, and exotherm throu...view more Epoxies® 20-2523 is a black, two part, high performance polyurethane potting and encapsulating compound that has very a very low viscosity and is ideal for use with delicate electronic components. It exhibits very low shrinkage, stress, and exotherm throughout the cure cycle. Epoxies® 20-2521 is also well known for its outstanding thermal shock and excellent dielectric properties. It is also a good choice when exposure to salt water, mild acids and bases, and aliphatic hydrocarbons is expected. view less |
