| Epoxies® 20-1634 | Epoxies, Etc. | Epoxies® 20-1634 is a low density, light weight, silicone potting and encapsulating compound. It utilizes an advanced micro balloon technology filler that is ideal for applications which require low weight, flexibility, high heat resistance, and excellent...view more Epoxies® 20-1634 is a low density, light weight, silicone potting and encapsulating compound. It utilizes an advanced micro balloon technology filler that is ideal for applications which require low weight, flexibility, high heat resistance, and excellent electrical insulation properties. 20-1634 is formulated without solvents or other toxic materials. As a result, no by-products are released during the cure process and it is safe to handle. view less | |
| Epoxies® 20-3236 | Epoxies, Etc. | Epoxies® 20-3236 is a low viscosity, copolymer elastomer made of a modified epoxy resin that is specifically designed for bonding vinyls and neoprenes. It can be used in many difficult bonding applications and has an extended working time with a convenien...view more Epoxies® 20-3236 is a low viscosity, copolymer elastomer made of a modified epoxy resin that is specifically designed for bonding vinyls and neoprenes. It can be used in many difficult bonding applications and has an extended working time with a convenient 2:1 mix ratio. 20-3236 Resin can also be used for the encapsulation of vinyl insulated electrical components or sealing vinyl lead wires. view less | |
| Epoxies® 20-3300 | Epoxies, Etc. | Epoxies® 20-3300 is a two part, high temperature and thermal shock epoxy formulated to meet the most critical electronic encapsulating requirements. It has low shrinkage, high tensile and compressive strength. 20-3300 has a convenient 1:1 mix ratio with ...view more Epoxies® 20-3300 is a two part, high temperature and thermal shock epoxy formulated to meet the most critical electronic encapsulating requirements. It has low shrinkage, high tensile and compressive strength. 20-3300 has a convenient 1:1 mix ratio with an extended pot life and has excellent adhesion to most substrates and forms a hermetic like seal to protect encapsulated parts. Well suited for high voltage applications. view less | |
| Epoxies® 20-1710 | Epoxies, Etc. | Epoxies® 20-1710 is a two part, potting and encapsulating clear silicone gel that has a soft and extended curing process. It has excellent electrical properties and their soft cushioning provide vibration and thermal shock protection. It can also provide ...view more Epoxies® 20-1710 is a two part, potting and encapsulating clear silicone gel that has a soft and extended curing process. It has excellent electrical properties and their soft cushioning provide vibration and thermal shock protection. It can also provide protection from moisture, dust and other environmental contaminants. Due to its electrical properties, dielectric strength, and resistivity the 20-1710 can be used to encapsulate electronic components, junction boxes, power modules and LED’s. view less | |
| Epoxies® 20-1715 | Epoxies, Etc. | Epoxies® 20-1715 is a two part, potting and encapsulating clear silicone gel that has a firm and extended curing process. It has excellent electrical properties and their soft cushioning provide vibration and thermal shock protection. It can also provide ...view more Epoxies® 20-1715 is a two part, potting and encapsulating clear silicone gel that has a firm and extended curing process. It has excellent electrical properties and their soft cushioning provide vibration and thermal shock protection. It can also provide protection from moisture, dust and other environmental contaminants. Due to its electrical properties, dielectric strength, and resistivity the 20-1715 can be used to encapsulate electronic components, junction boxes, power modules and LED’s. view less |
