UL Prospector
Prospector

Éxito!

Su búsqueda se ha guardado exitosamente
19 Resultados
Epoxies® 50-3170 Epoxies, Etc. Epoxies® 50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure. The resin has a rubber consistency and retains its properties and f...Vea Mas Epoxies® 50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure. The resin has a rubber consistency and retains its properties and flexibility on long term aging. This allows pottings and castings to be probed for detection of electrical failure. 50-3170 can be used for bonding sensitive components or for potting of power supplies, coils, glass diodes, and other delicate assemblies. This new formulation can be used successfully for transformers, regulators, PCB's, etc... Vea Menos
UV Cure 60-7111 Epoxies, Etc. UV Cure 60-7111 is a non-yellowing, UV curable urethane adhesive and encapsulant featuring high impact strength and flexibility, as well as good water and weather resistance. This product is formulated to provide low stress on electronics and displays goo...Vea Mas UV Cure 60-7111 is a non-yellowing, UV curable urethane adhesive and encapsulant featuring high impact strength and flexibility, as well as good water and weather resistance. This product is formulated to provide low stress on electronics and displays good adhesion to a variety of substances. Vea Menos
Epoxies® 20-1625 Epoxies, Etc. Epoxies® 20-1625 is a two part optically clear silicone potting and encapsulating compound with a low viscosity and easy 1:1 ratio system. 20-1625 is formulated without solvents or other toxic materials and provides good heat resistance and is flame retar...Vea Mas Epoxies® 20-1625 is a two part optically clear silicone potting and encapsulating compound with a low viscosity and easy 1:1 ratio system. 20-1625 is formulated without solvents or other toxic materials and provides good heat resistance and is flame retardant. Vea Menos
UV Cure 60-7114 Epoxies, Etc. UV Cure 60-7114 is a low viscosity urethane adhesive, potting compound, and coating with very good adhesion to metal and plastic substrates. This UV curable resin is formulated to provide excellent water and chemical resistance, making it a good choice fo...Vea Mas UV Cure 60-7114 is a low viscosity urethane adhesive, potting compound, and coating with very good adhesion to metal and plastic substrates. This UV curable resin is formulated to provide excellent water and chemical resistance, making it a good choice for potting electronic assemblies exposed to excessive moisture. Vea Menos
Epoxies® 20-3006 Epoxies, Etc. Epoxies® 20-3006 is a two part, flexible epoxy potting and encapsulating compound specially formulated to provide electrical insulation, chemical protection and thermal shock resistance. Its flexibility provides low stress on surface mounts and other deli...Vea Mas Epoxies® 20-3006 is a two part, flexible epoxy potting and encapsulating compound specially formulated to provide electrical insulation, chemical protection and thermal shock resistance. Its flexibility provides low stress on surface mounts and other delicate electronic components. 20-3006 has an easy one to one mix ratio, and is D.O.T. non-hazardous. Vea Menos
Epoxies® 20-1634 Epoxies, Etc. Epoxies® 20-1634 is a low density, light weight, silicone potting and encapsulating compound. It utilizes an advanced micro balloon technology filler that is ideal for applications which require low weight, flexibility, high heat resistance, and excellent...Vea Mas Epoxies® 20-1634 is a low density, light weight, silicone potting and encapsulating compound. It utilizes an advanced micro balloon technology filler that is ideal for applications which require low weight, flexibility, high heat resistance, and excellent electrical insulation properties. 20-1634 is formulated without solvents or other toxic materials. As a result, no by-products are released during the cure process and it is safe to handle. Vea Menos
Epoxies® 20-2121 Epoxies, Etc. Epoxies® is a clear to amber colored elastomeric potting and encapsulating compound made of polyurethane. Specifically formulated for electronic potting, encapsulating and casting applications, it is a two-component, low viscosity, room temperature curing...Vea Mas Epoxies® is a clear to amber colored elastomeric potting and encapsulating compound made of polyurethane. Specifically formulated for electronic potting, encapsulating and casting applications, it is a two-component, low viscosity, room temperature curing system that does not contain TDI, MbOCA or Mercury. 20-2121 can be used to cushion and protect sensitive electronic components and will impart very little stress on components during cure or thermal cycling. Vea Menos
UV Cure 60-7180 Epoxies, Etc. UV Cure 60-7180 is a one part, UV curable adhesive that is water clear and exhibits great yellowing resistance has been formulated to cure instantly when exposed to high intensity ultraviolet light. This product is ideal for use as an adhesive and coating...Vea Mas UV Cure 60-7180 is a one part, UV curable adhesive that is water clear and exhibits great yellowing resistance has been formulated to cure instantly when exposed to high intensity ultraviolet light. This product is ideal for use as an adhesive and coating on a wide variety of substrates. It can also be used in small potting applications as well as decorative clear doming on labels, pins, key fobs, magnets, etc. Vea Menos
Epoxies® 20-2028 Epoxies, Etc. Epoxies® 20-2028 is a two part, light weight, closed cell, liquid polyurethane foaming resin system designed for potting and encapsulating. It is a water blown rigid foam that does not contain any hydrochlorofluorocarbon (HCFC). And thus, it is also safe...Vea Mas Epoxies® 20-2028 is a two part, light weight, closed cell, liquid polyurethane foaming resin system designed for potting and encapsulating. It is a water blown rigid foam that does not contain any hydrochlorofluorocarbon (HCFC). And thus, it is also safer to use since it does not utilize MOCA or TDI. 20-2028 has been formulated for ease in handling with a convenient 1:1 mix ratio, low viscosity, and short demolding time. Vea Menos
Epoxies® 20-3300 Epoxies, Etc. Epoxies® 20-3300 is a two part, high temperature and thermal shock epoxy formulated to meet the most critical electronic encapsulating requirements. It has low shrinkage, high tensile and compressive strength. 20-3300 has a convenient 1:1 mix ratio with ...Vea Mas Epoxies® 20-3300 is a two part, high temperature and thermal shock epoxy formulated to meet the most critical electronic encapsulating requirements. It has low shrinkage, high tensile and compressive strength. 20-3300 has a convenient 1:1 mix ratio with an extended pot life and has excellent adhesion to most substrates and forms a hermetic like seal to protect encapsulated parts. Well suited for high voltage applications. Vea Menos
Epoxies® 40-3911 Epoxies, Etc. Epoxies® 40-3911 is an electrically conductive, silver filled, epoxy adhesive that is formulated without solvents and is 100% solids. Because of it is highly filled with silver, it has a very low volume resistance rating of 5 X 10-4 ohm-cm. This one part ...Vea Mas Epoxies® 40-3911 is an electrically conductive, silver filled, epoxy adhesive that is formulated without solvents and is 100% solids. Because of it is highly filled with silver, it has a very low volume resistance rating of 5 X 10-4 ohm-cm. This one part system cures quickly at elevated temperatures making it a suitable adhesive for many electronic assembly operations. And it is a good choice for lid sealing and die bonding applications. Vea Menos
Epoxies® 20-2362 FR Epoxies, Etc. Epoxies® 20-2362 FR is a two part, potting and encapsulating compound that has been formulated to meet the stringent non-burning requirements of UL-94 V-0. This system offers a unique combination of properties. 20-2362 is very low in viscosity, flame reta...Vea Mas Epoxies® 20-2362 FR is a two part, potting and encapsulating compound that has been formulated to meet the stringent non-burning requirements of UL-94 V-0. This system offers a unique combination of properties. 20-2362 is very low in viscosity, flame retardant, has a glass transition temperature of -72°C, and has low moisture permeability. This product forms a soft elastomer that will cushion and protect sensitive electronic components. Vea Menos
Epoxies® 50-3152 FR Epoxies, Etc. Epoxies® 50-3152 FR is a flame retardant, thermally conductive potting and encapsulating compound that has been formulated to meet the strict non-burning requirements of UL 94-0. It is a two part epoxy that turns black when cured and has excellent shock a...Vea Mas Epoxies® 50-3152 FR is a flame retardant, thermally conductive potting and encapsulating compound that has been formulated to meet the strict non-burning requirements of UL 94-0. It is a two part epoxy that turns black when cured and has excellent shock and vibration resistance along with good thermal conductivity. Epoxies® 50-3152 FR is low in viscosity and is designed for ease of use with a convenient 1:1 mix ratio. Vea Menos
Epoxies® 20-1640 Epoxies, Etc. Epoxies® 20-1640 is a two part silicone elastomer potting and encapsulating compound that forms a soft and highly flexible electrically insulating package when cured. It can be used for potting or encapsulating electronic packages that have sensitive comp...Vea Mas Epoxies® 20-1640 is a two part silicone elastomer potting and encapsulating compound that forms a soft and highly flexible electrically insulating package when cured. It can be used for potting or encapsulating electronic packages that have sensitive components. Due to its low stress during and after cure, this material will not crush or damage delicate components. 20-1640 is formulated without solvents or other toxic materials. As a result, no by-products released during cure and safe to handle. Vea Menos
Epoxies® 20-1650 Epoxies, Etc. Epoxies® 20-1650 is a two part high temperature silicone potting and encapsulating compound and is formulated with iron oxide to impart increased stability at elevated temperatures. It can be used for potting or encapsulating electronic packages that have...Vea Mas Epoxies® 20-1650 is a two part high temperature silicone potting and encapsulating compound and is formulated with iron oxide to impart increased stability at elevated temperatures. It can be used for potting or encapsulating electronic packages that have sensitive components. This material will not crush or damage delicate components due to its low stress during and after the curing process. 20-1650 is made without solvents or other toxic materials. As a result, no by-products are released during curing process and is safe to handle. Vea Menos
Epoxies® 20-3302 Epoxies, Etc. Epoxies® 20-3302 is a two part, water clear, optically transparent epoxy potting compound and adhesive. This high purity grade polymer system is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. It provides excel...Vea Mas Epoxies® 20-3302 is a two part, water clear, optically transparent epoxy potting compound and adhesive. This high purity grade polymer system is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. It provides excellent optical transmission along with outstanding adhesion and electrical properties. 20-3302 is a low viscosity system designed for L.E.D. encapsulating, fiber optics, and any potting or adhesive application requiring a bubble free and glass smooth finish with optimum clarity. Vea Menos
Epoxies® 20-3302NCLV Epoxies, Etc. Epoxies® 20-3302NCLV is a two part, water clear, optically transparent epoxy potting compound and adhesive. This high purity grade polymer system is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. It provides e...Vea Mas Epoxies® 20-3302NCLV is a two part, water clear, optically transparent epoxy potting compound and adhesive. This high purity grade polymer system is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. It provides excellent optical transmission along with outstanding adhesion and electrical properties. 20-3302NCLV is a very low viscosity system designed for L.E.D. encapsulating, fiber optics, and any potting or adhesive application requiring a bubble free and glass smooth finish with optimum clarity. Vea Menos
Epoxies® 50-3150 FR Epoxies, Etc. Epoxies® 50-3150 is a flame retardant, thermally conductive epoxy resin that has been formulated to meet the stringent non-burning requirements of UL94 V-0. It is a black epoxy mixed with catalyst 190 and catalyst 30 and offers great heat transfer, low sh...Vea Mas Epoxies® 50-3150 is a flame retardant, thermally conductive epoxy resin that has been formulated to meet the stringent non-burning requirements of UL94 V-0. It is a black epoxy mixed with catalyst 190 and catalyst 30 and offers great heat transfer, low shrinkage, and outstanding insulation properties. Primarily used for encapsulating power supplies, transformers, coils, insulators, sensors, etc... Epoxies® 50-3150 FR is an excellent choice for applications requiring high thermal conductivity and flame retardancy. Vea Menos
Epoxies® 50-3182 NC Epoxies, Etc. Epoxies® 50-3182 NC is a highly filled, thermally conductive epoxy resin with excellent physical, electrical and thermal properties. It is formulated for applications where electrical insulation and mechanical protection must be maintained while transferr...Vea Mas Epoxies® 50-3182 NC is a highly filled, thermally conductive epoxy resin with excellent physical, electrical and thermal properties. It is formulated for applications where electrical insulation and mechanical protection must be maintained while transferring heat. 50-3182 NC is designed to work with a variety of catalysts to adjust additional properties including toughness, viscosity, thermal and mechanical shock values and cure times. This product is well suited for high voltage applications such as power supplies, transformers, high voltage insulators, bushings, etc... Vea Menos