Commercial: Active

Africa & Middle East, Asia Pacific, Europe, Latin America, North America

Filler / Reinforcement, Density / Specific Gravity, Density, Mold Shrink, Linear-Flow, Mold Shrink, Linear-Trans, Molding Shrinkage, Water Absorption @ 24 hrs, Water Absorption 24h/23C, Water Absorption Sat/23C, Water Absorption 23C/50RH, Moisture Content, Tensile Modulus, Tensile Modulus, Tensile Strength, Tensile Strength at Yield, Tensile Stress at Yield, Tensile Strength at Break, Tensile Stress at Break, Tensile Stress, Tensile Elongation at Yield, Tensile Elongation at Break, Tensile Strain at Break, Flexural Modulus, Flexural Modulus, Flexural Strength, Flexural Stress, Flexural Strength at Break, Compressive Stress, Poisson's Ratio, Charpy Notched Impact Strength, Charpy Unnotched Impact Strength, Notched Izod Impact, Notched Izod Impact (Area), Notched Izod Impact Strength, Unnotched Izod Impact, Unnotched Izod Impact Strength, Rockwell Hardness, Rockwell Hardness, DTUL (66 psi) - Unannealed, DTUL (0.45 MPa) Unannealed, DTUL (264 psi) - Unannealed, DTUL (1.80 MPa) Unannealed, Continuous Use Temperature, Glass Transition Temperature, Vicat Softening Temperature, Vicat Softening Temperature, Peak Melting Temperature, Melting Temperature (DSC), Melting Temperature, Melting Temperature, Melting Temperature, CLTE, Flow, Coefficient of Linear Thermal Expansion, Flow, Coefficient of Linear Thermal Expansion, Transverse, RTI Elec, RTI Imp, RTI Str, Surface Resistivity, Surface Resistivity, Volume Resistivity, Volume Resistivity, Volume Resistivity, Dielectric Strength, Electric Strength, Dielectric Constant, Dielectric Constant, Relative Permittivity, Dissipation Factor, Dissipation Factor, Dissipation Factor, Arc Resistance, Comparative Tracking Index, Burning Rate, Glow Wire Flammability Index, Glow Wire Ignition Temperature, Oxygen Index, Oxygen Index, Melt Density, Drying Temperature, Drying Time, Suggested Max Moisture, Hopper Temperature, Rear Temperature, Middle Temperature, Front Temperature, Nozzle Temperature, Processing (Melt) Temp, Mold Temperature, Injection Pressure, Back Pressure, Screw Speed, Injection Notes