Prospector

Hysol® EO7039

Generic Family: 环氧; 环氧树脂Supplied by: Henkel AG & Co. KGaA
EO7039 encapsulant is designed for attachment of integrated circuits and components to advanced flexible substrates. This material is formulated to produce a void-free bond line with excellent interfacial adhesive strength to a wide variety of organic substrates and various metal surfaces.
General Properties

Access the complete datasheet details for Hysol® EO7039 when you create your free account with Prospector. You’ll find complete information on physical, mechanical and hardness specs.

Material Status
已商用:当前有效
Documents
description

Technical Datasheet (English)

Download Document
Availability
亚太地区, 北美洲, 拉丁美洲, 欧洲, 非洲和中东
Uses
Encapsulant
Processing Method
包封
Other Properties
特性, 外观, 玻璃转化温度, 线性热膨胀系数,流动, 其他性能, 粘度, 固化时间, 储存稳定性, 贮藏期限
Access 9 properties in Plastics. Create your free account or sign into Prospector.
Processing

Find specific processing information for Hysol® as well as general information for the 环氧; 环氧树脂 generic family. Register or Sign In for more information.

Where To Buy

You can purchase Hysol® EO7039 from 1 distributors or manufacturers. Register or Sign In for more information.

Prospector Sign in / Register
Premium Features
Find UL Yellow Cards
UL Yellow Cards

UL's Yellow Cards are a globally recognized safety and quality guarantee, a certified demonstration of how plastics have met a specific set of performance credentials.

PROSPECTOR

Find solutions, not just materials.

When you join Prospector, you leverage the dynamic tools and features to find solutions fast.

Register Today