Polyaryletherketone (PAEK): LNP™ THERMOCOMP™ Compound
| 製品 | 可用性 | 製品の説明 |
|---|---|---|
| LNP™ THERMOCOMP™ Compound LC003E - Americas | ラテンアメリカ |
LNP THERMOCOMP LC003E compound is based on Polyetheretherketone (PEEK) resin containing 15% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive
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| LNP™ THERMOCOMP™ Compound LC003E - Asia | アジア太平洋地域 |
LNP THERMOCOMP LC003E compound is based on Polyetheretherketone (PEEK) resin containing 15% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive
|
| LNP™ THERMOCOMP™ Compound LC004XXP | アジア太平洋地域 |
LNP THERMOCOMP LC004XXP compound is based on Polyetheretherketone (PEEK) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.
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| LNP™ THERMOCOMP™ Compound LC006 - Americas | ラテンアメリカ |
LNP THERMOCOMP LC006 compound is based on Polyetheretherketone (PEEK) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.
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| LNP™ THERMOCOMP™ Compound LC006 - Europe | 欧州 |
LNP THERMOCOMP LC006 compound is based on Polyetheretherketone (PEEK) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.
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| LNP™ THERMOCOMP™ Compound LC006EX1 | アジア太平洋地域 |
LNP THERMOCOMP LC006EX1 compound is based on Polyetheretherketone (PEEK) resin containing 30% carbon fiber. Added features of this grade include: High Modulus, High impact, Easy Molding, Electrical Conductive.
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| LNP™ THERMOCOMP™ Compound LC006EXQ | アジア太平洋地域 |
LNP THERMOCOMP LC006EXQ compound is based on Polyetheretherketone (PEEK) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding.
|
| LNP™ THERMOCOMP™ Compound LC008E - Americas | ラテンアメリカ |
LNP THERMOCOMP LC008E compound is based on Polyetheretherketone (PEEK) resin containing 40% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive.
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| LNP™ THERMOCOMP™ Compound LC008E - Asia | アジア太平洋地域 |
LNP THERMOCOMP LC008E compound is based on Polyetheretherketone (PEEK) resin containing 40% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive.
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| LNP™ THERMOCOMP™ Compound LC008EXP | アジア太平洋地域 |
LNP THERMOCOMP LC008EXP compound is based on Polyetheretherketone (PEEK) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding.
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| LNP™ THERMOCOMP™ Compound LC008EXQ | アジア太平洋地域 |
LNP THERMOCOMP LC008EXQ compound is based on Polyetheretherketone (PEEK) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding.
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| LNP™ THERMOCOMP™ Compound LC00AEX1 | アジア太平洋地域 |
LNP THERMOCOMP LC00AEX1 compound is based on Polyetheretherketone (PEEK) resin containing 50% carbon fiber. Added features of this grade include: Electrically Conductive, Ultra High Modulus and Strength, Easy Molding, Excellent Wear Resistance and Low CTE.
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| LNP™ THERMOCOMP™ Compound LC00APXQ | アジア太平洋地域 |
LNP THERMOCOMP LC00APXQ compound is based on Polyetheretherketone (PEEK) resin containing 50% carbon fiber. Added features of this grade include: Exceptional Processing, Electrically Conductive.
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| LNP™ THERMOCOMP™ Compound LCF62E - Americas | ラテンアメリカ |
LNP THERMOCOMP LCF62E compound is based on Polyetheretherketone (PEEK) resin containing 10% carbon fiber and 30% glass fiber. Added features of this grade include: Easy Molding, Electrically Conductive.
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| LNP™ THERMOCOMP™ Compound LCF62E - Asia | アジア太平洋地域 |
LNP THERMOCOMP LCF62E compound is based on Polyetheretherketone (PEEK) resin containing 10% carbon fiber and 30% glass fiber. Added features of this grade include: Easy Molding, Electrically Conductive.
|
| LNP™ THERMOCOMP™ Compound LCF62E - Europe | 欧州 |
LNP THERMOCOMP LCF62E compound is based on Polyetheretherketone (PEEK) resin containing 10% carbon fiber and 30% glass fiber. Added features of this grade include: Easy Molding, Electrically Conductive.
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| LNP™ THERMOCOMP™ Compound LF002 - Americas | ラテンアメリカ |
LNP THERMOCOMP LF002 compound is based on Polyetheretherketone (PEEK) resin containing 10% glass fiber.
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| LNP™ THERMOCOMP™ Compound LF002 - Europe | 欧州 |
LNP THERMOCOMP LF002 compound is based on Polyetheretherketone (PEEK) resin containing 10% glass fiber.
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| LNP™ THERMOCOMP™ Compound LF002EXD-WT02005 | アジア太平洋地域 |
LNP THERMOCOMP LF002EXD compound is based on Polyetheretherketone (PEEK) resin containing 10% glass fiber. Added features of this grade include: Custom Color, Easy Molding.
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| LNP™ THERMOCOMP™ Compound LF002XXP-WT02005 | アジア太平洋地域 |
LNP THERMOCOMP LF002XXP-WT02005 compound is based on Polyetheretherketone (PEEK) resin containing 10% glass fiber. Added features of this grade include: Custom Color.
|
| LNP™ THERMOCOMP™ Compound LF003 | アジア太平洋地域 |
LNP THERMOCOMP LF003 compound is based on Polyetheretherketone (PEEK) resin containing 15% glass fiber.
|
| LNP™ THERMOCOMP™ Compound LF004E - Americas | ラテンアメリカ |
LNP THERMOCOMP LF004E compound is based on Polyetheretherketone (PEEK) resin containing 20% glass fiber. Added features of this grade include: Easy Molding.
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| LNP™ THERMOCOMP™ Compound LF004E - Asia | アジア太平洋地域 |
LNP THERMOCOMP LF004E compound is based on Polyetheretherketone (PEEK) resin containing 20% glass fiber. Added features of this grade include: Easy Molding.
|
| LNP™ THERMOCOMP™ Compound LF004E - Europe | 欧州 |
LNP THERMOCOMP LF004E compound is based on Polyetheretherketone (PEEK) resin containing 20% glass fiber. Added features of this grade include: Easy Molding.
|
| LNP™ THERMOCOMP™ Compound LF004EX1 | アジア太平洋地域 |
LNP THERMOCOMP LF004E1 compound is based on Polyetheretherketone (PEEK) resin containing 20% glass fiber. Added features of this grade include: Easy Molding and Low Warpage
|
| LNP™ THERMOCOMP™ Compound LF006 - Americas | ラテンアメリカ |
LNP THERMOCOMP LF006 compound is based on Polyetheretherketone (PEEK) resin containing 30% glass fiber.
|
| LNP™ THERMOCOMP™ Compound LF006 - Asia | アジア太平洋地域 |
LNP THERMOCOMP LF006 compound is based on Polyetheretherketone (PEEK) resin containing 30% glass fiber.
|
| LNP™ THERMOCOMP™ Compound LF006 - Europe | 欧州 |
LNP THERMOCOMP LF006 compound is based on Polyetheretherketone (PEEK) resin containing 30% glass fiber.
|
| LNP™ THERMOCOMP™ Compound LF006E - Americas | ラテンアメリカ |
LNP THERMOCOMP LF006E compound is based on Polyetheretherketone (PEEK) resin containing 30% glass fiber. Added features of this grade include: Easy Molding.
|
| LNP™ THERMOCOMP™ Compound LF006E - Europe | 欧州 |
LNP THERMOCOMP LF006E compound is based on Polyetheretherketone (PEEK) resin containing 30% glass fiber. Added features of this grade include: Easy Molding.
|
| LNP™ THERMOCOMP™ Compound LF006EX1 | アジア太平洋地域 |
LNP THERMOCOMP LF006EX1 compound is based on Polyetheretherketone (PEEK) resin containing 30% glass fiber. Added features of this grade include: Low warpage, Easy Molding.
|
| LNP™ THERMOCOMP™ Compound LF008 - Americas | ラテンアメリカ |
LNP THERMOCOMP LF008 compound is based on Polyetheretherketone (PEEK) resin containing 40% glass fiber. Added features of this grade include: High Modulus and Strength.
|
| LNP™ THERMOCOMP™ Compound LF008 - Asia | アジア太平洋地域 |
LNP THERMOCOMP LF008 compound is based on Polyetheretherketone (PEEK) resin containing 40% glass fiber. Added features of this grade include: High Modulus and Strength.
|
| LNP™ THERMOCOMP™ Compound LF008EX1 | アジア太平洋地域 |
LNP THERMOCOMP LF008EX1 compound is based on Polyetheretherketone (PEEK) resin containing 40% glass fiber. Added features of this grade include: High Modulus and Strength, Easy Molding and Low Warpage.
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| LNP™ THERMOCOMP™ Compound LFW55EX1 | アジア太平洋地域 |
LNP THERMOCOMP LFW55EX1 compound is based on Polyetheretherketone (PEEK) resin containing 25% glass fiber and 25% mineral. Added features of this material include: Easy Molding, Dimensional Stability.
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| LNP™ THERMOCOMP™ Compound LX03447 | アジア太平洋地域 |
LNP THERMOCOMP LX03447 compound is based on Polyetheretherketone (PEEK) resin containing 35% carbon fiber. Added features of this grade include: Electrically Conductive.
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| LNP™ THERMOCOMP™ Compound LX04015 | アジア太平洋地域 |
LNP THERMOCOMP LX04015 compound is based on Polyetheretherketone (PEEK) resin containing 15% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding.
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| LNP™ THERMOCOMP™ Compound LX08411 | アジア太平洋地域 |
LNP THERMOCOMP LX08411 compound is based on Polyetheretherketone (PEEK) resin containing 45% carbon fiber. Added features of this grade include: Electrically Conductive, High Modulus, Easy Molding.
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| LNP™ THERMOCOMP™ Compound LX09404 | アジア太平洋地域 |
LNP THERMOCOMP LX09404 compound is based on Polyetheretherketone (PEEK) resin containing 45% carbon fiber. Added features of this grade include: Electrically Conductive, High Modulus
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| LNP™ THERMOCOMP™ Compound LX97024 | アジア太平洋地域 |
LNP THERMOCOMP LX97024 compound is based on Polyetheretherketone (PEEK) resin containing 15% glass fiber, 5% PTFE. Added features of this grade include: Internally Lubricated, Easy Molding.
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