Thermoplastic Elastomer (TPE) by EMPILON
製品 | 可用性 | 製品の説明 |
---|---|---|
EMPILON® HA272 | アジア太平洋地域 |
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.
|
EMPILON® HA359 | アジア太平洋地域 | |
EMPILON® HA40 | アジア太平洋地域 |
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.
|
EMPILON® HA50 | アジア太平洋地域 |
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.
|
EMPILON® HA60 | アジア太平洋地域 |
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.
|
EMPILON® HA70 | アジア太平洋地域 |
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.
|
EMPILON® HA80 | アジア太平洋地域 |
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.
|
EMPILON® HB60 | アジア太平洋地域 |
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.
|
EMPILON® HP65 | アジア太平洋地域 |
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.
|