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SKYBOND® 2601

通用系列: 聚酰亚胺,芳香族提供方: Industrial Summit Technology Co.
The Skybond® product line encompasses a number of products usable as matrix resins for manufacture of high thermal stability structural composites. Composites based on the Skybond® family of resins have continuous use temperatures in excess of 600° F with short term capability greater than 1000° F. Prepreg has been successfully manufactured from all common high performance substrates, such as, E-glass, high modulus carbon, and quartz. Two new classes of matrix resins have been developed in the Skybond® family. The first can be processed by RTM molding techniques to bring the outstanding thermal resistance of polyimide resins to RTM molded composites. The second new class of Skybond® matrix resins is the two-stage cure resins that when used in prepreg applications allow the manufacture of very low void level composites by autoclave processing (<0.5% voids) combined with excellent thermal stability of polyimide resins.
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description

Technical Datasheet (English)

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可用性
北美洲
用途
混料
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加工

Find specific processing information for SKYBOND® PI as well as general information for the 聚酰亚胺,芳香族 generic family. 注册 登录 了解更多信息。

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