| Torlon® AI-10 | Solvay Specialty Polymers | Torlon® AI-10 is a polyamideimide (PAI) powder developed for the performance coatings industry. As a liquid polymer solution, the resin is incorporated into the formulation of engineered coatings; often as the principal primer, binder or high temperature ...view more Torlon® AI-10 is a polyamideimide (PAI) powder developed for the performance coatings industry. As a liquid polymer solution, the resin is incorporated into the formulation of engineered coatings; often as the principal primer, binder or high temperature adhesive component. As a powder, the resin is used in specialty composites and unique dry spray applications. view less | |
| GR-100F | Techneglas | GR-100F is an odorless, translucent flake of thermosetting polysiloxane resin, soluble in polar and aromatic solvents such as: alcohols (isopropanol, N-propanol, butanol and diacetone alcohol), ketones and the glycol ethers and their acetates. It is nonflammable and exhibits good chemical resistance and dielectric strength, making it useful for a binder...view more GR-100F is an odorless, translucent flake of thermosetting polysiloxane resin, soluble in polar and aromatic solvents such as: alcohols (isopropanol, N-propanol, butanol and diacetone alcohol), ketones and the glycol ethers and their acetates. It is nonflammable and exhibits good chemical resistance and dielectric strength, making it useful for a binder in flame-proof, filled coatings and microelectronic and fiber optic coatings. view less | |
| GR-650F | Techneglas | GR-650F is an odorless, translucent flake of thermosetting polysiloxane resin, soluble in polar solvents such as: alcohols (isopropanol, N-propanol, butanol and diacetone alcohol), ketones and the glycol ethers and their acetates. It is suitable for use as a binder...view more GR-650F is an odorless, translucent flake of thermosetting polysiloxane resin, soluble in polar solvents such as: alcohols (isopropanol, N-propanol, butanol and diacetone alcohol), ketones and the glycol ethers and their acetates. It is suitable for use as a binder for flame-proof, filled coatings and microelectronic and fiber optic coatings; optically clear, abrasion resistant coatings for lenses and applications requiring a thermal operating temperature from 250 °C to 300 °C (482 °F to 572 °F). view less | |
| GR-150F | Techneglas | GR-150F is an odorless, translucent flake of thermosetting polysiloxane resin, soluble in polar and aromatic solvents such as: alcohols (isopropanol, N-propanol, butanol and diacetone alcohol), ketones and the glycol ethers and their acetates. it can be used as a binder...view more GR-150F is an odorless, translucent flake of thermosetting polysiloxane resin, soluble in polar and aromatic solvents such as: alcohols (isopropanol, N-propanol, butanol and diacetone alcohol), ketones and the glycol ethers and their acetates. it can be used as a binder for filled and clear top coats which call for service temperatures between 200 °C and 300 °C (392 °F to 572 °F). It also exhibits good chemical resistance and dielectric strength, for applications as a coating for microelectronic components. view less | |
| Epoxies® 20-1615 | Epoxies, Etc. | Epoxies® 20-1615 is a clear, orderless, two part silicone rubber compound that is low in viscosity and cures in room temperature. Primarily used for potting electronic assemblies that require shock and vibration resistance, it can also protect assemblies ...view more Epoxies® 20-1615 is a clear, orderless, two part silicone rubber compound that is low in viscosity and cures in room temperature. Primarily used for potting electronic assemblies that require shock and vibration resistance, it can also protect assemblies from moisture, ozone, chemicals and other environmental hazards. view less | |
| Epoxies® 20-1625 | Epoxies, Etc. | Epoxies® 20-1625 is a two part optically clear silicone potting and encapsulating compound with a low viscosity and easy 1:1 ratio system. 20-1625 is formulated without solvents or other toxic materials and provides good heat resistance and is flame retar...view more Epoxies® 20-1625 is a two part optically clear silicone potting and encapsulating compound with a low viscosity and easy 1:1 ratio system. 20-1625 is formulated without solvents or other toxic materials and provides good heat resistance and is flame retardant. view less | |
| Epoxies® 20-1634 | Epoxies, Etc. | Epoxies® 20-1634 is a low density, light weight, silicone potting and encapsulating compound. It utilizes an advanced micro balloon technology filler that is ideal for applications which require low weight, flexibility, high heat resistance, and excellent...view more Epoxies® 20-1634 is a low density, light weight, silicone potting and encapsulating compound. It utilizes an advanced micro balloon technology filler that is ideal for applications which require low weight, flexibility, high heat resistance, and excellent electrical insulation properties. 20-1634 is formulated without solvents or other toxic materials. As a result, no by-products are released during the cure process and it is safe to handle. view less | |
| Epoxies® 20-1640 | Epoxies, Etc. | Epoxies® 20-1640 is a two part silicone elastomer potting and encapsulating compound that forms a soft and highly flexible electrically insulating package when cured. It can be used for potting or encapsulating electronic packages that have sensitive comp...view more Epoxies® 20-1640 is a two part silicone elastomer potting and encapsulating compound that forms a soft and highly flexible electrically insulating package when cured. It can be used for potting or encapsulating electronic packages that have sensitive components. Due to its low stress during and after cure, this material will not crush or damage delicate components. 20-1640 is formulated without solvents or other toxic materials. As a result, no by-products released during cure and safe to handle. view less | |
| Epoxies® 20-1650 | Epoxies, Etc. | Epoxies® 20-1650 is a two part high temperature silicone potting and encapsulating compound and is formulated with iron oxide to impart increased stability at elevated temperatures. It can be used for potting or encapsulating electronic packages that have...view more Epoxies® 20-1650 is a two part high temperature silicone potting and encapsulating compound and is formulated with iron oxide to impart increased stability at elevated temperatures. It can be used for potting or encapsulating electronic packages that have sensitive components. This material will not crush or damage delicate components due to its low stress during and after the curing process. 20-1650 is made without solvents or other toxic materials. As a result, no by-products are released during curing process and is safe to handle. view less | |
| Epoxies® 20-1700 | Epoxies, Etc. | Epoxies® 20-1700 is a two part, potting and encapsulating clear silicone gel that has a soft and fast cure process. It has excellent electrical properties and their soft cushioning provide vibration and thermal shock protection. It can also provide protec...view more Epoxies® 20-1700 is a two part, potting and encapsulating clear silicone gel that has a soft and fast cure process. It has excellent electrical properties and their soft cushioning provide vibration and thermal shock protection. It can also provide protection from moisture, dust and other environmental contaminants. Due to its electrical properties, dielectric strength, and resistivity the 20-1700 can be used to encapsulate electronic components, junction boxes, power modules and LED’s. view less | |
| Epoxies® 20-1705 | Epoxies, Etc. | Epoxies® 20-1705 is a two part, potting and encapsulating clear silicone gel that has a firm and fast curing process. It has excellent electrical properties and their soft cushioning provide vibration and thermal shock protection. It can also provide prot...view more Epoxies® 20-1705 is a two part, potting and encapsulating clear silicone gel that has a firm and fast curing process. It has excellent electrical properties and their soft cushioning provide vibration and thermal shock protection. It can also provide protection from moisture, dust and other environmental contaminants. Due to its electrical properties, dielectric strength, and resistivity the 20-1705 can be used to encapsulate electronic components, junction boxes, power modules and LED’s. view less | |
| Epoxies® 20-1710 | Epoxies, Etc. | Epoxies® 20-1710 is a two part, potting and encapsulating clear silicone gel that has a soft and extended curing process. It has excellent electrical properties and their soft cushioning provide vibration and thermal shock protection. It can also provide ...view more Epoxies® 20-1710 is a two part, potting and encapsulating clear silicone gel that has a soft and extended curing process. It has excellent electrical properties and their soft cushioning provide vibration and thermal shock protection. It can also provide protection from moisture, dust and other environmental contaminants. Due to its electrical properties, dielectric strength, and resistivity the 20-1710 can be used to encapsulate electronic components, junction boxes, power modules and LED’s. view less | |
| Epoxies® 20-1715 | Epoxies, Etc. | Epoxies® 20-1715 is a two part, potting and encapsulating clear silicone gel that has a firm and extended curing process. It has excellent electrical properties and their soft cushioning provide vibration and thermal shock protection. It can also provide ...view more Epoxies® 20-1715 is a two part, potting and encapsulating clear silicone gel that has a firm and extended curing process. It has excellent electrical properties and their soft cushioning provide vibration and thermal shock protection. It can also provide protection from moisture, dust and other environmental contaminants. Due to its electrical properties, dielectric strength, and resistivity the 20-1715 can be used to encapsulate electronic components, junction boxes, power modules and LED’s. view less | |
| Epoxies® 20-2028 | Epoxies, Etc. | Epoxies® 20-2028 is a two part, light weight, closed cell, liquid polyurethane foaming resin system designed for potting and encapsulating. It is a water blown rigid foam that does not contain any hydrochlorofluorocarbon (HCFC). And thus, it is also safe...view more Epoxies® 20-2028 is a two part, light weight, closed cell, liquid polyurethane foaming resin system designed for potting and encapsulating. It is a water blown rigid foam that does not contain any hydrochlorofluorocarbon (HCFC). And thus, it is also safer to use since it does not utilize MOCA or TDI. 20-2028 has been formulated for ease in handling with a convenient 1:1 mix ratio, low viscosity, and short demolding time. view less | |
| Epoxies® 20-2101 | Epoxies, Etc. | Epoxies® 20-2101 is a clear two part polyurethane potting and encapsulating resin engineered for use in electronics and casting purposes. It is low in viscosity, low in toxicity and is suitable for a variety of electronic insulating applications. It is ma...view more Epoxies® 20-2101 is a clear two part polyurethane potting and encapsulating resin engineered for use in electronics and casting purposes. It is low in viscosity, low in toxicity and is suitable for a variety of electronic insulating applications. It is made from Natural Oil Polyol (NOP) obtained directly from a plant source without chemical modifications. Using renewable resources, such as NOP’s, will reduce the demand on non-renewable fossil fuels and reduce the overall production of carbon dioxide. view less | |
| Epoxies® 20-2160 | Epoxies, Etc. | Epoxies® 20-2160 is a black two part polyurethane potting and encapsulating resin engineered for use in electronics and casting purposes. It is low in viscosity, low in toxicity and is suitable for a variety of electronic insulating applications. It is ma...view more Epoxies® 20-2160 is a black two part polyurethane potting and encapsulating resin engineered for use in electronics and casting purposes. It is low in viscosity, low in toxicity and is suitable for a variety of electronic insulating applications. It is made from Natural Oil Polyol (NOP) obtained directly from a plant source without chemical modifications. Using renewable resources, such as NOP’s, will reduce the demand on non-renewable fossil fuels and reduce the overall production of carbon dioxide. view less | |
| Epoxies® 20-2180 | Epoxies, Etc. | Epoxies® 20-2180 is a black two part polyurethane potting and encapsulating resin engineered for use in electronics and casting purposes. It is low in viscosity, low in toxicity and is suitable for a variety of electronic insulating applications. It is ma...view more Epoxies® 20-2180 is a black two part polyurethane potting and encapsulating resin engineered for use in electronics and casting purposes. It is low in viscosity, low in toxicity and is suitable for a variety of electronic insulating applications. It is made from Natural Oil Polyol (NOP) obtained directly from a plant source without chemical modifications. Using renewable resources, such as NOP’s, will reduce the demand on non-renewable fossil fuels and reduce the overall production of carbon dioxide. view less | |
| Epoxies® 20-2121 | Epoxies, Etc. | Epoxies® is a clear to amber colored elastomeric potting and encapsulating compound made of polyurethane. Specifically formulated for electronic potting, encapsulating and casting applications, it is a two-component, low viscosity, room temperature curing...view more Epoxies® is a clear to amber colored elastomeric potting and encapsulating compound made of polyurethane. Specifically formulated for electronic potting, encapsulating and casting applications, it is a two-component, low viscosity, room temperature curing system that does not contain TDI, MbOCA or Mercury. 20-2121 can be used to cushion and protect sensitive electronic components and will impart very little stress on components during cure or thermal cycling. view less | |
| Epoxies® 20-2330 | Epoxies, Etc. | Epoxies® 20-2330 is a black, two part unfilled low durometer urethane elastomer used in potting, casting, and encapsulating. It is engineered to provide excellent hydrolytic stability and low moisture permeability. As well as outstanding thermal cycling p...view more Epoxies® 20-2330 is a black, two part unfilled low durometer urethane elastomer used in potting, casting, and encapsulating. It is engineered to provide excellent hydrolytic stability and low moisture permeability. As well as outstanding thermal cycling properties, low glass transition temperatures and low embedment stress to sensitive electronic components. Epoxies® 20-2330 can maintain its integrity over a wide operating temperature range. With a low glass transition temperature of approximately -70°C makes these urethanes ideal for low temperature potting applications. view less | |
| Epoxies® 20-2345 | Epoxies, Etc. | Epoxies® 20-2345 is a black, two part unfilled low durometer urethane elastomer used in potting, casting, and encapsulating. It is engineered to provide excellent hydrolytic stability and low moisture permeability. As well as outstanding thermal cycling p...view more Epoxies® 20-2345 is a black, two part unfilled low durometer urethane elastomer used in potting, casting, and encapsulating. It is engineered to provide excellent hydrolytic stability and low moisture permeability. As well as outstanding thermal cycling properties, low glass transition temperatures and low embedment stress to sensitive electronic components. Epoxies® 20-2345 can maintain its integrity over a wide operating temperature range. With a low glass transition temperature of approximately -70°C makes these urethanes ideal for low temperature potting applications. view less | |
| Epoxies® 20-2370 | Epoxies, Etc. | Epoxies® 20-2370 is a black, two part unfilled low durometer urethane elastomer used in potting, casting, and encapsulating. It is engineered to provide excellent hydrolytic stability and low moisture permeability. As well as outstanding thermal cycling p...view more Epoxies® 20-2370 is a black, two part unfilled low durometer urethane elastomer used in potting, casting, and encapsulating. It is engineered to provide excellent hydrolytic stability and low moisture permeability. As well as outstanding thermal cycling properties, low glass transition temperatures and low embedment stress to sensitive electronic components. Epoxies® 20-2370 can maintain its integrity over a wide operating temperature range. With a low glass transition temperature of approximately -70°C makes these urethanes ideal for low temperature potting applications. view less | |
| Epoxies® 20-2390 | Epoxies, Etc. | Epoxies® 20-2390 is a black, two part unfilled low durometer urethane elastomer used in potting, casting, and encapsulating. It is engineered to provide excellent hydrolytic stability and low moisture permeability. As well as outstanding thermal cycling p...view more Epoxies® 20-2390 is a black, two part unfilled low durometer urethane elastomer used in potting, casting, and encapsulating. It is engineered to provide excellent hydrolytic stability and low moisture permeability. As well as outstanding thermal cycling properties, low glass transition temperatures and low embedment stress to sensitive electronic components. Epoxies® 20-2390 can maintain its integrity over a wide operating temperature range. With a low glass transition temperature of approximately -70°C makes these urethanes ideal for low temperature potting applications. view less | |
| Epoxies® 20-2521 | Epoxies, Etc. | Epoxies® 20-2521 is a black, two part, polyurethane potting and encapsulating compound that has very a very low viscosity and is ideal for use with delicate electronic components. It exhibits very low shrinkage, stress, and exotherm throughout the cure cy...view more Epoxies® 20-2521 is a black, two part, polyurethane potting and encapsulating compound that has very a very low viscosity and is ideal for use with delicate electronic components. It exhibits very low shrinkage, stress, and exotherm throughout the cure cycle. Epoxies® 20-2521 is also well known for its outstanding thermal shock and excellent dielectric properties. It is also a good choice when exposure to salt water, mild acids and bases, and aliphatic hydrocarbons is expected. view less | |
| Epoxies® 20-2523 | Epoxies, Etc. | Epoxies® 20-2523 is a black, two part, high performance polyurethane potting and encapsulating compound that has very a very low viscosity and is ideal for use with delicate electronic components. It exhibits very low shrinkage, stress, and exotherm throu...view more Epoxies® 20-2523 is a black, two part, high performance polyurethane potting and encapsulating compound that has very a very low viscosity and is ideal for use with delicate electronic components. It exhibits very low shrinkage, stress, and exotherm throughout the cure cycle. Epoxies® 20-2521 is also well known for its outstanding thermal shock and excellent dielectric properties. It is also a good choice when exposure to salt water, mild acids and bases, and aliphatic hydrocarbons is expected. view less | |
| Epoxies® 20-2621 | Epoxies, Etc. | Epoxies® 20-2621 is a crystal clear, two part, polyurethane potting and encapsulating compound designed for applications requiring "water like" clarity. This product curse at room temperature and will not yellow over time wile providing excellent environm...view more Epoxies® 20-2621 is a crystal clear, two part, polyurethane potting and encapsulating compound designed for applications requiring "water like" clarity. This product curse at room temperature and will not yellow over time wile providing excellent environmental protection. 20-2621 is semi-flexible and will not place excess stress on electronic components. It also has a low viscosity, which facilitates easy flow and penetration into difficult areas. view less | |
| Epoxies® 20-3001 NC | Epoxies, Etc. | Epoxies® 20-3001 NC is a low viscosity, unfilled epoxy potting and encapsulating resin which forms a bubble free glass like finish upon curing. It is either black or clear and dose not contain any solvents. with a 1 to 1 mix ratio and lack of fillers, it ...view more Epoxies® 20-3001 NC is a low viscosity, unfilled epoxy potting and encapsulating resin which forms a bubble free glass like finish upon curing. It is either black or clear and dose not contain any solvents. with a 1 to 1 mix ratio and lack of fillers, it is an ideal material for meter mixes and dispense equipment. view less | |
| Epoxies® 20-3006 | Epoxies, Etc. | Epoxies® 20-3006 is a two part, flexible epoxy potting and encapsulating compound specially formulated to provide electrical insulation, chemical protection and thermal shock resistance. Its flexibility provides low stress on surface mounts and other deli...view more Epoxies® 20-3006 is a two part, flexible epoxy potting and encapsulating compound specially formulated to provide electrical insulation, chemical protection and thermal shock resistance. Its flexibility provides low stress on surface mounts and other delicate electronic components. 20-3006 has an easy one to one mix ratio, and is D.O.T. non-hazardous. view less | |
| Epoxies® 20-3035 | Epoxies, Etc. | Epoxies® 20-3035 is a low density, to part epoxy potting and encapsulating compound with half the weight of most commercially available potting compounds on the market. it exhibits low shrinkage during the cure process with a low coefficient of thermal ex...view more Epoxies® 20-3035 is a low density, to part epoxy potting and encapsulating compound with half the weight of most commercially available potting compounds on the market. it exhibits low shrinkage during the cure process with a low coefficient of thermal expansion. 20-3035 is an ideal materail for the potting of electron assemblies where a low dielectric constant and low weight are required. view less | |
| Epoxies® 20-3060 | Epoxies, Etc. | Epoxies® 20-3060 is a low viscosity, general purpose, epoxy potting and encapsulating resin made from 100% solids and dose not contain any solvents. It has exceptional resistance to impact, vibration, and thermal shock. In addition, this versatile resin s...view more Epoxies® 20-3060 is a low viscosity, general purpose, epoxy potting and encapsulating resin made from 100% solids and dose not contain any solvents. It has exceptional resistance to impact, vibration, and thermal shock. In addition, this versatile resin system is machinable and ideal for use with meter mix dispensing equipment. 20-3060 is recommended for applications requiring the optimum in over-all properties and where rigid or flexible wire leads protrude directly from the encapsulation. It also adheres extremely well to lead materials, such as vinyl, neoprene, natural rubber, etc. view less | |
| Epoxies® 20-3300 | Epoxies, Etc. | Epoxies® 20-3300 is a two part, high temperature and thermal shock epoxy formulated to meet the most critical electronic encapsulating requirements. It has low shrinkage, high tensile and compressive strength. 20-3300 has a convenient 1:1 mix ratio with ...view more Epoxies® 20-3300 is a two part, high temperature and thermal shock epoxy formulated to meet the most critical electronic encapsulating requirements. It has low shrinkage, high tensile and compressive strength. 20-3300 has a convenient 1:1 mix ratio with an extended pot life and has excellent adhesion to most substrates and forms a hermetic like seal to protect encapsulated parts. Well suited for high voltage applications. view less | |
| Epoxies® 50-3100 | Epoxies, Etc. | Epoxies® 50-3100 is a high thermal K heat transfer epoxy resin designed for fast and continuous heat transfer. Primarily used for the encapsulation of power supplies, transformers, coils, insulators, protective covering for chips, temperature probes, etc....view more Epoxies® 50-3100 is a high thermal K heat transfer epoxy resin designed for fast and continuous heat transfer. Primarily used for the encapsulation of power supplies, transformers, coils, insulators, protective covering for chips, temperature probes, etc. 50-3100 measures several times faster heat dissipation than other commercially available types and can be easily mixed and poured to form a dimensionally stable heat transfer package. view less | |
| Epoxies® 50-3170 | Epoxies, Etc. | Epoxies® 50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure. The resin has a rubber consistency and retains its properties and f...view more Epoxies® 50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure. The resin has a rubber consistency and retains its properties and flexibility on long term aging. This allows pottings and castings to be probed for detection of electrical failure. 50-3170 can be used for bonding sensitive components or for potting of power supplies, coils, glass diodes, and other delicate assemblies. This new formulation can be used successfully for transformers, regulators, PCB's, etc... view less | |
| Epoxies® 50-3182 NC | Epoxies, Etc. | Epoxies® 50-3182 NC is a highly filled, thermally conductive epoxy resin with excellent physical, electrical and thermal properties. It is formulated for applications where electrical insulation and mechanical protection must be maintained while transferr...view more Epoxies® 50-3182 NC is a highly filled, thermally conductive epoxy resin with excellent physical, electrical and thermal properties. It is formulated for applications where electrical insulation and mechanical protection must be maintained while transferring heat. 50-3182 NC is designed to work with a variety of catalysts to adjust additional properties including toughness, viscosity, thermal and mechanical shock values and cure times. This product is well suited for high voltage applications such as power supplies, transformers, high voltage insulators, bushings, etc... view less | |
| Epoxies® 50-3185 NC | Epoxies, Etc. | Epoxies® 50-3185 NC is a filled, thermally conductive potting and encapsulating resin with excellent physical, electrical and thermal properties. It is well suited for applications where low thermal expansion, outstanding electrical insulation and/or high...view more Epoxies® 50-3185 NC is a filled, thermally conductive potting and encapsulating resin with excellent physical, electrical and thermal properties. It is well suited for applications where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required. 50-3185 NC is designed to work with a variety of catalysts to adjust additional properties including toughness, viscosity, thermal and mechanical shock values and cure times. This product is well suited for high voltage applications such as power supplies, transformers, high voltage insulators, bushings, etc... view less | |
| UV Cure 60-7159 | Epoxies, Etc. | UV Cure 60-7159 is a low viscosity conformal coating for Printed Circuit Boards (PCB’s), components and various substrates. When exposed to long wave UV it forms a tough, clear and flexible coating. UV Cure 60-7159 resists yellowing, vibration and impact....view more UV Cure 60-7159 is a low viscosity conformal coating for Printed Circuit Boards (PCB’s), components and various substrates. When exposed to long wave UV it forms a tough, clear and flexible coating. UV Cure 60-7159 resists yellowing, vibration and impact. UV Cure 7159 does not contain any solvents and forms a smooth, non-sticky surface. view less | |
| Epoxies® 20-2362 FR | Epoxies, Etc. | Epoxies® 20-2362 FR is a two part, potting and encapsulating compound that has been formulated to meet the stringent non-burning requirements of UL-94 V-0. This system offers a unique combination of properties. 20-2362 is very low in viscosity, flame reta...view more Epoxies® 20-2362 FR is a two part, potting and encapsulating compound that has been formulated to meet the stringent non-burning requirements of UL-94 V-0. This system offers a unique combination of properties. 20-2362 is very low in viscosity, flame retardant, has a glass transition temperature of -72°C, and has low moisture permeability. This product forms a soft elastomer that will cushion and protect sensitive electronic components. view less | |
| CHS-Epoxy 301 | Spolchemie | CHS-Epoxy 301 is a medium molecular weighted, semi-solid epoxy resin based on BPA. This product is primarily used for hot casting applications in several different areas of industry; this is including the electrical industry. It is also used in solvent bo...view more CHS-Epoxy 301 is a medium molecular weighted, semi-solid epoxy resin based on BPA. This product is primarily used for hot casting applications in several different areas of industry; this is including the electrical industry. It is also used in solvent borne coatings. view less | |
| CHS-Epoxy 510 | Spolchemie | CHS-Epoxy 510 is a universal low molecular weight epoxy resin based on BPA. This product is a non-modified liquid with a very low crystallization tendency. CHS-Epoxy 510 can be cured at two different levels of ambient or elevated. The primary use for this...view more CHS-Epoxy 510 is a universal low molecular weight epoxy resin based on BPA. This product is a non-modified liquid with a very low crystallization tendency. CHS-Epoxy 510 can be cured at two different levels of ambient or elevated. The primary use for this product is to modify, impregnate, encapsulate and potting operations. view less | |
| CHS-Epoxy 520 | Spolchemie | CHS-Epoxy 520 is a universal low molecular weight epoxy resin based on BPA. This product is a resin that has no modifiers and can cure at two different levels at either an elevated or ambient temperature. CHS-Epoxy 520 is primarily used for modifying, sat...view more CHS-Epoxy 520 is a universal low molecular weight epoxy resin based on BPA. This product is a resin that has no modifiers and can cure at two different levels at either an elevated or ambient temperature. CHS-Epoxy 520 is primarily used for modifying, saturating, condensing and preserving operations in different areas of industry. view less | |
| CHS-Epoxy 525 | Spolchemie | CHS-Epoxy 525 is a universal low molecular weight epoxy resin based on BPA. This product contains no modifications and is able to dry at two different levels at either an elevated or ambient temperature. CHS-Epoxy 525 is primarily used for modifying, satu...view more CHS-Epoxy 525 is a universal low molecular weight epoxy resin based on BPA. This product contains no modifications and is able to dry at two different levels at either an elevated or ambient temperature. CHS-Epoxy 525 is primarily used for modifying, saturating, condensing and preserving operations in different areas of industry. view less | |
| CHS-Epoxy 525 LA | Spolchemie | CHS-Epoxy 525 LA is a universal low molecular weight epoxy resin based on BPA with lower alpha glycol content. This product contains no modifications and is able to dry at two different levels at either an elevated or ambient temperature. CHS-Epoxy 525 LA...view more CHS-Epoxy 525 LA is a universal low molecular weight epoxy resin based on BPA with lower alpha glycol content. This product contains no modifications and is able to dry at two different levels at either an elevated or ambient temperature. CHS-Epoxy 525 LA is primarily used for modifying, saturating, condensing and preserving operations in different areas of industry. view less | |
| CHS-Epoxy 530 | Spolchemie | CHS-Epoxy 530 is a universal low molecular weight epoxy resin based on BPA. This product is a resin that has no modifiers and can cure at two different levels at either an elevated or ambient temperature. CHS-Epoxy 530 is primarily used for modifying, sat...view more CHS-Epoxy 530 is a universal low molecular weight epoxy resin based on BPA. This product is a resin that has no modifiers and can cure at two different levels at either an elevated or ambient temperature. CHS-Epoxy 530 is primarily used for modifying, saturating, condensing and preserving operations in different areas of industry. view less | |
| Epokukdo KDCP-200 | Kukdo Chemical Co., Ltd. | Epokukdo KDCP-200 is a multi-functional epoxy resin derived from poly-addition compound of dicyclopentadiene and phenol, and is designed for application of high performance epoxy molding compound(EMC) in semi-conductor and laminates. The strongest advanta...view more Epokukdo KDCP-200 is a multi-functional epoxy resin derived from poly-addition compound of dicyclopentadiene and phenol, and is designed for application of high performance epoxy molding compound(EMC) in semi-conductor and laminates. The strongest advantage in semi-conductor packaging using this product is much lower moisture absorption than previous generation epoxy resins, such as o-cresol novolac epoxy resin(YDCN type) or biphenyl type epoxy resin. This product can be substituted for YDCN and biphenyl type epoxy resin for preparing EMC with excellent performance in SMD. view less | |
| Epokukdo KDCP-150 | Kukdo Chemical Co., Ltd. | Epokukdo KDCP-150 is a multi-functional epoxy resin derived from poly-addition compound of dicyclopentadiene and phenol, and is designed for application of high performance epoxy molding compound(EMC) in semi-conductor and laminates. The strongest advanta...view more Epokukdo KDCP-150 is a multi-functional epoxy resin derived from poly-addition compound of dicyclopentadiene and phenol, and is designed for application of high performance epoxy molding compound(EMC) in semi-conductor and laminates. The strongest advantage in semi-conductor packaging using this product is much lower moisture absorption than previous generation epoxy resins, such as o-cresol novolac epoxy resin(YDCN type) or biphenyl type epoxy resin. This product can be substituted for YDCN and biphenyl type epoxy resin for preparing EMC with excellent performance in SMD. view less | |
| Epokukdo KDCP-100 | Kukdo Chemical Co., Ltd. | Epokukdo KDCP-100 is a multi-functional epoxy resin derived from poly-addition compound of dicyclopentadiene and phenol, and is designed for application of high performance epoxy molding compound(EMC) in semi-conductor and laminates. The strongest advanta...view more Epokukdo KDCP-100 is a multi-functional epoxy resin derived from poly-addition compound of dicyclopentadiene and phenol, and is designed for application of high performance epoxy molding compound(EMC) in semi-conductor and laminates. The strongest advantage in semi-conductor packaging using this product is much lower moisture absorption than previous generation epoxy resins, such as o-cresol novolac epoxy resin(YDCN type) or biphenyl type epoxy resin. This product can be substituted for YDCN and biphenyl type epoxy resin for preparing EMC with excellent performance in SMD. view less | |
| Epokukdo YC-230 | Kukdo Chemical Co., Ltd. | Epokukdo YC-230 of casting resin system is a liquid type medium viscosity Bisphenol-A epoxy resin and medium-viscosity Hardener, respectively. This cured resin gives outstanding resistance to mechanical and electrical stresses and thermal shocks. Also, it...view more Epokukdo YC-230 of casting resin system is a liquid type medium viscosity Bisphenol-A epoxy resin and medium-viscosity Hardener, respectively. This cured resin gives outstanding resistance to mechanical and electrical stresses and thermal shocks. Also, it shows excellent long-term behavior in terms with breakdown strength and discharge resistance. view less | |
| Epokukdo YC-195B | Kukdo Chemical Co., Ltd. | Epokukdo YC-195B has low softening point and low bromine content. It is used for making mold products, which require excellent mechanical and electrical properties, by combination with acid anhydride curing agents. This product is especially suitable for ...view more Epokukdo YC-195B has low softening point and low bromine content. It is used for making mold products, which require excellent mechanical and electrical properties, by combination with acid anhydride curing agents. This product is especially suitable for large size electric mold that needs high reliability due to its dimensional stability. YC-195B can be mainly used as dielectric material for high voltage transformer, high voltage converter, resin insulator, bushing and high voltage switch, etc. view less | |
| Epokukdo YC-195 | Kukdo Chemical Co., Ltd. | Epokukdo YC-195 is molding epoxy resin with a low softening point. It is used for making mold products, which require excellent mechanical and electrical properties, by combination with acid anhydride curing agents. This product is especially suitable for...view more Epokukdo YC-195 is molding epoxy resin with a low softening point. It is used for making mold products, which require excellent mechanical and electrical properties, by combination with acid anhydride curing agents. This product is especially suitable for large size electric mold that needs high reliability due to its dimensional stability. YC-195 can be mainly used as dielectric material for high voltage transformer, high voltage converter, resin insulator, bushing and high voltage switch, etc. view less | |
| Epokukdo YH-300 | Kukdo Chemical Co., Ltd. | Epokukdo YH-300, tri-functional epoxy resin which is a reactive diluent, provides very low viscosity, low temperature curable, non-crystalline, non-yellowing and low volatile content in combination with standard liquid epoxy resin such as Epokukdo YD-128....view more Epokukdo YH-300, tri-functional epoxy resin which is a reactive diluent, provides very low viscosity, low temperature curable, non-crystalline, non-yellowing and low volatile content in combination with standard liquid epoxy resin such as Epokukdo YD-128. YH-300 is well suited for use in electrical insulation, tar epoxy coating, FRP, molding, etc. view less | |
| Epokukdo KDT-4400 | Kukdo Chemical Co., Ltd. | Epokukdo KDT-4400 is a tetra functional epoxy resin that shows excellent cured properties such as UV-blocking effect and thermal stability, etc. In case of being used with low brominated epoxy resin, it can be applied in electronic and electrical field fo...view more Epokukdo KDT-4400 is a tetra functional epoxy resin that shows excellent cured properties such as UV-blocking effect and thermal stability, etc. In case of being used with low brominated epoxy resin, it can be applied in electronic and electrical field for AOI system. view less | |
| CHS-Epoxy 200 M 75 | Spolchemie | CHS-Epoxy 200 M 75 is a Gardner colored solution of an epoxy resin. This product is a low weighted epoxy resin in methyl ethyl ketone (MEK) and its epoxide equivalent weight (EEW) range is 435-525 g/mol. This product is primarily used for production of la...view more CHS-Epoxy 200 M 75 is a Gardner colored solution of an epoxy resin. This product is a low weighted epoxy resin in methyl ethyl ketone (MEK) and its epoxide equivalent weight (EEW) range is 435-525 g/mol. This product is primarily used for production of laminates and mica insulators in electrical engineering industry. view less | |
| Epotec® YD 127 FP | Aditya Birla | Epotec® YD 127 FP is an unmodified, low viscosity liquid epoxy resin reaction product of bisphenol-A and epichlorohydrin. This product is ideal for use in high solids solvent-free coatings, laminates, and electrical & electronics applications. | |
| Epokukdo KC-335 | Kukdo Chemical Co., Ltd. | Epokukdo KC-335 of casting resin system is a liquid type medium viscosity bisphenol-A epoxy resin and medium-viscosity hardener, respectively. This cured resin gives outstanding resistance to mechanical and electrical stresses and thermal shocks. Also, it...view more Epokukdo KC-335 of casting resin system is a liquid type medium viscosity bisphenol-A epoxy resin and medium-viscosity hardener, respectively. This cured resin gives outstanding resistance to mechanical and electrical stresses and thermal shocks. Also, it shows excellent long-term behavior in terms with breakdown strength and discharge resistance. view less | |
| Epokukdo KC-305 | Kukdo Chemical Co., Ltd. | Epokukdo KC-305 of casting resin system is a liquid type medium viscosity bisphenol-A epoxy resin and medium-viscosity hardener, respectively. This cured resin gives outstanding resistance to mechanical and electrical stresses and thermal shocks. Also, it...view more Epokukdo KC-305 of casting resin system is a liquid type medium viscosity bisphenol-A epoxy resin and medium-viscosity hardener, respectively. This cured resin gives outstanding resistance to mechanical and electrical stresses and thermal shocks. Also, it shows excellent long-term behavior in terms with breakdown strength and discharge resistance. view less | |
| SCV-2585 | NuSil Silicone Technology 1 | SCV-2585 is a silicone elastomer that features Ultra Low OutgassingTM and also has a high tear strength. This makes it an ideal product to provide protection to electronic components against shock, vibration, moisture, dust and other environmental hazards...view more SCV-2585 is a silicone elastomer that features Ultra Low OutgassingTM and also has a high tear strength. This makes it an ideal product to provide protection to electronic components against shock, vibration, moisture, dust and other environmental hazards. It can also perform under a broad temperature range for electronic and space applications. view less | |
| CV3-2640 | NuSil Silicone Technology 1 | CV3-2640 is a static dissipative silicone that has controlled volatility and cures at room temperature. This product can be utilized as shielding for RFI and EMI in space and electronic applications. It can also be used to adhere covers onto housings or f...view more CV3-2640 is a static dissipative silicone that has controlled volatility and cures at room temperature. This product can be utilized as shielding for RFI and EMI in space and electronic applications. It can also be used to adhere covers onto housings or for any application where grooves require a non-flowable to limited flow material. view less | |
| R-2630 | NuSil Silicone Technology 1 | R-2630 is a black, electrically conductive RTV silicone that has a high durometer. It is based on a methyl silicone polymer and has a broad temperature range. This product can be used to adhere covers on housings or where grooves or other configurations r...view more R-2630 is a black, electrically conductive RTV silicone that has a high durometer. It is based on a methyl silicone polymer and has a broad temperature range. This product can be used to adhere covers on housings or where grooves or other configurations require a flowable to limited flow material with a low viscosity. It can also be used for RFI and EMI shielding for space and electrical applications. It is well suited for formed in place conductive gaskets and has an operating temperature range of 65°C to 200°C (-85°F to 392°F). view less | |
| R-2370 | NuSil Silicone Technology 1 | R-2370 is a two-part, RTV silicone rubber foam that has a 100:6 Mix Ratio (Base: Catalyst). It yields a low density silicone rubber foam when catalyzed. It is best utilized in shock and vibration dampening situations that require a flexible, light weight ...view more R-2370 is a two-part, RTV silicone rubber foam that has a 100:6 Mix Ratio (Base: Catalyst). It yields a low density silicone rubber foam when catalyzed. It is best utilized in shock and vibration dampening situations that require a flexible, light weight foam with exceptional electrical and thermal properties. view less | |
| R-2380 | NuSil Silicone Technology 1 | R-2380 is a two-part, RTV silicone rubber foam that yields a medium density, and has a 100:6 Mix Ratio (Base: Catalyst). This product is specifically designed to be used in vibration and shock dampening situations that require a lightweight, flexible foam...view more R-2380 is a two-part, RTV silicone rubber foam that yields a medium density, and has a 100:6 Mix Ratio (Base: Catalyst). This product is specifically designed to be used in vibration and shock dampening situations that require a lightweight, flexible foam that also has exceptional thermal and electrical properties. view less | |
| R-2175 | NuSil Silicone Technology 1 | R-2175 is a two-part, black, pourable, self-leveling silicone potting elastomer that cures at room temperature. The low viscosity of this product allows for the potting of complex geometries without entrapping air. It is thermally stable, flowable, and ha...view more R-2175 is a two-part, black, pourable, self-leveling silicone potting elastomer that cures at room temperature. The low viscosity of this product allows for the potting of complex geometries without entrapping air. It is thermally stable, flowable, and has several applications which include potting for connectors, sensors, relays, power devices and other electronic components that require protection from shock, vibration and other environmental hazards. view less | |
| EPM-2461 | NuSil Silicone Technology 1 | EPM-2461 is a dissipative silicone elastomer that has a low volatility and offers low modulus. This elastomer can be used for static dissipation in electronic components and for applications that require low volatility. It can also be utilized in any appl...view more EPM-2461 is a dissipative silicone elastomer that has a low volatility and offers low modulus. This elastomer can be used for static dissipation in electronic components and for applications that require low volatility. It can also be utilized in any applications where grooves and other configurations require a non-flowing material. view less | |
| EPM-2462 | NuSil Silicone Technology 1 | EPM-2462 is a two-part, tan-colored, electrically conductive silicone elastomer that has a 20:1 Mix Ratio (Part A: Part B). This product can be used as a thermally and electrically conductive interface material. It can also be utilized with form-in-place ...view more EPM-2462 is a two-part, tan-colored, electrically conductive silicone elastomer that has a 20:1 Mix Ratio (Part A: Part B). This product can be used as a thermally and electrically conductive interface material. It can also be utilized with form-in-place conductive gaskets, and for applications that require a material with low volatility. view less | |
| CHS-Epoxy 411 | Spolchemie | CHS-Epoxy 411 is a semi-solid epoxy resin based on BPA. This product is primarily used for hot casting applications, in several different areas of industry; this is including the electrical industry. This product is also used for producing solvent borne c...view more CHS-Epoxy 411 is a semi-solid epoxy resin based on BPA. This product is primarily used for hot casting applications, in several different areas of industry; this is including the electrical industry. This product is also used for producing solvent borne coatings and pre impregnations. view less | |
| CHS-Epoxy 455 | Spolchemie | CHS-Epoxy 455 is a low molecular weight solvent-free epoxy bonding agent with non-phthalate modifier. This product viscosity is modified by non-reactive, non-phthalate plasticizer. It is able to dry at two different levels at either an elevated or ambient...view more CHS-Epoxy 455 is a low molecular weight solvent-free epoxy bonding agent with non-phthalate modifier. This product viscosity is modified by non-reactive, non-phthalate plasticizer. It is able to dry at two different levels at either an elevated or ambient temperature. CHS-Epoxy 455 is primarily used for modifying, saturating, condensing and preserving and in particular, electrical, electronic, building and civil engineering. view less | |
| CHS-Epoxy 531 | Spolchemie | CHS-Epoxy 531 is a modified liquid epoxy resin with a low molecular weight. This epoxy resin product modified through a bi-functional reactive diluent. It also has the ability to cure at ambient or elevated temperature levels with the proper curing agent...view more CHS-Epoxy 531 is a modified liquid epoxy resin with a low molecular weight. This epoxy resin product modified through a bi-functional reactive diluent. It also has the ability to cure at ambient or elevated temperature levels with the proper curing agent. CHS-Epoxy 531 is primarily used for laminating, potting, solvent free coatings, and several different uses in electrical industry. view less | |
| CV10-2500 | NuSil Silicone Technology 1 | CV10-2500 is an optically clear silicone system that is an ideal adhesive in low-strength applications such as with solar cell arrays where clarity and low volatility are important. It serves as an embedding or potting compound for electronic assemblies a...view more CV10-2500 is an optically clear silicone system that is an ideal adhesive in low-strength applications such as with solar cell arrays where clarity and low volatility are important. It serves as an embedding or potting compound for electronic assemblies and components. It will protect against extreme humidity, radiation, thermal and mechanical stress. view less | |
| CV1-2646 | NuSil Silicone Technology 1 | CV1-2646 is a silicone that is electrically conductive and can be used in applications that require a broad operating temperature range. This product can be used to for EMI and RFI shielding in electrical and space applications. It can also be utilized as...view more CV1-2646 is a silicone that is electrically conductive and can be used in applications that require a broad operating temperature range. This product can be used to for EMI and RFI shielding in electrical and space applications. It can also be utilized as an adhesive to bond covers on housings or any application where a non-flowable material is needed. view less | |
| CV3-2289-1 | NuSil Silicone Technology 1 | CV3-2289-1 is a two-part white silicone elastomer, that is an ideal adhesive where a large surface area must be covered. It has the ability to provide protection to electrical components against harsh environments where shock, vibration, dust and moisture...view more CV3-2289-1 is a two-part white silicone elastomer, that is an ideal adhesive where a large surface area must be covered. It has the ability to provide protection to electrical components against harsh environments where shock, vibration, dust and moisture are a threat. It is also an ideal product for applications that require minimal outgassing. view less | |
| Epotec® YD 134 | Aditya Birla | Epotec® YD 134 is an unmodified, high viscosity, bisphenol-A-based semi-solid epoxy resin used to impart or improve toughness, flexibility, and adhesion. This product is ideal for use in adhesives, marine & industrial protective coatings, solvent-based co...view more Epotec® YD 134 is an unmodified, high viscosity, bisphenol-A-based semi-solid epoxy resin used to impart or improve toughness, flexibility, and adhesion. This product is ideal for use in adhesives, marine & industrial protective coatings, solvent-based coatings, construction coatings & systems, and electrical & electronic applications. view less | |
| CV2-2644 | NuSil Silicone Technology 1 | CV2-2644 is a two-part, tan colored electrically conductive silicone adhesive/sealant. This product is well suited to use with form-in-place conductive gaskets. It meets the low outgas specifications outlined by NASA and the European Space Agency so it ca...view more CV2-2644 is a two-part, tan colored electrically conductive silicone adhesive/sealant. This product is well suited to use with form-in-place conductive gaskets. It meets the low outgas specifications outlined by NASA and the European Space Agency so it can be used in applications that require low outgassing under extreme operating conditions. view less | |
| CV-2644 | NuSil Silicone Technology 1 | CV-2644 is a two-part, tan colored electrically conductive silicone adhesive/sealant. It meets the low outgas specifications outlined by NASA and the European Space Agency so it can be used in applications that require low outgassing under extreme operati...view more CV-2644 is a two-part, tan colored electrically conductive silicone adhesive/sealant. It meets the low outgas specifications outlined by NASA and the European Space Agency so it can be used in applications that require low outgassing under extreme operating conditions. This product is well suited to use with form-in-place conductive gaskets. view less | |
| CV4-2500 | NuSil Silicone Technology 1 | CV4-2500 is a two-part, optically clear silicone system that has a controlled volatility. It is suitable to be used as an adhesive in low-strength applications such as bonding solar cell arrays where low volatility and clarity are needed. It can also be u...view more CV4-2500 is a two-part, optically clear silicone system that has a controlled volatility. It is suitable to be used as an adhesive in low-strength applications such as bonding solar cell arrays where low volatility and clarity are needed. It can also be used as an embedding or potting compound for electronic assemblies that need to be protected from extremes in radiation, humidity, mechanical and thermal stress. view less | |
| PRO-NBDA | DKSH | PRO-NBDA is Norbornane diamine, a cycloaliphatic diamine. Norbornane diamine is a mixture of 2,5- and 2.6-disubstituents, that has four stereoisomers. At ambient temperatures, PRO-NBDA is a low-viscosity liquid, having no odor or a slight characteristic o...view more PRO-NBDA is Norbornane diamine, a cycloaliphatic diamine. Norbornane diamine is a mixture of 2,5- and 2.6-disubstituents, that has four stereoisomers. At ambient temperatures, PRO-NBDA is a low-viscosity liquid, having no odor or a slight characteristic odor. view less | Request Sample |
| Epotec® YD 128 X | Aditya Birla | Epotec® YD 128 X is a modified, medium viscosity, bisphenol-A-based epoxy resin which displays good chemical resistance, resistance to crystallization on storage, and pigment and filler wetting properties. This product is ideal for use in electrical, elec...view more Epotec® YD 128 X is a modified, medium viscosity, bisphenol-A-based epoxy resin which displays good chemical resistance, resistance to crystallization on storage, and pigment and filler wetting properties. This product is ideal for use in electrical, electronic, and flooring applications. view less | |
| Epotec® YD 128 XX | Aditya Birla | Epotec® YD 128 XX is a medium viscosity, bisphenol-A-based modified epoxy resin which displays good chemical resistance, resistance to crystallization on storage, and pigment and filler wetting properties. This product is ideal for use in electrical, elec...view more Epotec® YD 128 XX is a medium viscosity, bisphenol-A-based modified epoxy resin which displays good chemical resistance, resistance to crystallization on storage, and pigment and filler wetting properties. This product is ideal for use in electrical, electronic, and flooring applications. view less | |
| Picassian® AC-191 | Stahl Polymers | Picassian® AC-191 is a waterbased anionic styrene acrylic copolymer emulsion agent. It is used in consumer electronics, metallic coatings, and in general plastic applications. This product is brittle, has good adhesion on ABS and PS, has good scratch resi...view more Picassian® AC-191 is a waterbased anionic styrene acrylic copolymer emulsion agent. It is used in consumer electronics, metallic coatings, and in general plastic applications. This product is brittle, has good adhesion on ABS and PS, has good scratch resistance properties, good alcohol resistance, has good hand cream resistance, is stable with treated aluminium flakes, and provides clear, very hard, and glossy films. view less | |
| Epotec® YD 535 | Aditya Birla | Epotec® YD 535 is a low viscosity, modified, bisphenol-A-based epoxy resin which displays very good wet out and degassing, as well as excellent adhesion and mechanical, physical, and thermal properties. This product is ideal for use in coatings and adhesi...view more Epotec® YD 535 is a low viscosity, modified, bisphenol-A-based epoxy resin which displays very good wet out and degassing, as well as excellent adhesion and mechanical, physical, and thermal properties. This product is ideal for use in coatings and adhesives for fiber-reinforced structural components - such as those used in automotive, sporting equipment, navy, aeronautic, marine, and electrical insulation applications. view less | |
| CV7-1142-1 | NuSil Silicone Technology 1 | CV7-1142-1 is a non corrosive material that has a white color and it is a non-slumping silicone RTV. It can be used as a caulking, adhesive or sealant that protects sensitive circuits, connectors and switches in space applications. This product has a broa...view more CV7-1142-1 is a non corrosive material that has a white color and it is a non-slumping silicone RTV. It can be used as a caulking, adhesive or sealant that protects sensitive circuits, connectors and switches in space applications. This product has a broad operating temperature range so it can withstand hot and cold conditions. It also can be used for sealing openings in modules or housings where grooves or other configurations require a non-flowable to limited flow material. view less | |
| CV4-2289-1 | NuSil Silicone Technology 1 | CV4-2289-1 is a thixotropic silicone elastomer that can be used as an adhesive that offers superior tear strength. This silicone also demonstrates flexibility at extremely low temperatures with a stiffening temperature of approximately -115°C. It can be u...view more CV4-2289-1 is a thixotropic silicone elastomer that can be used as an adhesive that offers superior tear strength. This silicone also demonstrates flexibility at extremely low temperatures with a stiffening temperature of approximately -115°C. It can be used to protect electronic components, cable harness breakouts, seals, and gaskets from harsh environmental conditions. view less | |
| CV-2567 | NuSil Silicone Technology 1 | CV-2567 is a pourable RTV siicone that can be used as a diluent for reducing the viscosity of other controlled volatility silicones. This product meets the ASTM 595 low outgas specifications outlined in NASA and the European Space Agency. It can be used a...view more CV-2567 is a pourable RTV siicone that can be used as a diluent for reducing the viscosity of other controlled volatility silicones. This product meets the ASTM 595 low outgas specifications outlined in NASA and the European Space Agency. It can be used as an adhesive or sealant for electronic and space applications. view less | |
| Nichigo-Polyester TP217 | Nippon Gohsei | Nichigo-Polyester TP217 is a high molecular weight saturated polyester resin featuring good workability. This product is well suited for use in general and electronic coating applications. | |
| Nichigo-Polyester TP290 | Nippon Gohsei | Nichigo-Polyester TP290 is a high molecular weight saturated polyester resin featuring good staining properties. This product is well suited for use in general and electronic coating applications. | |
| Coronate® AP-M | Tosoh Corporation | Coronate® AP-M, in the form of a pale yellow to brownish flakes, is an isocyanate that is masked with blocking agents (E-caprolactam and phenol). This blocked isocyanate can be applied as baking finishes for coil coatings, wire, rubber, plastics, metals, ...view more Coronate® AP-M, in the form of a pale yellow to brownish flakes, is an isocyanate that is masked with blocking agents (E-caprolactam and phenol). This blocked isocyanate can be applied as baking finishes for coil coatings, wire, rubber, plastics, metals, and more. view less | |
| Coronate® BI-301 | Tosoh Corporation | Coronate® BI-301, in the form of a pale yellow to brownish flakes, is an isocyanate that is masked with blocking agents (E-caprolactam and phenol). This blocked isocyanate can be applied as baking finishes for coil coatings, wire, rubber, plastics, metals...view more Coronate® BI-301, in the form of a pale yellow to brownish flakes, is an isocyanate that is masked with blocking agents (E-caprolactam and phenol). This blocked isocyanate can be applied as baking finishes for coil coatings, wire, rubber, plastics, metals, and more. view less | |
| Coronate® 2507 | Tosoh Corporation | Coronate® 2507, in the form of a pale yellow to brownish flakes, is an isocyanate that is masked with blocking agents (E-caprolactam and phenol). This blocked isocyanate can be applied as baking finishes for coil coatings, wire, rubber, plastics, metals, ...view more Coronate® 2507, in the form of a pale yellow to brownish flakes, is an isocyanate that is masked with blocking agents (E-caprolactam and phenol). This blocked isocyanate can be applied as baking finishes for coil coatings, wire, rubber, plastics, metals, and more. view less | |
| Coronate® 2513 | Tosoh Corporation | Coronate® 2513, in the form of a pale yellow to brownish flakes, is an isocyanate that is masked with blocking agents (E-caprolactam and phenol). This blocked isocyanate can be applied as baking finishes for coil coatings, wire, rubber, plastics, metals, ...view more Coronate® 2513, in the form of a pale yellow to brownish flakes, is an isocyanate that is masked with blocking agents (E-caprolactam and phenol). This blocked isocyanate can be applied as baking finishes for coil coatings, wire, rubber, plastics, metals, and more. view less | |
| Epoxies® 50-3112 | Epoxies, Etc. | Epoxies® 50-3112 is a two part, fast curing thermally conductive epoxy adhesive. Dark grey in color when mixed, this product a simple 1:1 mix ratio and develops a 1,400 psi Lap Shear strength bond (aluminum to aluminum) in four hours at room temperature ...view more Epoxies® 50-3112 is a two part, fast curing thermally conductive epoxy adhesive. Dark grey in color when mixed, this product a simple 1:1 mix ratio and develops a 1,400 psi Lap Shear strength bond (aluminum to aluminum) in four hours at room temperature and 2,200 psi. just after 20 hours. 50-3112 offers fast heat dissipation for a wide range of electronic applications. The black resin and white hardener provide an excellent visual indication of a complete mix. view less | |
| Epoxies® 50-3122 | Epoxies, Etc. | Epoxies® 50-3122 is a one part epoxy adhesive with both high sheer and high peel strength properties. It is also able to maintain exceptionally strong bonds over a wide temperature range of -60 to +205°C. 50-3122 is both a thermally conductive and electri...view more Epoxies® 50-3122 is a one part epoxy adhesive with both high sheer and high peel strength properties. It is also able to maintain exceptionally strong bonds over a wide temperature range of -60 to +205°C. 50-3122 is both a thermally conductive and electrically insulating epoxy adhesive. It is suitable for electronic, electrical, aerospace, appliance, automotive and industrial applications. view less | |
| Epoxies® 20-3004 LV | Epoxies, Etc. | Epoxies® 20-3004 LV is a low viscosity, two part, chemical resistant epoxy system that has been developed for potting, coating and adhesive applications requiring superior chemical resistance. It exhibits outstanding bonds to a variety of substrates inclu...view more Epoxies® 20-3004 LV is a low viscosity, two part, chemical resistant epoxy system that has been developed for potting, coating and adhesive applications requiring superior chemical resistance. It exhibits outstanding bonds to a variety of substrates including most metals and plastics. 20-3004's low viscosity lends itself to being a self leveling system and is noncorrosive. view less | |
| Epoxies® 20-3004 HV | Epoxies, Etc. | Epoxies® 20-3004 HV is a high viscosity, two part, chemical resistant epoxy system that has been developed for potting, coating and adhesive applications requiring superior chemical resistance. It exhibits outstanding bonds to a variety of substrates incl...view more Epoxies® 20-3004 HV is a high viscosity, two part, chemical resistant epoxy system that has been developed for potting, coating and adhesive applications requiring superior chemical resistance. It exhibits outstanding bonds to a variety of substrates including most metals and plastics. 20-3004's high viscosity prevents sagging and is noncorrosive. view less | |
| Epoxies® 20-3064 NC | Epoxies, Etc. | Epoxies® 20-3064 NC is a filled, flexible epoxy potting compound and adhesive, developed to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio the hardness can be varied from 60 Shore A to 85 Shore D. 20-3...view more Epoxies® 20-3064 NC is a filled, flexible epoxy potting compound and adhesive, developed to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio the hardness can be varied from 60 Shore A to 85 Shore D. 20-3064 NC provides excellent thermal shock resistance and outstanding adhesion. view less | |
| Epoxies® 20-3064 NC LV | Epoxies, Etc. | Epoxies® 20-3064 NC LV is a low viscosity, flexible epoxy potting compound and adhesive, developed to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio the hardness can be varied from 60 Shore A to 85 Sho...view more Epoxies® 20-3064 NC LV is a low viscosity, flexible epoxy potting compound and adhesive, developed to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio the hardness can be varied from 60 Shore A to 85 Shore D. 20-3064 NC provides excellent thermal shock resistance and outstanding adhesion. view less | |
| Epoxies® 20-3068 | Epoxies, Etc. | Epoxies® 20-3068 is a two part epoxy adhesive and potting compound that can cure in room temperatures and has excellent chemical and corrosion resistance. This product provides good water resistance, adhesion, and toughness and is well suited for use with...view more Epoxies® 20-3068 is a two part epoxy adhesive and potting compound that can cure in room temperatures and has excellent chemical and corrosion resistance. This product provides good water resistance, adhesion, and toughness and is well suited for use with most electronics. 20-3068 Epoxy System meets the Food and Drug Administration (FDA) regulations permitting use in “indirect” food contact applications. The raw materials used in the products comply with the FDA regulations of Title 21 Code of Federal Regulations under Sections 175.105 and 175.300. view less | |
| Epoxies® 20-3236 | Epoxies, Etc. | Epoxies® 20-3236 is a low viscosity, copolymer elastomer made of a modified epoxy resin that is specifically designed for bonding vinyls and neoprenes. It can be used in many difficult bonding applications and has an extended working time with a convenien...view more Epoxies® 20-3236 is a low viscosity, copolymer elastomer made of a modified epoxy resin that is specifically designed for bonding vinyls and neoprenes. It can be used in many difficult bonding applications and has an extended working time with a convenient 2:1 mix ratio. 20-3236 Resin can also be used for the encapsulation of vinyl insulated electrical components or sealing vinyl lead wires. view less | |
| Epoxies® 20-3302 | Epoxies, Etc. | Epoxies® 20-3302 is a two part, water clear, optically transparent epoxy potting compound and adhesive. This high purity grade polymer system is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. It provides excel...view more Epoxies® 20-3302 is a two part, water clear, optically transparent epoxy potting compound and adhesive. This high purity grade polymer system is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. It provides excellent optical transmission along with outstanding adhesion and electrical properties. 20-3302 is a low viscosity system designed for L.E.D. encapsulating, fiber optics, and any potting or adhesive application requiring a bubble free and glass smooth finish with optimum clarity. view less | |
| Epoxies® 20-3302NCLV | Epoxies, Etc. | Epoxies® 20-3302NCLV is a two part, water clear, optically transparent epoxy potting compound and adhesive. This high purity grade polymer system is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. It provides e...view more Epoxies® 20-3302NCLV is a two part, water clear, optically transparent epoxy potting compound and adhesive. This high purity grade polymer system is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. It provides excellent optical transmission along with outstanding adhesion and electrical properties. 20-3302NCLV is a very low viscosity system designed for L.E.D. encapsulating, fiber optics, and any potting or adhesive application requiring a bubble free and glass smooth finish with optimum clarity. view less | |
| Epoxies® 50-3186 NC | Epoxies, Etc. | Epoxies® 50-3186 NC is a two part thermally conductive epoxy adhesive. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50-3186 NC is a perfect choice for applications requiring high thermal conductivity, low thermal e...view more Epoxies® 50-3186 NC is a two part thermally conductive epoxy adhesive. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50-3186 NC is a perfect choice for applications requiring high thermal conductivity, low thermal expansion, and high operating temperature performance. view less | |
| UV Cure 60-7105 | Epoxies, Etc. | UV Cure 60-7105 is a low viscosity urethane adhesive, coating, and potting compound. This UV curable resin exhibits good adhesion, toughness, and exterior durability. UV Cure 60-7105 does not contain any solvents and is therefore a 100% solids system. Thi...view more UV Cure 60-7105 is a low viscosity urethane adhesive, coating, and potting compound. This UV curable resin exhibits good adhesion, toughness, and exterior durability. UV Cure 60-7105 does not contain any solvents and is therefore a 100% solids system. This material is a good choice for products requiring deep section curing. view less | |
| UV Cure 60-7108 | Epoxies, Etc. | UV Cure 60-7108 is a low viscosity and optically clear UV curable epoxy system designed for fiber optic and other clear adhesive and potting applications. With good electrical insulation properties and moisture resistance, this product is ideal for use in...view more UV Cure 60-7108 is a low viscosity and optically clear UV curable epoxy system designed for fiber optic and other clear adhesive and potting applications. With good electrical insulation properties and moisture resistance, this product is ideal for use in the manufacture of electronic assemblies. Low viscosity makes it suitable for a variety of other coating applications. view less | |
| UV Cure 60-7111 | Epoxies, Etc. | UV Cure 60-7111 is a non-yellowing, UV curable urethane adhesive and encapsulant featuring high impact strength and flexibility, as well as good water and weather resistance. This product is formulated to provide low stress on electronics and displays goo...view more UV Cure 60-7111 is a non-yellowing, UV curable urethane adhesive and encapsulant featuring high impact strength and flexibility, as well as good water and weather resistance. This product is formulated to provide low stress on electronics and displays good adhesion to a variety of substances. view less |
